公开(公告)号：US20180123559A1

公开(公告)日：2018-05-03

申请号：US15793988

申请日：2017-10-26

Applicant: NIHON DEMPA KOGYO CO., LTD.

Inventor： Yoshihiro WATANABE

IPC: H03H9/19 ,  H03H3/02 ,  H01L41/047 ,  H03H9/05 ,  H03H9/21 ,  H01L41/053 ,  H03H9/10

CPC classification number: H03H9/19 ,  H01L41/0477 ,  H01L41/053 ,  H03H3/02 ,  H03H9/0509 ,  H03H9/0519 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/022

Abstract: A piezoelectric device is provided and includes: a piezoelectric vibrating piece, having an outer shape in rectangular shape and including an excitation electrode formed on both principal surfaces which are a top surface and a lower surface, an electrode pad formed at both ends of one short side, and an extraction electrode extracted from the excitation electrode to the electrode pad to be electrically connected to the electrode pad; a package, including a placement surface on which the piezoelectric vibrating piece is placed as opposed to the lower surface of the piezoelectric vibrating piece, and an adhesion pad formed on the placement surface; and a conductive adhesive, securing the piezoelectric vibrating piece to the package and electrically connecting the adhesion pad to the electrode pad. An adhesive is applied on the top surface of the piezoelectric vibrating piece and between the conductive adhesive and the excitation electrode.

公开(公告)号：US20180114893A1

公开(公告)日：2018-04-26

申请号：US15730749

申请日：2017-10-12

Applicant: NIHON DEMPA KOGYO CO., LTD.

Inventor： Yoshiharu SATO ,  Hirokazu IWATA

IPC: H01L41/047 ,  H01L41/22 ,  H01L41/29 ,  H01L41/053

CPC classification number: H01L41/047 ,  H01L41/053 ,  H01L41/0533 ,  H01L41/18 ,  H01L41/22 ,  H01L41/29 ,  H01L41/33 ,  H03H9/02023 ,  H03H9/02102 ,  H03H9/0519 ,  H03H9/1021 ,  H03H9/19

Abstract: A piezoelectric device includes a piezoelectric vibrating piece, an excitation electrode, an extraction electrode, a container, a pad, a conductive member, and a heat conductive metal film. The excitation electrode is disposed on a front surface and a back surface of the piezoelectric vibrating piece. The extraction electrode is extracted from the excitation electrode. The container houses the piezoelectric vibrating piece. The pad is disposed in the container, and the pad is connected to the piezoelectric vibrating piece. The conductive member connects the pad to the extraction electrode. The heat conductive metal film is disposed at least on a surface of a pad side of the piezoelectric vibrating piece, the heat conductive metal film is extracted from the extraction electrode without contacting the excitation electrode.

公开(公告)号：US20170366162A1

公开(公告)日：2017-12-21

申请号：US15692075

申请日：2017-08-31

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuyuki Noto ,  Hiroaki Kaida

IPC: H03H9/19 ,  H01L41/04 ,  H03H9/05 ,  H03H9/145

CPC classification number: H03H9/19 ,  H01L23/02 ,  H01L23/04 ,  H01L23/08 ,  H01L41/04 ,  H03H9/0519 ,  H03H9/0595 ,  H03H9/14594

Abstract: A quartz crystal resonator unit including a quartz crystal resonator having a quartz crystal blank, a frame surrounding an outer periphery of the quartz crystal blank, and coupling members connecting the frame to the quartz crystal blank. Moreover, a lid member and a base member are attached to the frame and seal the resonator. One or more outer electrodes is formed over end surfaces of the frame, the lid member, and the base member on a side where the coupling members are coupled. The one or more outer electrodes has a machinery quality factor smaller than that of the frame.

公开(公告)号：US09729124B2

公开(公告)日：2017-08-08

申请号：US14670251

申请日：2015-03-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Bunta Okamoto ,  Hidekazu Oishibashi

IPC: H01L41/053 ,  H03H9/19 ,  H03H9/10 ,  H03H9/05 ,  H01L41/047 ,  H03H9/17 ,  H03H9/13

CPC classification number: H03H9/1021 ,  H01L41/0475 ,  H01L41/053 ,  H03H9/0519 ,  H03H9/131 ,  H03H9/17

Abstract: A piezoelectric vibration component that includes a sealed space formed between first and second package members, and a piezoelectric vibrator is bonded to the first package member with first and second conductive adhesive portions. In the piezoelectric vibrator, a first vibration electrode and a first extended electrode are formed on a first surface of a piezoelectric substrate, and a second vibration electrode and a second extended electrode are formed on a second surface of the piezoelectric substrate. At least the second extended electrode provided on the second principal surface has a higher bonding strength with respect to the conductive adhesive than that of the electrodes on the first principal surface. The electrode patterns on the first and second principal surfaces differ from each other so that the first surface and the second surface can be distinguished from each other.

