-
51.发明申请Wafer holder, heater unit used for wafer prober having the wafer holder, and wafer prober having the heater unit 审中-公开用于具有晶片保持器的晶片探测器的晶片保持器，加热器单元和具有加热器单元的晶片探测器公开(公告)号：US20070045778A1
公开(公告)日：2007-03-01
申请号：US11498988
申请日：2006-08-04
IPC分类号： H01L29/06
CPC分类号： H01L21/67103 , G01R31/2865 , G01R31/2875
摘要： A wafer holder for a wafer prober, a heater unit including the same, and a wafer prober including the heater unit are provided in which deformation or breakage of a chuck top can be prevented and proper measurement can be realized even in repeated use. A wafer holder in the present invention includes a chuck top having a chuck top conductive layer on a surface thereof and a support body supporting the chuck top. The chuck top and the support body are fixed to each other by a screw. The difference of thermal expansion coefficient between the screw and the chuck top is 5.0×10−6/K or less.
摘要翻译： 提供了用于晶片探测器的晶片保持器，包括该晶片探测器的加热器单元和包括加热器单元的晶片探测器，其中可以防止卡盘顶部的变形或破损，并且即使在重复使用中也可以实现适当的测量。 本发明的晶片保持器包括在其表面上具有卡盘顶部导电层的卡盘顶部和支撑卡盘顶部的支撑体。 卡盘顶部和支撑体通过螺钉彼此固定。 螺杆和卡盘顶部之间的热膨胀系数的差为5.0×10 -6 / K以下。
-
52.发明申请Wafer holder, heater unit used for wafer prober and having wafer holder, and wafer prober 审中-公开晶圆支架，用于晶圆探测器的加热器单元和具有晶片支架的晶片探测器公开(公告)号：US20070024304A1
公开(公告)日：2007-02-01
申请号：US11492196
申请日：2006-07-25
IPC分类号： G01R31/02
CPC分类号： G01R31/2875 , G01R31/2865
摘要： Noise leakage from a heater body can be reduced by a wafer holder including a chuck top for mounting a semiconductor wafer, provided with the heater body, and a supporter supporting the chuck top, at least partially covered with a metal member, and by a heater unit for a wafer prober and the wafer prober using the wafer holder. In the wafer holder in accordance with the present invention, the metal member covers the supporter, preferably apart from the supporter by a distance of at most 5 mm, more preferably at most 1 mm and particularly preferably at most 0.2 mm.
摘要翻译： 加热器本体的噪声泄漏可以通过包括用于安装加热器主体的半导体晶片的卡盘顶部的晶片保持架和支撑卡盘顶部的至少部分地被金属部件覆盖的加热器和加热器 用于晶圆探测器的单元和使用晶片架的晶片探测器。 在根据本发明的晶片保持器中，金属构件覆盖支撑件，优选地与支撑件隔开最多5mm，更优选至多1mm，特别优选至多0.2mm的距离。
-
公开(公告)号：US20060191639A1
公开(公告)日：2006-08-31
申请号：US10568683
申请日：2004-08-18
CPC分类号： H01L21/68792 , H01L21/67103
摘要： The object of the present invention is to prevent damage due to thermal stress induced into a substrate holding table in a substrate holding structure for holding a substrate to be processed. In the substrate holding structure having the substrate holding table arranged at the top of a support column, a flanged part is defined by an inner circumferential surface and an outer circumferential surface at a joint between the support column and the substrate holding table. The inner circumferential surface is formed of an inclined surface, which is inclined such that the inner diameter of the flanged part successively increases as approaching the lower surface of the substrate holding table. On the lower surface of the substrate holding table to which the flanged part is joined, a U-shaped groove is formed so as to correspond to the outer circumferential surface of the flanged part.
