公开(公告)号：US20210086231A1

公开(公告)日：2021-03-25

申请号：US17095333

申请日：2020-11-11

申请人： eXo Imaging, Inc.

发明人： Brian BIRCUMSHAW ,  Sandeep AKKARAJU

IPC分类号： B06B1/06 ,  H01L41/04 ,  H01L41/047 ,  H01L41/187 ,  H01L41/313 ,  H01L41/338 ,  G01S15/89 ,  G01S7/52

摘要： The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.

公开(公告)号：US20210083648A1

公开(公告)日：2021-03-18

申请号：US16603220

申请日：2018-03-15

申请人： RICHVIEW ELECTRONICS CO., LTD.

发明人： Zhijian WANG ,  Honglin SONG ,  Xianglan WU ,  Siping BAI

IPC分类号： H03H9/13 ,  H03H3/02 ,  H03H9/02 ,  H03H9/17 ,  H03H9/19 ,  H01L41/29 ,  H01L41/338 ,  H01P1/04 ,  H01P11/00 ,  H01Q1/38 ,  H01Q13/02

摘要： A microwave dielectric component (100) comprises a microwave dielectric substrate (101) and a metal layer, the metal layer being bonded to a surface of the microwave dielectric substrate (101). The metal layer comprises a conductive seed layer and a metal thickening layer (105). The conductive seed layer comprises an ion implantation layer (103) implanted into the surface of the microwave dielectric substrate (101) and a plasma deposition layer (104) adhered on the ion implantation layer (103). The metal thickening layer (105) is adhered on the plasma deposition layer (104). A manufacturing method of the microwave dielectric component (100) is further disclosed.

公开(公告)号：US10759165B2

公开(公告)日：2020-09-01

申请号：US15894996

申请日：2018-02-13

申请人： Junichi Iwata ,  Takahiro Yoshida ,  Yukio Otome ,  Tomoaki Murakami

发明人： Junichi Iwata ,  Takahiro Yoshida ,  Yukio Otome ,  Tomoaki Murakami

IPC分类号： B41J2/14 ,  B41J2/045 ,  B41J2/15 ,  H01L41/338 ,  B41J2/16 ,  H01L41/09 ,  H01L41/312

摘要： A liquid discharge head includes a nozzle to discharge a liquid, an individual chamber communicating with the nozzle, a supply channel communicating with the individual chamber to supply the liquid to the individual chamber, and a discharge channel communicating with the individual chamber to discharge the liquid in the individual chamber. A fluid resistance of the supply channel is greater than a fluid resistance of the discharge channel.

公开(公告)号：US10601389B2

公开(公告)日：2020-03-24

申请号：US15586315

申请日：2017-05-04

申请人： Murata Manufacturing Co., Ltd.

发明人： Daisuke Sekiya ,  Taku Kikuchi ,  Hiroshi Tanaka

IPC分类号： H03H9/25 ,  H03H3/10 ,  H03H3/08 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/145 ,  H03H9/64 ,  H01L23/367 ,  H01L41/297 ,  H01L41/337 ,  H01L41/338 ,  H01L41/053

摘要： An elastic wave device includes IDT electrodes on a first main surface of a piezoelectric substrate and a heat dissipating film on a second main surface and including a pair of opposing main surfaces and side surfaces connecting the pair of main surfaces. At least a portion of the side surfaces of the heat dissipating film is located in an inner side portion relative to the outer circumference of the second main surface of the piezoelectric substrate on an arbitrary cross section along a direction connecting the pair of main surfaces of the heat dissipating film.

公开(公告)号：US20200021269A1

公开(公告)日：2020-01-16

申请号：US16582010

申请日：2019-09-25

申请人： SKYWORKS SOLUTIONS, INC.

发明人： Atsushi Takano

IPC分类号： H03H9/10 ,  H03H9/17 ,  H01L25/065 ,  H01L21/18 ,  B23K20/16 ,  H01L41/337 ,  H01L23/00 ,  H01L41/338 ,  H01L41/313 ,  H03H9/05 ,  H03H3/02 ,  B23K26/402 ,  B23K1/00 ,  B23K26/382

摘要： An electronic device includes a first substrate and a second substrate. A side wall joins the first substrate to the second substrate. The side wall includes a first alloy layer of a first metal and a second metal bonded directly to an upper surface of the first substrate and a second alloy layer of the first metal and a third metal disposed on top of the first alloy layer and bonded directly to a lower surface of the second substrate, the second metal and the third metal being different from each other and from the first metal. An electronic circuit is disposed on the lower surface of the second substrate within a cavity defined by the lower surface of the first substrate, the upper surface of the second substrate, and the side wall.

