公开(公告)号：US20230308076A1

公开(公告)日：2023-09-28

申请号：US18324902

申请日：2023-05-26

Applicant: Stathera IP Holdings Inc.

Inventor： Vamsy P. Chodavarapu ,  George Xereas

IPC: H03H9/10 ,  B81C1/00 ,  H03H9/24 ,  H03H3/007 ,  B81B7/00 ,  G01L9/12 ,  H03H9/05 ,  G01L9/00

CPC classification number: H03H9/1057 ,  B81C1/00182 ,  H03H9/2426 ,  H03H3/0072 ,  H03H3/0073 ,  B81B7/007 ,  G01L9/12 ,  H03H9/0561 ,  G01L9/0042 ,  G01L9/0073 ,  B81C1/00269 ,  B81C1/00301 ,  H03H9/2405 ,  H03H9/2436 ,  H03H9/2431 ,  H03H9/2478 ,  H03H2009/2442 ,  B81B2203/0307 ,  H03H9/2452 ,  H03H9/2463 ,  H03H9/2473

Abstract: A MEMS device may include: (i) a lower cavity, including a first island, formed within a first layer of the MEMS device; (ii) an upper cavity, including a second island, formed within a second layer of the MEMS device; (iii) a MEMS resonating element arranged in a device layer of the MEMS device and anchored via the first and second islands; (iv) a first set of electrodes for electrostatic actuation and sensing of the MEMS resonating element in an in-plane mode that is arranged in the device layer of the MEMS device; and (v) a second set of electrodes for electrostatic actuation and sensing of the MEMS resonating element in an out-of-plane mode that is electrically isolated from the first set of electrodes and located in the first or second layer of the MEMS device, and wherein the out-of-plane mode is a torsional mode or a saddle mode.

公开(公告)号：US11750173B2

公开(公告)日：2023-09-05

申请号：US17023861

申请日：2020-09-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryota Kawai ,  Keisuke Takeyama ,  Yuichi Goto

IPC: H03H9/24 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10

CPC classification number: H03H9/2457 ,  H03H9/02448 ,  H03H9/0595 ,  H03H9/1057

Abstract: A resonance device includes a resonator, an upper lid, and a lower lid. The resonator includes a vibration portion, a frame, and holding arms. The vibration portion includes a base and a plurality of vibration arms. The lower lid has a protruding portion protruding between two adjacent vibration arms, the protruding portion has an insulating film, the vibration arms have a weight portion that has a conductive film formed on the insulating film, and in a direction in which the plurality of vibration arms extend, a first distance between the weight portion of any one of the two adjacent vibration arms and the holding portion is less than a second distance between the weight portion and the protruding portion.

公开(公告)号：US11703330B2

公开(公告)日：2023-07-18

申请号：US16836387

申请日：2020-03-31

Applicant: The Regents of the University of California

Inventor： Andrei M. Shkel ,  Mohammad H. Asadian Ardakani ,  Yusheng Wang

IPC: G01C19/5719 ,  B81C1/00 ,  H03H3/007 ,  H03H9/10 ,  B81B3/00 ,  G01C19/5691 ,  B81B7/00

CPC classification number: G01C19/5719 ,  B81C1/00182 ,  H03H3/0072 ,  H03H9/1057 ,  B81B3/0051 ,  B81B7/0016 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2203/0127 ,  B81B2203/0172 ,  B81C1/00158 ,  G01C19/5691

Abstract: A dual-shell architecture and methods of fabrication of fused quartz resonators is disclosed. The architecture may include two encapsulated and concentric cavities using plasma-activated wafer bonding followed by the high-temperature glassblowing. The dual-shell architecture can provide a protective shield as well as a “fixed-fixed” anchor for the sensing element of the resonators. Structures can be instrumented to operate as a resonator, a gyroscope, or other vibratory sensor and for precision operation in a harsh environment. Methods for fabricating a dual-shell resonator structure can include pre-etching cavities on a cap wafer, pre-etching cavities on a device wafer, bonding the device wafer to a substrate wafer to form a substrate pair and aligning and bonding the cap wafer to the substrate pair to form a wafer stack with aligned cavities including a cap cavity and a device cavity. The wafer stack may be glassblown to form a dual-shell structure.

公开(公告)号：US20230208394A1

公开(公告)日：2023-06-29

申请号：US18112464

申请日：2023-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Kuo-Hua LAI ,  Hui-Chung LIU

IPC: H03H9/24 ,  H03H3/007 ,  H03H9/10 ,  H03H9/08 ,  H03H9/05 ,  H03L1/02 ,  H03L1/04

CPC classification number: H03H9/2426 ,  H03H3/0073 ,  H03H9/1057 ,  H03H9/08 ,  H03H9/0547 ,  H03L1/028 ,  H03L1/04

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

公开(公告)号：US20230183060A1

公开(公告)日：2023-06-15

申请号：US18072506

申请日：2022-11-30

Applicant: SiTime Corporation

Inventor： Charles I. Grosjean ,  Nicholas Miller ,  Paul M. Hagelin ,  Ginel C. Hill ,  Joseph C. Doll

IPC: B81C1/00 ,  H10N30/05 ,  H10N39/00 ,  H03H3/007 ,  H03H9/10

CPC classification number: B81C1/00698 ,  H03H3/0073 ,  H03H9/1057 ,  H10N30/05 ,  H10N39/00 ,  B81C1/00158 ,  B81C2201/0171

Abstract: Multiple degenerately-doped silicon layers are implemented within resonant structures to control multiple orders of temperature coefficients of frequency.