公开(公告)号：US20160028369A1

公开(公告)日：2016-01-28

申请号：US14808221

申请日：2015-07-24

Applicant: Seiko Epson Corporation

Inventor： Yusuke YAMAMOTO

IPC: H03H9/19 ,  H03B28/00

CPC classification number: H03H9/19 ,  H03B28/00 ,  H03H9/0519 ,  H03H9/0542 ,  H03H9/1021 ,  H03H9/174

Abstract: A resonator element includes a substrate region sandwiched by first and second excitation electrodes. The region is located within a quadrangle having four 90° corners, a pair of first sides along a thickness-shear vibration direction, and a pair of second sides perpendicular to the vibration direction. The region includes a side or a circular arc in contact with each of the first and second sides, and an outer edge recessed from at least two corners of the quadrangle in a direction intersecting the vibration direction. Further, assuming a maximum length of the region along the vibration direction is Lx, and a length of the outer edge along the vibration direction is lx, 13.7%≦(lx/Lx)≦46.0%.

Abstract translation: 谐振器元件包括被第一和第二激励电极夹持的衬底区域。 该区域位于具有四个90°角，沿着厚度 - 剪切振动方向的一对第一侧和垂直于振动方向的一对第二侧的四边形内。 该区域包括与第一和第二侧中的每一个相接触的侧面或圆弧，以及从四边形的至少两个角部沿与振动方向相交的方向凹陷的外边缘。 此外，假设沿着振动方向的区域的最大长度为Lx，并且外边缘沿振动方向的长度为lx，13.7％＆nlE;（lx / Lx）＆nlE; 46.0％。

公开(公告)号：US08860285B2

公开(公告)日：2014-10-14

申请号：US13027598

申请日：2011-02-15

Applicant: Yukihiro Hashi

Inventor： Yukihiro Hashi

IPC: H03B5/32 ,  H03H9/10 ,  H03H3/04 ,  H03H9/05 ,  H03H9/215 ,  H03H3/02

CPC classification number: H03H9/1021 ,  H03H3/04 ,  H03H9/0519 ,  H03H9/215 ,  H03H2003/026

Abstract: An electronic component includes: a base material having a first conductive section; an oscillation piece having a second conductive section; a first member which is covered with a third conductive section making conductive contact with the first and second conductive sections and is provided between the base material and the oscillation piece; and a second member which is provided so as to be surrounded with the base material, the oscillation piece, and the first member and holds the base material and the oscillation piece.

Abstract translation: 电子部件包括：具有第一导电部的基材; 振荡片，具有第二导电部分; 覆盖有与所述第一导电部和所述第二导电部导电接触的第三导电部的第一部件，设置在所述基材与所述振动片之间; 以及第二构件，其被设置成被所述基材，所述振动片和所述第一构件包围并保持所述基底材料和所述振动片。

公开(公告)号：US20140183672A1

公开(公告)日：2014-07-03

申请号：US14029869

申请日：2013-09-18

Applicant: FUJITSU LIMITED

Inventor： Hajime KUBOTA ,  Masayuki ITOH ,  Masakazu KISHI

IPC: H01L41/053 ,  H01L41/313

CPC classification number: H01L41/313 ,  H03H9/0519 ,  H03H9/1021 ,  H03H2003/022

Abstract: An electronic device includes: a first-member that includes a through-hole; a second-member that includes a connection-hole and that is in contact with the first-member in a state where the through-hole and the connection-hole are in communication with each other; a first-locking-surface that is formed on the first-member while extending radially outside of the through-hole and that faces a side opposite to the connection-hole-side; a second-locking-surface that is formed in the second-member while extending radially outside of the connection-hole and that faces a side opposite to the through-hole-side; and an adhesive-portion including a shaft-portion with which the through-hole and the connection-hole are filled, a first-large-diameter portion that is formed at an end of the shaft-portion and secured to the first-locking-surface, and a second-large-diameter portion that is formed at the other end of the shaft-portion and secured to the second-locking-surface.

