公开(公告)号：US09346992B2

公开(公告)日：2016-05-24

申请号：US14330075

申请日：2014-07-14

Applicant: E I DU PONT DE NEMOURS AND COMPANY

Inventor： Vincenzo Arancio ,  Jay Robert Dorfman

IPC: H01B3/02 ,  C09K5/14 ,  C09D163/00 ,  H01B17/60 ,  H01B3/40 ,  H01B3/42 ,  H01B3/30 ,  H03K17/96

CPC classification number: C09K5/14 ,  C08G2650/56 ,  C08K3/38 ,  C08K2003/385 ,  C08L71/00 ,  C08L75/04 ,  C09D163/00 ,  H01B3/025 ,  H01B3/302 ,  H01B3/40 ,  H01B3/42 ,  H01B17/60 ,  H03K17/962 ,  C09D175/04

Abstract: This invention is directed to a polymer thick film thermally conductive thermoformable dielectric composition comprising urethane resin, thermoplastic phenoxy resin, diacetone alcohol and thermally conductive powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process.

Abstract translation: 本发明涉及包含聚氨酯树脂，热塑性苯氧基树脂，双丙酮醇和导热粉末的聚合物厚膜导热可热成形电介质组合物。 由组合物制成的电介质可用于各种电子应用中以保护电气元件，特别是在电容开关应用中绝缘并保护导电可热成型银和聚碳酸酯基板。 热成型电路可以随后进行注射成型工艺。

公开(公告)号：US20150030785A1

公开(公告)日：2015-01-29

申请号：US14511973

申请日：2014-10-10

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Weijun Yin ,  Min Yan ,  Ri-An Zhao

IPC: H01B19/04 ,  H01B17/60

CPC classification number: H01B19/04 ,  B32B27/281 ,  C23C14/00 ,  C23C14/562 ,  C23C16/545 ,  H01B3/306 ,  H01B7/292 ,  H01B17/60 ,  Y10T29/49885 ,  Y10T428/2495 ,  Y10T428/265 ,  Y10T428/3154 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31855

Abstract: A high-temperature insulation assembly for use in high-temperature electrical machines and a method for forming a high-temperature insulation assembly for insulating conducting material in a high-temperature electrical machine. The assembly includes a polymeric film and at least one ceramic coating disposed on the polymeric film. The polymeric film is disposed over conductive wiring or used as a conductor winding insulator for phase separation and slot liner.

Abstract translation: 用于高温电机的高温绝缘组件和用于形成用于在高温电机中绝缘导电材料的高温绝缘组件的方法。 组件包括聚合物膜和设置在聚合物膜上的至少一个陶瓷涂层。 聚合物膜设置在导电布线之上或用作用于相分离和槽衬的导体绕组绝缘体。

公开(公告)号：US08741441B2

公开(公告)日：2014-06-03

申请号：US12829528

申请日：2010-07-02

Applicant: Yuki Honda ,  Tomiya Abe ,  Hideyuki Kikuchi ,  Daisuke Hino

Inventor： Yuki Honda ,  Tomiya Abe ,  Hideyuki Kikuchi ,  Daisuke Hino

IPC: B32B15/08 ,  C08L79/08 ,  H01B17/60

CPC classification number: C09D179/08 ,  H01B3/305 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: An insulated wire includes a conductor, and an insulating covering layer formed on a periphery of the conductor and including two or more insulating coatings. The insulating coatings include a polyamide-imide resin insulating material represented by chemical formula 1: where R indicates a divalent aromatic diamine including three or more aromatic rings. The insulating coatings are formed by applying and baking the polyamide-imide resin insulating material, and the polyamide-imide resin insulating material is obtained by reacting an imide group containing dicarboxylic acid with a diisocyanate, the imide group containing dicarboxylic acid being obtained by dehydration reaction of a diamine comprising a divalent aromatic diamine including three or more aromatic rings with an acid using an azeotropic solvent.

