公开(公告)号：US20070040686A1

公开(公告)日：2007-02-22

申请号：US11205545

申请日：2005-08-16

申请人： Antonio Reis

发明人： Antonio Reis

IPC分类号： G08B13/14 ,  H01Q1/36

CPC分类号： H01Q7/00 ,  G06K19/07718 ,  G06K19/07752 ,  G08B13/244 ,  H01L24/95 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01Q1/2225 ,  H01Q1/38

摘要： A method of manufacturing RFID inlay structures includes providing a strap substrate containing an RFID chip. Strap pad patterns are formed adjacent said recessed regions over contacts of the RFID chip using a directly electroplateable resin (DER). The strap substrate is attached to an inlay substrate having an electrically conductive antenna and antenna contact patterns. The DER strap pad patterns, antenna pattern, antenna contacts and chip contacts are electroplated, thereby forming a metal interconnect between the contacts of the RFID chip and the antenna contacts on the inlay substrate. The strap substrate may be obtained from a web of strap substrates formed by a casting process. The DER material may be in the form of a DER ink and applied using a pen-plotter apparatus to form strap pad patterns or antenna coil patterns on the strap substrate, and to form antenna features and antenna contact patterns on the inlay substrate.

摘要翻译： RFID嵌体结构的制造方法包括提供包含RFID芯片的带状基板。 使用直接电镀树脂（DER）在RFID芯片的触点上邻近所述凹陷区域形成带状垫图形。 绑带基片连接到具有导电天线和天线接触图案的嵌入式基板。 DER带焊盘图案，天线图案，天线触点和芯片触点被电镀，从而在RFID芯片的触点和嵌入式基板上的天线触点之间形成金属互连。 带状基材可以从通过铸造工艺形成的带状基材的幅材获得。 DER材料可以是DER油墨的形式，并且使用笔式绘图仪装置施加以在带基底上形成带状图案或天线线圈图案，并且在镶嵌衬底上形成天线特征和天线接触图案。

公开(公告)号：US07172789B2

公开(公告)日：2007-02-06

申请号：US10634350

申请日：2003-08-04

申请人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

发明人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

IPC分类号： B05D5/06

CPC分类号： H01L24/32 ,  B82Y30/00 ,  H01L21/31122 ,  H01L21/32136 ,  H01L21/84 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/1214 ,  H01L28/55 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15788 ,  Y10S977/882 ,  Y10S977/883 ,  H01L2224/82 ,  H01L2924/00

摘要： Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element. The method further includes dispensing in a flow having a first direction a slurry onto a substrate, wherein the slurry includes a fluid.

摘要翻译： 将结构组装到基板上的方法和装置。 根据本发明的一个方面的方法包括将浆料分配到基底上，其中所述浆料包括第一多个元件，每个元件设计成与所述基底上的受体区域配合，并且每个元件包括功能元件。 该方法还包括将具有第一方向的流浆分配到基底上，其中浆料包括流体。

公开(公告)号：US20070007237A1

公开(公告)日：2007-01-11

申请号：US11172960

申请日：2005-07-05

申请人： Enboa Wu ,  Chia-Shou Chang

发明人： Enboa Wu ,  Chia-Shou Chang

IPC分类号： C23F1/00 ,  B44C1/22 ,  C03C15/00

CPC分类号： B81C1/00214 ,  B23K3/0623 ,  B23K2101/40 ,  B81C3/002 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method for self-assembling microstructures onto a substrate includes using a bonding material to make the microstructure assembled onto the substrate by a physical attraction force. The microstructures are self-aligned with the substrate, and further are permanently fixed on and electrically connected with the substrate by the solder bumps between the microstructures and the substrate, which is formed by the solder bumps via reflow process. There is no need for the using of the conventional pick-and-place device in the method. The method could be applied to light emitting diodes, RFID tags, micro-integrated circuits or other types of microstructures.

摘要翻译： 用于将微结构自组装到衬底上的方法包括使用接合材料通过物理吸引力将微结构组装在衬底上。 微结构与衬底自对准，并且通过由微焊料和衬底之间的焊料凸块永久地固定在衬底上并与衬底电连接，该焊料凸块通过回焊工艺由焊料凸块形成。 在该方法中不需要使用传统的拾取和放置装置。 该方法可以应用于发光二极管，RFID标签，微集成电路或其他类型的微结构。

公开(公告)号：US07046328B2

公开(公告)日：2006-05-16

申请号：US09932505

申请日：2001-08-17

申请人： Jeffrey Jay Jacobsen ,  John Stephen Smith ,  Mark A. Hadley

发明人： Jeffrey Jay Jacobsen ,  John Stephen Smith ,  Mark A. Hadley

IPC分类号： G02F1/1333 ,  G02F1/136 ,  G02F1/13 ,  H01L21/44

CPC分类号： G02F1/133305 ,  G02F1/1362 ,  H01L21/2007 ,  H01L24/95 ,  H01L24/97 ,  H01L27/1214 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2251/5338 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/15153 ,  H01L2924/00

摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming a flexible active matrix display along a length of flexible substrate. Another embodiment of the invention relates to forming multiple flexible displays along a continuous flexible substrate. Another embodiment of the invention relates to forming a flexible display along a flexible reflective substrate. Another embodiment of the invention relates to using FSA generally with a flexible web process material. Another embodiment of the invention relates to using FSA and a deterministic method such as “pick and place” to place objects onto a rigid substrate or onto a web process material. Another embodiment of the invention relates to using web processing to deposit and/or pattern display material through an in-line process.