-
公开(公告)号：US07090423B2
公开(公告)日：2006-08-15
申请号：US10248771
申请日：2003-02-17
IPC分类号： F16B4/00
CPC分类号： C04B35/581 , B32B2311/12 , B32B2315/02 , C03C29/00 , C04B37/005 , C04B37/006 , C04B2235/3205 , C04B2235/3224 , C04B2235/658 , C04B2235/6581 , C04B2235/6582 , C04B2235/945 , C04B2235/96 , C04B2235/9607 , C04B2237/10 , C04B2237/122 , C04B2237/123 , C04B2237/125 , C04B2237/343 , C04B2237/36 , C04B2237/365 , C04B2237/368 , C04B2237/403 , C04B2237/405 , C04B2237/407 , C04B2237/408 , C04B2237/72 , C04B2237/76 , Y10T403/21 , Y10T403/213 , Y10T403/217 , Y10T403/478
摘要： Joint formations that, in joining together joining members employed in a variety of electrical and electronic components, yield sufficiently high joint strength in the direction perpendicular to the plane in which two joining members join, and meanwhile in the direction parallel to the joint plane. First and second joining members have respective joint phases each formed with a different number of distinct yet continuous conformational faces, defining the joint phases so that neither is the matching complement of the other. A bonding agent interposed between the joint phases joins the joining members together. The difference in thermal expansion coefficient between the two joining members, and between them and the bonding agent, is 5.0×10−6/° C. or less. The joining members are a metal such as tungsten or Cu—W, or a ceramic such as AlN or Si3N4; and glass or a solder material is utilized for the bonding agent.
摘要翻译： 在接合在各种电气和电子部件中使用的接合部件接合在一起的联接结构中，在垂直于两个接合部件接合的平面的方向上产生足够高的接合强度，同时在平行于接合平面的方向上产生足够高的接合强度。 第一和第二接合构件具有各自的接合阶段，每个接合阶段各自形成有不同数量的不同但连续的构象面，限定了接合阶段，使得两者的匹配互补也不是。 插入在接合部之间的接合剂将接合部件接合在一起。 两个接合构件之间及其与接合剂之间的热膨胀系数的差为5.0×10 -6 /℃以下。 接合构件是诸如钨或Cu-W的金属，或诸如AlN或Si 3 N 4的陶瓷。 并且玻璃或焊料材料用于粘合剂。
-
公开(公告)号：US07090394B2
公开(公告)日：2006-08-15
申请号：US10605519
申请日：2003-10-06
IPC分类号： G01K7/00
CPC分类号： G01K1/08
摘要： Temperature gauge, and ceramic susceptors and semiconductor manufacturing equipment utilizing the temperature gauge, in which the thermocouple may be easily replaced even if damaged, and in which heat from the temperature-gauging site is readily transmitted to the temperature-gauging contact, shortening time until the measurement temperature stabilizes. A temperature-gauging contact (12) in the tip of the thermocouple contacts, in an exposed-as-it-is state, a temperature-gauging site on a ceramic susceptor (1), and by means of a circular cylindrical-shaped retaining member (11) screwed into female threads in the ceramic susceptor (1) is detachably pressed upon and retained against the ceramic susceptor. Thermocouple lead lines (13), passing through a through-hole (14) in the retaining member (11), stretch from one end face to the other end face thereof. The retaining member may be provided with a flange having threaded holes and screwlocked into female screws in the ceramic susceptor.
摘要翻译： 使用温度计的温度计和陶瓷感受体和半导体制造设备，其中热电偶即使损坏也可以容易地更换，并且来自温度测量部位的热量容易传递到温度测量接点，缩短时间直到 测量温度稳定。 热电偶尖端中的温度测量接点（12）以暴露状态接触陶瓷基座（1）上的温度测量位置，并且通过圆柱形保持 螺纹连接在陶瓷基座（1）中的阴螺纹中的构件（11）可拆卸地按压并保持在陶瓷基座上。 穿过保持构件（11）中的通孔（14）的热电偶引线（13）从一个端面延伸到另一端面。 保持构件可以设置有具有螺纹孔的凸缘并且被螺纹锁定在陶瓷基座中的内螺纹中。
-
公开(公告)号：US07045045B2
公开(公告)日：2006-05-16
申请号：US10237975
申请日：2002-09-10
IPC分类号： C25B9/02
CPC分类号： H01L21/6831
摘要： An inexpensive workpiece holder having high reliability and a processing apparatus equipped with the workpiece holder are provided, in which damage caused by oxygen in the air is prevented. The holder comprises: a ceramic body which has an electrode and a heater circuit and which can holds a workpiece; a tubular member having an end portion connected to the ceramic body; a sealing member which is disposed inside the tubular member and which isolates a space inside the tubular member into two regions: a region on the first end portion (“sealed portion”) and a region on the opposite side (“opposite region”); and power supply conductive members which extend from the opposite region side, penetrating the sealing member to the sealed region side, and which are electrically connected to the electrode and the heater circuit.
-
公开(公告)号：US20050000956A1
公开(公告)日：2005-01-06
申请号：US10711064
申请日：2004-08-20
CPC分类号： H01L21/67103 , H05B3/143 , H05B3/265
摘要： Ceramic susceptor whose wafer-retaining face has superior isothermal properties, and that is suited to utilization in apparatuses for manufacturing semiconductors and in liquid-crystal manufacturing apparatuses. In plate-shaped sintered ceramic body 1, resistive heating element 2 is formed. Fluctuation in pullback length L between sintered ceramic body outer-peripheral edge 1a and resistive heating element substantive-domain outer-peripheral edge 2a is within ±0.8%, while isothermal rating of the entire surface of the wafer-retaining face is ±1.0% or less. Preferable is a superior isothermal rating of ±0.5% or less that can be achieved by bringing the fluctuation in pullback length L to within ±0.5%.
摘要翻译： 其晶片保持面具有优异的等温性能，适用于半导体制造装置和液晶制造装置的陶瓷基座。 在板状烧结陶瓷体1中，形成电阻加热元件2。 烧结陶瓷体外周边缘1a和电阻加热元件本体外周边缘2a之间的回拉长度L的波动在±0.8％以内，而晶片保持面的整个表面的等温额定值为±1.0％ 减。 优选的等温额定值为±0.5％以下，通过使拉回长度L的波动在±0.5％以内可以实现。
-
公开(公告)号：US06671489B2
公开(公告)日：2003-12-30
申请号：US10169129
申请日：2002-06-27
IPC分类号： G03G1520
CPC分类号： G03G15/2064 , G03G2215/2016 , G03G2215/2035
摘要： In a heating-type toner-fixing unit using a ceramic heater and a cylindrical fixing film, the shape of the fixing face-side surface of a ceramic heater 10 which comes into contact with a fixing film 3 and the shape of the portions of a heater support 12 at least adjacent to the fixing face-side surface are formed into a shape that is almost identical to a naturally deformed shape of the fixing film 3 in a static state or a traveling state where the fixing film is pressed by a pressure roller 4 at a designated nip width. It is also possible that the nip portion and portions adjacent thereto at the entrance side and exit side are formed into a flat shape and portions other than the flat portions are formed into a curved surface shape along the cylindrical shape of the fixing film 3.
-
59.发明授权Wafer holder for semiconductor manufacturing apparatus, method of manufacturing wafer holder, and semiconductor manufacturing apparatus 有权用于半导体制造装置的晶片保持器，晶片保持器的制造方法以及半导体制造装置公开(公告)号：US06508884B2
公开(公告)日：2003-01-21
申请号：US09741477
申请日：2000-12-19
申请人： Akira Kuibira , Hirohiko Nakata , Kenjiro Higaki , Masuhiro Natsuhara , Takashi Ishii , Yasuyuki Matsui
发明人： Akira Kuibira , Hirohiko Nakata , Kenjiro Higaki , Masuhiro Natsuhara , Takashi Ishii , Yasuyuki Matsui
IPC分类号： C23C1600
CPC分类号： H01L21/6835 , C04B37/005 , C04B41/009 , C04B41/52 , C04B41/89 , C04B2237/06 , C04B2237/062 , C04B2237/064 , C04B2237/066 , C04B2237/08 , C04B2237/10 , C04B2237/122 , C04B2237/123 , C04B2237/125 , C04B2237/343 , C04B2237/366 , C04B2237/368 , C04B2237/52 , C04B2237/567 , C04B2237/62 , C04B2237/66 , C04B2237/704 , C04B2237/708 , C04B2237/72 , C04B2237/80 , H01L21/4857 , H01L21/67103 , C04B41/0072 , C04B41/4539 , C04B41/4572 , C04B41/5133 , C04B41/5022 , C04B35/581
摘要： A wafer holder for a semiconductor manufacturing apparatus that has a high heat conductivity and includes a conductive layer such as heater circuit pattern which can be formed with a high precision pattern, a method of manufacturing the wafer holder, and a semiconductor manufacturing apparatus having therein the wafer holder are provided. On a surface of a sintered aluminum nitride piece, paste containing metal particles is applied and fired to form a heater circuit pattern as a conductive layer. Between the surface of the sintered aluminum nitride piece having the heater circuit pattern formed thereon and another sintered aluminum nitride piece, a glass layer is provided as a joint layer to be heated for joining the sintered aluminum nitride pieces together.
摘要翻译： 一种用于半导体制造装置的晶片保持器，其具有高导热性并且包括可以以高精度图案形成的加热器电路图案的导电层，制造晶片保持器的方法，以及其中具有 提供晶片保持器。 在烧结的氮化铝片的表面上，涂覆含有金属颗粒的糊状物并烧制以形成作为导电层的加热器电路图案。 在其上形成有加热器电路图案的烧结氮化铝片的表面和另一个烧结的氮化铝片之间，设置玻璃层作为待烧结的接合层，以将烧结的氮化铝片接合在一起。
-
60.发明授权Ceramic heater for toner-fixing units and method for manufacturing the heater 失效用于调色剂定影单元的陶瓷加热器和用于制造加热器的方法公开(公告)号：US06384378B2
公开(公告)日：2002-05-07
申请号：US09834642
申请日：2001-04-16
IPC分类号： H05B300
CPC分类号： G03G15/2053 , G03G15/2064 , H05B3/0095
摘要： A ceramic heater that is used in a toner-fixing system comprising a ceramic heater and a heat-resistant film, that reduces the degree of deformation of the heat-resistant film, that lightens the load applied to the film at the time of revolution, that prevents the fracture of the film, and that enables fixing at a high rate exceeding 24 ppm. A ceramic base material 11 of the ceramic heater attached to a heating cylinder comprises aluminum nitride or silicon nitride. A heating element 12 and current-feeding electrodes are made of heat-resistant metal such as tungsten and molybdenum or heat resistant alloy and are formed on the ceramic base material. In the ceramic heater, at least one part of the face (the fixing face) that contacts the heat-resistant film is curved when viewed from a direction perpendicular to the feeding direction of a copying sheet.
摘要翻译： 一种用于包括陶瓷加热器和耐热膜的调色剂定影系统中的陶瓷加热器，其减小了耐热膜的变形程度，从而减轻了在旋转时施加到膜上的载荷， 可以防止膜的断裂，能够以超过24ppm的高速率进行固定。 附着在加热缸上的陶瓷加热器的陶瓷基材11包括氮化铝或氮化硅。 加热元件12和馈电电极由诸如钨和钼的耐热金属或耐热合金制成并形成在陶瓷基材上。 在陶瓷加热器中，从与复印纸的进给方向垂直的方向观察时，与耐热膜接触的面（固定面）的至少一部分是弯曲的。
-
-
-
-
-
-
-
-
-
搜索结果
108 条记录 (耗时 0.025 秒)
