Abstract:
A magnetic sensor comprises magnetoresistive elements and permanent magnet films, which are combined together to form GMR elements formed on a quartz substrate having a square shape, wherein the permanent magnet films are paired and connected to both ends of the magnetoresistive elements, so that an X-axis magnetic sensor and a Y-axis magnetic sensor are realized by adequately arranging the GMR elements relative to the four sides of the quartz substrate. Herein, the magnetization direction of the pinned layer of the magnetoresistive element forms a prescribed angle of 45° relative to the longitudinal direction of the magnetoresistive element or relative to the magnetization direction of the permanent magnet film. Thus, it is possible to reliably suppress offset variations of bridge connections of the GMR elements even when an intense magnetic field is applied; and it is therefore possible to noticeably improve the resistant characteristics to an intense magnetic field.
Abstract:
An electrode, an antiferromagnetic film, a ferromagnetic film, a nonmagnetic film, a ferromagnetic film, a tunnel insulating film, a ferromagnetic film, a first Ta film, a Ru film, and a second Ta film are formed in sequence on a substrate. The thickness of the second Ta film is about 0.5 nm. The second Ta film is naturally oxidized after being formed. Then, heat treatment to improve the characteristic of a TMR film is performed. The temperature of this heat treatment is approximately from 200° C. to 300° C. In a conventional manufacturing method, film peeling occurs in this heat treatment, and accompanying this, defects such as occurrence of holes and wrinkles further occur, but in the present method, such an occurrence of defects is prevented since the Ta film is formed at the uppermost surface. Subsequently, the Ta film and so on are patterned.
Abstract:
A device for magnetically annealing magnetoresistive elements formed on wafers includes a heated chuck and a delivery mechanism for individually placing the wafers individually on the chuck one at a time. A coil is adjacent to the chuck and generates a magnetic field after the wafer is heated to a Néel temperature of an anti-ferromagnetic layer. A control system regulates the temperature of the heated chuck, the strength of the magnetic field, and a time period during which each chuck is heated to control the annealing process. The annealed elements are incorporated in the fabrication of magnetic memory devices.
Abstract:
A magnetic detecting element and method of manufacturing the same are provided. The magnetic detecting element including a free magnetic layer and a second pinned magnetic layer is formed of a CoMnGeSi alloy layer represented by a composition formula of Co2xMnx(Ge1-zSiz)y (where x and y are atomic percent, and 3x+y=100 atomic percent). The content y in the composition formula is 23 atomic percent to 26 atomic percent, and a Si ratio Z in GeSi is 0.1 to 0.6. Accordingly, ΔRA identical with a case when a CoMnGe alloy is used can be obtained, and a coupling magnetic field Hin or a coercive force Hc can be reduced.
Abstract translation:提供一种磁检测元件及其制造方法。 包括自由磁性层和第二被钉扎磁性层的磁性检测元件由Co 2 N x Mn x x(Ge)的组成式表示的CoMnGeSi合金层形成 其中x和y是原子百分比,3x + y = 100原子百分比)。 组成式中的含量y为23原子%〜26原子%,GeSi中的Si比Z为0.1〜0.6。 因此,可以获得与使用CoMnGe合金的情况相同的DeltaRA,并且可以减小耦合磁场Hin或矫顽力Hc。
Abstract:
A method is provided for fabricating a fixed layer for a MRAM device. The method includes providing the fixed layer. The fixed layer includes an antiferromagnetic pinning layer over a substrate and a ferromagnetic pinned layer over the pinning layer, the pinned layer having a first thickness. The fixed layer further includes a spacer layer over the pinned layer, and a ferromagnetic reference layer over the spacer layer, the reference layer having a second thickness. The method further includes annealing the fixed layer using a temporal temperature/magnetic field profile, the profile having a maximum magnetic field magnitude (Hanneal). The profile is selected based on the first thickness of the pinned layer and the second thickness of the reference layer.
Abstract:
A method is provided for fabricating a fixed layer for a MRAM device. The method includes providing the fixed layer. The fixed layer includes an antiferromagnetic pinning layer over a substrate and a ferromagnetic pinned layer over the pinning layer, the pinned layer having a first thickness. The fixed layer further includes a spacer layer over the pinned layer, and a ferromagnetic reference layer over the spacer layer, the reference layer having a second thickness. The method further includes annealing the fixed layer using a temporal temperature/magnetic field profile, the profile having a maximum magnetic field magnitude (Hanneal). The profile is selected based on the first thickness of the pinned layer and the second thickness of the reference layer.
Abstract translation:提供了一种制造用于MRAM器件的固定层的方法。 该方法包括提供固定层。 固定层包括衬底上的反铁磁钉扎层和钉扎层上的铁磁性钉扎层,钉扎层具有第一厚度。 固定层还包括被钉扎层上的间隔层,以及间隔层上方的铁磁参考层,参考层具有第二厚度。 该方法还包括使用时间温度/磁场分布对固定层进行退火,该轮廓具有最大磁场强度(H H 3退火)。 基于被钉扎层的第一厚度和参考层的第二厚度来选择轮廓。
Abstract:
A device for magnetically annealing magnetoresistive elements formed on wafers includes a heated chuck and a delivery mechanism for individually placing the wafers individually on the chuck one at a time. A coil is adjacent to the chuck and generates a magnetic field after the wafer is heated to a Néel temperature of an anti-ferromagnetic layer. A control system regulates the temperature of the heated chuck, the strength of the magnetic field, and a time period during which each chuck is heated to control the annealing process. The annealed elements are incorporated in the fabrication of magnetic memory devices.
Abstract:
A dual spin-valve magnetoresistive thin film elements includes a first dual pinned magnetic layer and a second dual pinned magnetic layer. A first pinned magnetic layer of the first dual pinned magnetic layer contacts a first antiferromagnetic layer and a second pinned magnetic layer of the first dual pinned magnetic layer contacts a first nonmagnetic electrically conductive layer. The first pinned magnetic layer of the second dual pinned magnetic layer contacts a second antiferromagnetic layer and the second pinned magnetic of the second dual pinned magnetic layer contacts a second nonmagnetic electrically conductive layer. A synthesized magnetic moment of the first pinned magnetic layer and the second pinned magnetic layer in the first dual pinned magnetic layer, and a synthesized magnetic moment the first pinned magnetic layer and the second pinned magnetic layer in the second dual pinned magnetic layer face in opposite directions.
Abstract:
An antiferromagnetic layer is formed of a PtMn alloy which has high blocking temperature and further generates a great exchange coupling magnetic field with a first pinned magnetic layer. Further, by appropriately adjusting the film thickness ratio of the first pinned magnetic layer and a second pinned magnetic layer, the film thickness of a nonmagnetic electrically conductive layer and the antiferromagnetic layer, and so forth, an exchange coupling magnetic field of at least 500 (Oe) or greater, preferably 1,000 (Oe) or greater, can be obtained.
Abstract:
A manufacturing method of a thin-film magnetic head with a spin valve effect MR read sensor includes a temperature-annealing step of firmly fixing the direction of the pinned magnetization in the spin valve effect MR sensor. The temperature-annealing step is executed by a plurality of times.