Abstract translation: 电子设备包括：包括通孔的第一构件; 第二构件，其包括连接孔，并且在所述通孔和所述连接孔彼此连通的状态下与所述第一构件接触; 第一锁定面，其形成在第一构件上，同时沿着通孔的径向外侧延伸并且面向与连接孔侧相对的一侧; 第二锁定表面，其形成在所述第二构件中，同时在所述连接孔的径向外侧延伸并且面向与所述通孔侧相对的一侧; 以及包括通孔和连接孔填充的轴部的粘合部，形成在所述轴部的端部并固定到所述第一锁定部的第一大直径部， 表面和形成在轴部的另一端并固定到第二锁定表面的第二大直径部分。

公开(公告)号：US20130249353A1

公开(公告)日：2013-09-26

申请号：US13845236

申请日：2013-03-18

Applicant: SEIKO EPSON CORPORATION

Inventor： Matsutaro NAITO ,  Hideo Endo ,  Toshihiro II

IPC: H01L41/08

CPC classification number: H01L41/0825 ,  H03H9/02023 ,  H03H9/02157 ,  H03H9/0519 ,  H03H9/0542 ,  H03H9/0552 ,  H03H9/1021 ,  H03H9/177 ,  H03H9/19

Abstract: When a size from a main surface of an outer edge to a step of a first stage of a vibration section is Md1, a size from the step of the first stage to a step of a second stage is Md2, a density of materials of the substrate is dA, a density of materials of the excitation electrode is dB, and a thickness of the excitation electrode on a main surface of a mesa of the second stage is tB, a relationship of ((Md2+(dB/dA)×tB))/Md1≦1.4 is satisfied.

Abstract translation: 当从外边缘的主表面到振动部分的第一阶段的步骤的尺寸为Md1时，从第一阶段的步骤到第二阶段的步骤的尺寸为Md2，材料的密度 基板为dA，激励电极的材料密度为dB，第二级台面的主表面上的激励电极的厚度为tB，（（Md2 +（dB / dA）×tB））的关系为 ）/Md1@1.4。

公开(公告)号：US08482358B2

公开(公告)日：2013-07-09

申请号：US13176192

申请日：2011-07-05

Applicant: Akinori Yamada

Inventor： Akinori Yamada

IPC: H03B5/32

CPC classification number: H03H9/21 ,  H03H9/02102 ,  H03H9/0519 ,  H03H9/1021

Abstract: A crystal resonator element include a pair of resonating arms extending from a base, the resonating arms includes a groove, a slope portion is formed in a connection portion of the resonating arms to the base so that a distance between the groove and the outer edge of each of the resonating arms increases as it approaches the base from the resonating arms, and a non-electrode region which extends over a range of areas from a connection portion connected to a first side surface formed along the longitudinal direction of the groove and a connection portion connected to a second side surface facing the first side surface with a bottom portion disposed there between and in which excitation electrodes are not formed is provided in the groove in at least a part of the bottom portion positioned in the slope portion.

公开(公告)号：US20130135055A1

公开(公告)日：2013-05-30

申请号：US13633880

申请日：2012-10-03

Applicant: Nihon Dempa Kogyo Co., Ltd.

Inventor： HIDENORI HARIMA

IPC: H03B5/36

CPC classification number: H03H9/0547 ,  H01L24/16 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2924/15321 ,  H03H9/0519 ,  H03H9/1021 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: A surface mount piezoelectric oscillator includes a piezoelectric resonator, a mounting board, and an IC chip mounted on the mounting board. An oscillator circuit includes the IC chip and the piezoelectric resonator. The piezoelectric resonator is bonded to the mounting board with solder balls. The mounting board includes a ceramic plate. The mounting board includes connecting terminals and a wiring pattern on the one mounting board principal surface of the mounting board. The connecting terminals are connected to the terminals of the piezoelectric resonator via solder balls. The mounting board includes an intermediate layer on the one mounting board principal surface and integrally formed with the mounting board. The intermediate layer includes solder ball placement openings to position the solder balls in a center of each of the connecting terminals and an IC chip mounting opening to mount the IC chip.

Abstract translation: 表面安装压电振荡器包括压电谐振器，安装板和安装在安装板上的IC芯片。 振荡电路包括IC芯片和压电谐振器。 压电谐振器用焊球接合到安装板上。 安装板包括陶瓷板。 安装板在安装板的一个安装板主表面上包括连接端子和布线图案。 连接端子通过焊球连接到压电谐振器的端子。 安装板在一个安装板主表面上包括中间层，并与安装板一体形成。 中间层包括焊球放置开口，以将焊球定位在每个连接端子的中心和用于安装IC芯片的IC芯片安装开口。