公开(公告)号：US10471716B2

公开(公告)日：2019-11-12

申请号：US15883919

申请日：2018-01-30

申请人： SII Printek Inc.

发明人： Hitoshi Nakayama

IPC分类号： B41J2/14 ,  B41J2/16 ,  B41J2/145 ,  H01L41/047 ,  H01L41/09 ,  H01L41/187 ,  H01L41/29 ,  H01L41/332 ,  H01L41/338

摘要： According to an embodiment, a liquid ejecting head chip includes an actuator plate and an in-channel electrode. In the actuator plate, a plurality of channels are arranged at a distance in an X-direction. Each of the channels includes an extension portion and a raise-and-cut portion. The extension portion extends in a Z-direction. The raise-and-cut portion continues from the extension portion toward one side of the Z-direction and has a groove depth which is gradually reduced toward the one side of the Z-direction. The in-channel electrode is formed on an inner surface of each of the channels, with a plating film.

公开(公告)号：US20190260341A1

公开(公告)日：2019-08-22

申请号：US16400111

申请日：2019-05-01

申请人： Murata Manufacturing Co., Ltd.

发明人： Mitsuyoshi HIRA ,  Seiji KAI

IPC分类号： H03H3/02 ,  H01L41/338 ,  H01L41/331 ,  H03H3/08 ,  H01L41/047 ,  H03H9/10

摘要： Functional element units and a connection line electrically connecting the functional element units are formed on one principal surface of a piezoelectric motherboard. A resin support layer enclosing the functional element units is formed on the one principal surface of the motherboard. An elastic wave device with the functional units is obtained by dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line. The connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected. Prior to dividing the multilayer body, a retaining member made of resin which straddles the line main body in the width direction of the line main body is formed separate from the support layer on the motherboard.

公开(公告)号：US10366899B2

公开(公告)日：2019-07-30

申请号：US15626250

申请日：2017-06-19

申请人： SPTS TECHNOLOGIES LIMITED

发明人： Oliver J Ansell ,  David A Tossell ,  Gautham Ragunathan

IPC分类号： H01S5/02 ,  H01L41/338 ,  H01L21/78 ,  H01L21/683 ,  H01L21/67 ,  H01L21/66 ,  H01L21/3213 ,  H01L21/3065 ,  H01J37/32

摘要： A method is for detecting a condition associated with a final phase of a plasma dicing process. The method includes providing a non-metallic substrate having a plurality of dicing lanes defined thereon, plasma etching through the substrate along the dicing lanes, wherein during the plasma etching infrared emission emanating from at least a portion of the dicing lanes is monitored so that an increase in infrared emission from the dicing lanes is observed as the final phase of the plasma dicing operation is entered, and detecting the condition associated with the final phase of the plasma dicing from the monitored infrared emission.

公开(公告)号：US20190221607A1

公开(公告)日：2019-07-18

申请号：US16246506

申请日：2019-01-13

申请人： Innovative Micro Technology

发明人： Christopher S. GUDEMAN

IPC分类号： H01L27/20 ,  H03H9/02 ,  H03H9/145 ,  H03H9/05 ,  H03H9/64 ,  H01L41/047 ,  H01L41/187 ,  H01L41/313 ,  H01L41/338 ,  H03H3/08 ,  H01H59/00

CPC分类号： H01L27/20 ,  H01H59/0009 ,  H01H2239/01 ,  H01L41/0477 ,  H01L41/1873 ,  H01L41/1876 ,  H01L41/313 ,  H01L41/338 ,  H03H3/08 ,  H03H9/02559 ,  H03H9/0542 ,  H03H9/145 ,  H03H9/64

摘要： Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second piezoelectric substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. The second piezoelectric substrate may include lithium tantalate (LiTaO3) or lithium niobate (LiNiO3) or lead zirconate titanate (Pb[Zr(x)Ti(1−x)]O3), or integrated circuits formed thereon.

公开(公告)号：US10233076B2

公开(公告)日：2019-03-19

申请号：US15154896

申请日：2016-05-13

申请人： uBeam Inc.

发明人： Andrew Joyce

IPC分类号： H01L41/09 ,  B81B7/00 ,  H01L41/338

摘要： Systems and techniques are provided for transducer array subdicing. A laminate material may include two laminate material flexures which each have a flexure boundary defined by a gap in the piece of laminate material. A trench may be located between the two flexures. The trench may be defined by a removal of a portion of laminate material from the piece of laminate material. A second trench may be on an opposite surface of the piece of laminate material from the trench. The second trench may be partially aligned with the trench. The trench and the second trench may result from the removal of laminate material from the piece of laminate material to a depth of 20% to 60% of the thickness of the piece of laminate material.