Abstract:
Methods and apparatus for providing a stage with a relatively high positioning bandwidth and low transmissibility are disclosed. According to one aspect of the present invention, a method for positioning a stage including providing a first force of a first magnitude to the stage using a primary actuator and providing a second force of a second magnitude to the stage using a secondary actuator. The first force is arranged to cause the stage to translate along a first axis. The secondary actuator is also arranged to cause the stage to translate along the first axis, and has a relatively high positioning bandwidth. The first force is arranged to enable the stage to be relatively coarsely positioned and the second force is arranged to enable the stage to be relatively finely positioned. In one embodiment, the secondary actuator is one of a voice coil motor and a piezoelectric motor.
Abstract:
“Hexapod” mountings are disclosed for use with optical elements. An exemplary mounting includes a base, a platform that is movable relative to the base, and six legs having nominally identical length. Three pairs of legs, having substantially equal stiffness, extend between the base and platform and support the platform relative to the base. In each pair of legs, respective first ends are coupled together in a Λ-shaped manner forming a respective apex. Respective second ends are splayed relative to the apex, desirably forming an angle of substantially 109.5° at the apex. The apices are mounted equidistantly from each other on a circle on the platform. The respective second ends of the pairs of legs are mounted at respective locations on a circle on the base. The axes of each pair of legs define a respective leg plane substantially perpendicular to the base plane. Each leg has an actuator that, when energized, changes a length of the respective leg. Coordinated energization of the actuators in selected legs produces a desired movement of the platform relative to the base in all six degrees of freedom of motion.
Abstract:
Methods and apparatus for supporting the weight of a first stage of a stage apparatus using magnets are disclosed. According to one aspect of the present invention, and apparatus includes a first structure, a second structure, and an anti-gravity device. The anti-gravity device has a first magnet and a piston arrangement that includes a second magnet. The first magnet is coupled to the first structure, and the piston arrangement is movably interfaced with the second structure through an air bearing. The first magnet and the piston arrangement cooperate to support the first structure over the second structure relative to a vertical axis.
Abstract:
Methods and apparatus for isolating or separating a reticle stage arrangement from a lens assembly are disclosed. According to one aspect of the present invention, an apparatus includes a reticle stage assembly, a lens assembly, and an isolator assembly. The isolator assembly is arranged to substantially prevent vibrations from being transmitted from the reticle stage assembly to the lens assembly. In one embodiment, the apparatus also includes a frame structure that supports the lens assembly and the reticle stage assembly.
Abstract:
A polishing apparatus (10) for polishing a device (12) with a polishing pad (48) includes a pad holder (50) and an actuator assembly (432). The pad holder (50) retains the polishing pad (48). The actuator assembly (432) includes a plurality of spaced apart actuators (438F) (438S) (438T) that are coupled to the pad holder (50). The actuators (438F) (438S) (438T) cooperate to direct forces on the pad holder (50) to alter the pressure of the polishing pad (48) on the device (12). At least one of the actuators (438F) (438S) (438T) includes a first actuator subassembly (440) and a second actuator subassembly (442) that interacts with the first actuator subassembly (440) to direct a force on the pad holder (50). The second actuator subassembly (442) is coupled to the pad holder (50) and the second actuator subassembly (442) rotates with the pad holder (50) relative to the first actuator subassembly (440).
Abstract:
Embodiments of the present invention are directed to compensating for force ripple of an apparatus driven by a force produced by a linear motor. In one embodiment, a method of compensating for force ripple comprises generating force commands for a trajectory starting at a plurality of starting positions of the apparatus driven by the linear motor to produce different trajectory motions based on the same trajectory at the plurality of starting positions, the force commands each including peaks of large acceleration/deceleration and valleys of low force levels; calculating an average of the force commands during large acceleration/deceleration generated based on trajectory motions for the plurality of starting positions; calculating a variation ratio of the force command for each trajectory motion to the calculated average of the force commands; and compensating for force ripple in the apparatus based on the calculated variation ratio to control the force applied by the linear motor to the apparatus.
Abstract:
An adjuster assembly (12) that adjusts the location where an image (18) from an object (20) is transferred onto a device (16) includes an adjuster (54) and a stage mover assembly (244). The stage mover assembly (244) adjusts the position of the adjuster (54). This moves the position where the image (18) is transferred onto the device (16). The adjuster assembly (12) can include a damper assembly (250) that is coupled to the stage mover assembly (244) and reduces the effect of vibration from the stage mover assembly (244) causing vibration on the rest of the apparatus.
Abstract:
A polishing apparatus (10) for polishing a device (12) with a polishing pad (48) includes a pad holder (50) and an actuator assembly (432). The pad holder (50) retains the polishing pad (48). The actuator assembly (432) includes a plurality of spaced apart actuators (438F) (438S) (438T) that are coupled to the pad holder (50). The actuators (438F) (438S) (438T) cooperate to direct forces on the pad holder (50) to alter the pressure of the polishing pad (48) on the device (12). At least one of the actuators (438F) (438S) (438T) includes a first actuator subassembly (440) and a second actuator subassembly (442) that interacts with the first actuator subassembly (440) to direct a force on the pad holder (50). The second actuator subassembly (442) is coupled to the pad holder (50) and the second actuator subassembly (442) rotates with the pad holder (50) relative to the first actuator subassembly (440).
Abstract:
Embodiments of the present invention are directed to a control system and method for controlling the trajectory and alignment of one or more stages by incorporating a grouping method in the control methodology. In one embodiment, a method of controlling movement of one or more stages of a precision assembly to process a substrate having a plurality of process regions comprises dividing the substrate into blocks according to one or more preset criteria, each block of the substrate including one or more process regions; generating learning data for one or more representative process regions for each block of the substrate; and using the generated learning data of the one or more representative process regions of each block to control movement of the one or more stages to process the block of one or more process regions of the substrate.
Abstract:
Methods and apparatus for applying a uniform polishing pressure on a wafer are disclosed. According to one aspect of the present invention, a chemical mechanical planarization polishing apparatus includes a polishing pad, a wafer holder, and a force control system. The wafer holder supports a wafer to be polished using the polishing pad. The polishing pad is arranged to move relative to the wafer holder such that an area of contact between the wafer holder and the polishing pad varies. The force control system including a controller and a plurality of actuators that apply forces to the polishing pad. The controller controls the forces as the area of contact varies to substantially maintain a first polishing pressure on the wafer arranged to be supported by the wafer holder.