Abstract translation: 绝缘线包括导体和形成在导体的周边上并包括两个或更多个绝缘涂层的绝缘覆盖层。 绝缘涂层包括由化学式1表示的聚酰胺酰亚胺树脂绝缘材料：其中R表示包含三个或更多个芳环的二价芳族二胺。 通过涂布和烘烤聚酰胺酰亚胺树脂绝缘材料形成绝缘涂层，并且通过使含有二羧酸的酰亚胺基与二异氰酸酯反应获得聚酰胺 - 酰亚胺树脂绝缘材料，通过脱水反应得到含有二羧酸的酰亚胺基 的二胺，其包含使用共沸溶剂的含有三个或更多个芳族环的二价芳族二胺与酸。

公开(公告)号：US20130341068A1

公开(公告)日：2013-12-26

申请号：US13884790

申请日：2010-11-10

Applicant: Benoit Prieur ,  Francisco Del Rey

Inventor： Benoit Prieur ,  Francisco Del Rey

IPC: H01B7/02 ,  H01B17/60 ,  H01B3/00

CPC classification number: H01B7/0241 ,  B32B19/045 ,  B32B27/20 ,  B32B2457/00 ,  B32B2553/00 ,  H01B3/006 ,  H01B3/04 ,  H01B17/60 ,  Y10T428/24999 ,  Y10T428/3154 ,  Y10T428/31663 ,  Y10T428/31667

Abstract: The present invention relates to a multilayer strip (1) comprising at least: an essentially mica-based layer (3) and a polymeric layer (2) comprising 60 to 85% by weight of a mineral filler (4) and 15 to 40% by weight of a polymer.

Abstract translation: 本发明涉及至少包括基本上云母的层（3）和包含60至85重量％的矿物填料（4）和15至40重量％的聚合物层（2）的多层条带（1） 的聚合物。

公开(公告)号：US20120012364A1

公开(公告)日：2012-01-19

申请号：US13113451

申请日：2011-05-23

Applicant: Gary C. Grenier

Inventor： Gary C. Grenier

IPC: H01B17/60 ,  C08L23/06 ,  C08J3/24 ,  C08L43/04 ,  C08K5/17

CPC classification number: C08L23/0892 ,  C08K5/0025 ,  C08K5/0041 ,  C08K5/005 ,  C08L23/06 ,  C08L2312/08 ,  Y10T428/31645 ,  C08L2666/06

Abstract: A new cross linked polyolefin material combination that is designed to replace current high-density polyethylene (“HDPE”) materials for use with molded or over-molded electrical transmission products. Such molded or over-molded electrical transmission products include, for example, vise-top pin insulators, line post insulators, F-neck, C-neck, and J-neck pin insulators of classes ANSI 55-3, 55-4, and 55-5, Spacer cable spacers, Brackets, hangers, Line post sensors, cable restraint insulators, and transmission style insulators.

Abstract translation: 一种新的交联聚烯烃材料组合，其设计用于替代当前的高密度聚乙烯（“HDPE”）材料，用于模制或超模塑电气产品。 这种模制或过模制的电气传输产品包括例如类别ANSI 55-3,55-4的顶针销绝缘子，线柱绝缘子，F颈，C颈和J-针销绝缘体，以及 55-5，间隔电缆间隔件，支架，吊架，线柱传感器，电缆约束绝缘子和传动式绝缘子。

公开(公告)号：US20050210828A1

公开(公告)日：2005-09-29

申请号：US11091861

申请日：2005-03-28

Applicant: Barry Mower ,  Brent Steed ,  Jay Calkin ,  Neil Watson ,  Robert Astle ,  L. Strong ,  Rich Howe ,  David Winter ,  Kent Ashby

Inventor： Barry Mower ,  Brent Steed ,  Jay Calkin ,  Neil Watson ,  Robert Astle ,  L. Strong ,  Rich Howe ,  David Winter ,  Kent Ashby

IPC: A47B13/08 ,  E04B1/343 ,  E04B1/346 ,  E04B7/02 ,  E04B7/16 ,  E04B7/20 ,  E04C2/00 ,  E04C2/54 ,  E04D3/35 ,  E04D3/40 ,  E04F13/00 ,  E04F15/00 ,  E04F19/00 ,  E04H1/00 ,  E04H1/12 ,  E06B5/02 ,  H01B17/32 ,  H01B17/60

CPC classification number: E04B1/34321 ,  E04B7/022 ,  E04B7/20 ,  E04B2001/34389 ,  E04D3/357 ,  E04D3/40 ,  E04F2201/05 ,  E04F2201/0594 ,  E04H1/1205 ,  E06B5/02

Abstract: A modular enclosure, such as a shed, may include a floor constructed from one or more floor panels. The floor panels, which may be constructed from blow-molded plastic, may include a pattern disposed on the upper surface. The floor panels may also include depressions that are formed in the lower surface and extend towards the upper surface. If desired, the depressions may be generally aligned with a portion of the pattern in the upper surface and the depressions may have a length that is less than the distance separating the upper surface and the lower surface. Advantageously, the depressions may be sized and configured to increase the strength of the floor panels. In addition, the floor panels may include a pattern disposed on the lower surface and the depressions may be at least partially disposed in the pattern. The patterns on the opposing sides of the panels may be generally offset and/or have different orientations.

Abstract translation: 诸如棚屋的模块化外壳可以包括由一个或多个地板构成的地板。 可由吹塑成型塑料构成的地板可以包括设置在上表面上的图案。 地板镶板还可以包括形成在下表面中并朝向上表面延伸的凹陷。 如果需要，凹部可以大致与上表面中的图案的一部分对准，并且凹陷可以具有小于分离上表面和下表面的距离的长度。 有利地，凹陷的尺寸和构造可以增加地板镶板的强度。 此外，地板镶板可以包括设置在下表面上的图案，并且凹部可以至少部分地设置在图案中。 板的相对侧上的图案通常可以偏移和/或具有不同的取向。

公开(公告)号：US20050181692A1

公开(公告)日：2005-08-18

申请号：US11028654

申请日：2005-01-05

Applicant: Satoshi Okamoto ,  Shiro Katagiri ,  Wakana Aizawa ,  Masatoshi Kito

Inventor： Satoshi Okamoto ,  Shiro Katagiri ,  Wakana Aizawa ,  Masatoshi Kito

IPC: C08J5/04 ,  B32B5/02 ,  B32B5/28 ,  B32B27/04 ,  C08G63/60 ,  C08J5/06 ,  C08J5/10 ,  C08L67/00 ,  C08L67/03 ,  D04H1/00 ,  D06N3/00 ,  D06N3/12 ,  D21H13/24 ,  D21H17/53 ,  H01B17/60 ,  H05K1/02 ,  H05K1/03

CPC classification number: B32B27/06 ,  B32B15/08 ,  B32B27/04 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/306 ,  B32B2457/08 ,  C08L67/00 ,  C08L67/03 ,  C08L2205/16 ,  D06N3/0015 ,  D06N3/121 ,  D21H13/24 ,  D21H17/53 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0278 ,  H05K2203/0783 ,  Y10T442/2418 ,  Y10T442/2475 ,  Y10T442/2631 ,  Y10T442/2861 ,  Y10T442/696 ,  C08L2666/02 ,  C08L2666/18

Abstract: A resin-impregnated substrate is obtained by a method comprising the steps of immersing a sheet comprising an aromatic liquid crystalline polyester fiber in an aromatic liquid crystalline polyester solution containing 100 parts by weight of a solvent and 0.5 to 100 parts by weight of an aromatic liquid crystalline polyester and removing the solvent, the solvent containing on a weight basis with respect to the solvent 30% or more of a phenol compound. The resin-impregnated substrate has a high heat resistance in soldering conditions.

Abstract translation: 通过包括以下步骤的方法获得树脂浸渍的基材：将包含芳族液晶聚酯纤维的片材浸入含有100重量份溶剂的芳族液晶聚酯溶液和0.5至100重量份的芳族液体 结晶聚酯并除去溶剂，溶剂相对于溶剂以重量计含有30％或更多的酚化合物。 浸渍树脂的基材在焊接条件下具有高耐热性。

公开(公告)号：US06891155B2

公开(公告)日：2005-05-10

申请号：US10246150

申请日：2002-09-17

Applicant: Jie Li ,  Thomas N. Corso ,  Gary A. Schultz

Inventor： Jie Li ,  Thomas N. Corso ,  Gary A. Schultz

IPC: G01N27/447 ,  B32B7/00 ,  B81B1/00 ,  G01N30/72 ,  G01N37/00 ,  G02B1/11 ,  H01B3/10 ,  H01B3/12 ,  H01B7/282 ,  H01B17/60 ,  H01J49/04 ,  H01L21/306 ,  H01L29/00 ,  H01L29/74 ,  H01L29/76 ,  H01L29/78

CPC classification number: H01B7/2825 ,  G01N27/44704 ,  G01N30/7266 ,  H01B3/10 ,  H01B3/12 ,  H01L21/3143 ,  H01L21/3145 ,  H01L21/3146

Abstract: A dielectric film is provided which includes a base layer and a capping layer, preferably silicon oxynitride, wherein the film is an effective moisture and ion barrier when disposed between a conductive substrate and a liquid having an electrical potential different than the electrical potential of the substrate.

Abstract translation: 提供了一种电介质膜，其包括基底层和覆盖层，优选氮氧化硅，其中当设置在导电衬底和具有不同于衬底的电位的电位的电位的液体之间时，膜是有效的水分和离子屏障 。

公开(公告)号：US6153831A

公开(公告)日：2000-11-28

申请号：US899995

申请日：1997-07-24

Applicant: Charles M. Weber ,  Timothy A. Antaya

Inventor： Charles M. Weber ,  Timothy A. Antaya

IPC: H01B3/08 ,  H01B17/56 ,  H01B17/60 ,  H01B17/32

CPC classification number: H01B17/60 ,  H01B3/082 ,  H01B3/084 ,  Y10S428/902 ,  Y10T442/2631 ,  Y10T442/2951

Abstract: A composite insulation of S2 glass fibers and epoxy is formed having a more nearly uniform coefficient of thermal expansion in all three planes for use in cryogenic superconductor applications. The glass fibers have a three-dimensional weave.

Abstract translation: 形成S2玻璃纤维和环氧树脂的复合绝缘体，其在所有三个平面中具有更接近于均匀的热膨胀系数，用于低温超导体应用。 玻璃纤维具有三维织造。

公开(公告)号：US5520974A

公开(公告)日：1996-05-28

申请号：US408433

申请日：1995-03-22

Applicant: Achilles Chiotis ,  Rajendra S. Cornelius ,  Pravin L. Soni

Inventor： Achilles Chiotis ,  Rajendra S. Cornelius ,  Pravin L. Soni

IPC: C08K3/22 ,  C08K3/00 ,  C08K5/00 ,  C08K5/02 ,  C08L83/04 ,  C09D5/18 ,  H01B17/60 ,  F16L11/00

CPC classification number: C08K3/0058 ,  C08K5/0066 ,  H02G15/18 ,  Y10T428/1352 ,  Y10T428/139

Abstract: Flame retarded organopolysiloxane gels suitable for sealing and protecting electrical contacts include (i) an organopolysiloxane gel having repeat units of the structure ##STR1## where each R is independently phenyl or C.sub.1 -C.sub.4 alkyl or fluoroalkyl, at least 40% of the R groups being phenyl; and (ii) an additive package mixed with the organopolysiloxane, which is (a) zinc oxide; (b) antimony oxide; (c) a brominated compound having a molecular weight of at least 450 and a bromine content of at least 40 weight %; (d) a chlorinated compound having a molecular weight of at least 300 and a chlorine content of at least 40 weight %; or (e) combinations of the above. The additive package is used in an amount between about 10 and about 60 parts by weight per 100 parts by weight of organopolysiloxane.

Abstract translation: 适用于密封和保护电接触的阻燃有机聚硅氧烷凝胶包括（i）具有结构“IMAGE”的重复单元的有机聚硅氧烷凝胶，其中每个R独立地为苯基或C 1 -C 4烷基或氟代烷基，至少40％的R基团为 苯基; 和（ii）与有机聚硅氧烷混合的添加剂包，其为（a）氧化锌; （b）氧化锑; （c）分子量至少为450且溴含量为至少40重量％的溴化合物; （d）分子量至少为300，氯含量为至少40重量％的氯化合物; 或（e）上述的组合。 添加剂包的用量为每100重量份有机聚硅氧烷约10至约60重量份。