发明公开
- 专利标题： MICRO PACKAGE STRUCTURE
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申请号： US18203916申请日： 2023-05-31
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公开(公告)号： US20230395585A1公开(公告)日： 2023-12-07
- 发明人: Yang YUE , Jing JU
- 申请人： JADE BIRD DISPLAY (SHANGHAI) LIMITED
- 申请人地址： CN SHANGHAI
- 专利权人： JADE BIRD DISPLAY (SHANGHAI) LIMITED
- 当前专利权人： JADE BIRD DISPLAY (SHANGHAI) LIMITED
- 当前专利权人地址： CN SHANGHAI
- 优先权： WO TCN2022096932 2022.06.02
- 主分类号： H01L25/16
- IPC分类号： H01L25/16 ; H01L23/00 ; H01L25/075 ; H01L23/31
摘要：
A micro package structure includes a micro LED panel comprising an IC (integrated circuit) substrate and an micro LED array area formed on the IC substrate, the IC substrate comprising a first connected area corresponding to the micro LED array area and a second connected area away from the first connected area, a plurality of signal metal pads are formed on the second connected area; a top cover plane formed above the micro LED panel, so that light emitted from the micro LED array area is transmitted upward to the top cover plane; and one or more bonding wires to connect the signal metal pads with an external circuit.
信息查询
IPC分类:
