发明授权
- 专利标题: Elastic wave device
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申请号: US15586315申请日: 2017-05-04
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公开(公告)号: US10601389B2公开(公告)日: 2020-03-24
- 发明人: Daisuke Sekiya , Taku Kikuchi , Hiroshi Tanaka
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2014-245794 20141204
- 主分类号: H03H9/25
- IPC分类号: H03H9/25 ; H03H3/10 ; H03H3/08 ; H03H9/02 ; H03H9/05 ; H03H9/10 ; H03H9/145 ; H03H9/64 ; H01L23/367 ; H01L41/297 ; H01L41/337 ; H01L41/338 ; H01L41/053
摘要:
An elastic wave device includes IDT electrodes on a first main surface of a piezoelectric substrate and a heat dissipating film on a second main surface and including a pair of opposing main surfaces and side surfaces connecting the pair of main surfaces. At least a portion of the side surfaces of the heat dissipating film is located in an inner side portion relative to the outer circumference of the second main surface of the piezoelectric substrate on an arbitrary cross section along a direction connecting the pair of main surfaces of the heat dissipating film.
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