公开(公告)号：US20190238113A1

公开(公告)日：2019-08-01

申请号：US16311572

申请日：2017-06-26

Applicant: SNAPTRACK, INC.

Inventor： Roland ROSEZIN ,  Ansgar SCHAUFELE

IPC: H03H9/10 ,  B81B7/00 ,  H03H3/007

CPC classification number: H03H9/1007 ,  B81B7/007 ,  B81B2207/097 ,  B81C2203/0136 ,  B81C2203/0145 ,  H01L2224/11 ,  H03H3/007 ,  H03H9/1057 ,  H03H9/1064 ,  H03H2003/0071

Abstract: A component (B) is specified which comprises a functional structure (FS) on a carrier (TR) that is spanned by a thin-layer covering (DSA) resting on said carrier. A first wiring layer (VE1) is applied onto or in the thin-layer covering and comprises structured conductor traces that are connected with the functional structure.

公开(公告)号：US20180273374A1

公开(公告)日：2018-09-27

申请号：US15650812

申请日：2017-07-14

Applicant: InvenSense, Inc.

Inventor： William Kerry Keal

IPC: B81C1/00 ,  G01C19/5719 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/18 ,  H01H59/00 ,  H03H9/10

CPC classification number: B81C1/0023 ,  B81B2201/0235 ,  B81B2201/042 ,  B81C2201/019 ,  B81C2203/0118 ,  G01C19/5719 ,  G01K11/24 ,  G01K13/02 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0831 ,  H01H59/0009 ,  H03H9/1057

Abstract: In a method of inferring ambient atmospheric temperature, an acoustic signal is emitted from a speaker. A first sample of the acoustic signal is captured with a first microphone spaced a first distance from the speaker. A second sample of the acoustic signal is captured with a second microphone spaced a second distance from the speaker. The second distance is greater than the first distance, and a difference between the first distance and the second distance is a known third distance. A time delay in the acoustic signal is determined between the first sample and the second sample. An ambient temperature of the atmosphere through which the acoustic signal traveled is inferred based on a relationship between the time delay and temperature for the acoustic signal over the third distance.

公开(公告)号：US20180191329A1

公开(公告)日：2018-07-05

申请号：US15904906

申请日：2018-02-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshio Nishimura ,  Ville Kaajakari

IPC: H03H9/24 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10

CPC classification number: H03H9/2405 ,  H03H9/02433 ,  H03H9/0595 ,  H03H9/1035 ,  H03H9/1057 ,  H03H2009/0244

Abstract: A resonator that includes a piezoelectric vibrating portion; a retainer provided in at least part of an area surrounding the piezoelectric vibrating portion; a first node generating portion disposed between the piezoelectric vibrating portion and the retainer; a first connecting arm that connects the first node generating portion to a region in the piezoelectric vibrating portion that faces the first node generating portion; and a first retaining arm that connects the first node generating portion to a region in the retainer that faces the first node generating portion. The first node generating portion is substantially symmetrical with respect to each of two lines passing through a center of the first node generating portion along a first direction and a second direction orthogonal to the first direction, with the first direction being a direction that the first connecting arm connects the first node generating portion to the piezoelectric vibrating portion.

公开(公告)号：US20180159501A1

公开(公告)日：2018-06-07

申请号：US15877746

申请日：2018-01-23

Applicant: Murara Manufacturing Co., Ltd.

Inventor： KOUJI ISHIKAWA ,  Akio Katsube ,  Takehito Ishihara ,  Takeshi Ono

IPC: H03H9/10 ,  H03H9/05 ,  H03H9/17 ,  H03H3/02

CPC classification number: H03H9/1021 ,  H03H3/02 ,  H03H9/0519 ,  H03H9/1057 ,  H03H9/176 ,  H03H2003/022 ,  H03H2003/027 ,  H03H2009/155

Abstract: An electronic component that includes an electronic element; a base member having an upper surface on which the electronic element is mounted; and a lid member bonded to the base member via a bonding member such that the electronic element is hermetically sealed therebetween. The bonding member is made of an insulating material containing a first metal. The lid member has an outermost layer formed on at least a surface of the lid member facing the base member. The outermost layer of the lid member has a solid solution layer of the first metal and a second metal at at least a portion of the outermost layer.

公开(公告)号：US20180034441A1

公开(公告)日：2018-02-01

申请号：US15725469

申请日：2017-10-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Wakana Hirota ,  Ville Kaajakari

IPC: H03H9/05 ,  H03H9/10 ,  H03H9/21

CPC classification number: H03H9/0595 ,  H03H9/10 ,  H03H9/1057 ,  H03H9/21 ,  H03H9/2489

Abstract: A resonator is provided that suppresses a shift in resonant frequency. The resonator includes a vibration member including vibration arms extending therefrom with two or more of the vibration arms performing out-of-plane bend with different phases. Moreover, the resonator includes a base having a front end connected to the vibration arms and a rear end opposing the front end and structured to bend in a direction of the out-of-plane bend when the vibration arms perform the out-of-plane bend. Moreover, a frame surrounds a periphery of the vibration member and one or more holding arms are positioned between the vibration member and the frame. One end of each holding arm is connected to the base and the other end of the holding arm is connected to the frame. The holding arms bend in the direction of the out-of-plane bend when the base bends.