摘要翻译： 要求保护用于形成显示器的装置和方法。 本发明的一个实施例涉及沿柔性基底的长度形成柔性有源矩阵显示器。 本发明的另一个实施例涉及沿着连续柔性基底形成多个柔性显示器。 本发明的另一个实施例涉及沿柔性反射衬底形成柔性显示器。 本发明的另一个实施方案涉及一般使用FSA柔性网状物料的FSA。 本发明的另一个实施例涉及使用FSA和诸如“拾取和放置”的确定性方法将物体放置在刚性基底或网状物质材料上。 本发明的另一个实施例涉及使用网络处理来通过在线处理来沉积和/或图案显示材料。

公开(公告)号：US06946322B2

公开(公告)日：2005-09-20

申请号：US10627949

申请日：2003-07-25

申请人： Peter D. Brewer

发明人： Peter D. Brewer

IPC分类号： H01L21/68 ,  H01L21/98 ,  H01L25/065 ,  H01L21/44

CPC分类号： H01L21/6835 ,  H01L24/95 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/95085 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/15153

摘要： A method for fabricating arbitrarily configured arrays of devices or circuit modules onto a host circuit substrate by using an assembly technique that temporarily locates and aligns the devices or circuit modules in positions to be received by the host circuit substrate. The method generally comprises four distinct steps. The first step comprises fabricating the individual devices and circuit modules in a manner that facilitates capture of the individual devices and/or modules by an assembly template. The second step comprises patterning the assembly template to provide receptacles or patterned coatings that capture the devices and modules in the appropriate orientation. The third step comprises the population of the assembly template with the devices and circuit modules. The fourth step comprises delivery of the device and circuit modules to the host circuit substrate.

摘要翻译： 一种用于通过使用临时将设备或电路模块定位并对准由主电路基板接收的位置的组装技术将任意配置的器件或电路模块阵列制造到主电路基板上的方法。 该方法通常包括四个不同的步骤。 第一步包括以便于通过组装模板捕获各个装置和/或模块的方式制造各个装置和电路模块。 第二步包括图案化组件模板以提供以适当取向捕获装置和模块的插座或图案化涂层。 第三步包括具有设备和电路模块的装配模板的总体。 第四步包括将设备和电路模块传送到主电路基板。

公开(公告)号：US06867983B2

公开(公告)日：2005-03-15

申请号：US10214066

申请日：2002-08-07

申请人： Peikang Liu ,  Scott Wayne Ferguson ,  Dave N. Edwards ,  Yukihiko Sasaki

发明人： Peikang Liu ,  Scott Wayne Ferguson ,  Dave N. Edwards ,  Yukihiko Sasaki

IPC分类号： G06K19/077 ,  H01L23/538 ,  H05K1/18 ,  H05K3/18 ,  H05K3/32 ,  H05K5/00 ,  B41M3/12 ,  H01L23/495

CPC分类号： H05K3/32 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/95 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H05K1/183 ,  H05K3/182 ,  H05K2203/0709 ,  H05K2203/1469 ,  Y10S428/901 ,  H01L2924/00

摘要： A device, such as a radio frequency identification (RFID) inlay structure for an RFID tag or label, includes a microstructure element, with leads coupling the microstructure element to other electrical or electronic components of the device. The leads may be electroless-plated leads, and may contact connectors of the microstructure element without the need for an intervening planarization layer.

摘要翻译： 用于RFID标签或标签的诸如射频识别（RFID）嵌体结构的装置包括微结构元件，其中引线将微结构元件耦合到器件的其它电子或电子部件。 引线可以是无电镀引线，并且可以接触微结构元件的连接器，而不需要中间的平坦化层。

公开(公告)号：US06844673B1

公开(公告)日：2005-01-18

申请号：US10020385

申请日：2001-12-06

申请人： Jan Bernkopf

发明人： Jan Bernkopf

IPC分类号： H01J1/62 ,  H01J63/04 ,  H01L27/32

CPC分类号： H01L27/3253 ,  H01L24/95 ,  H01L27/3255 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/00

摘要： Methods and apparatuses for fabricating an electroluminescent display structure. A method including coupling a frontplane to a backplane wherein a frontplane top surface laminates to a backplane top surface. The frontplane and the backplane are fabricated separately. A first electrode layer which is transparent is disposed over the frontplane. A display medium which produces electro-optical effects upon a voltage application is disposed over the first electrode. A second electrode layer which is pattered is disposed over the display medium. The second electrode layer includes a plurality of connecting regions. The backplane is electrically active to provide driving signals for the display medium wherein the backplane includes a plurality of output pads to match the plurality of connecting regions.

摘要翻译： 用于制造电致发光显示结构的方法和装置。 一种包括将前平面耦合到背板的方法，其中前平面顶表面层叠到背板顶表面。 前面板和背板是单独制造的。 透明的第一电极层设置在前平面上。 在施加电压时产生电光效应的显示介质设置在第一电极上。 图示的第二电极层设置在显示介质上。 第二电极层包括多个连接区域。 背板是电活动的以提供用于显示介质的驱动信号，其中背板包括多个输出焊盘以匹配多个连接区域。

公开(公告)号：US06723576B2

公开(公告)日：2004-04-20

申请号：US09896818

申请日：2001-06-29

申请人： Ryoichi Nozawa ,  Mutsumi Kimura ,  Satoshi Inoue

发明人： Ryoichi Nozawa ,  Mutsumi Kimura ,  Satoshi Inoue

IPC分类号： H01L2100

CPC分类号： H01L27/3255 ,  H01L24/95 ,  H01L27/3276 ,  H01L51/0004 ,  H01L51/56 ,  H01L2224/95092 ,  H01L2224/95136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/15153 ,  H01L2924/00

摘要： An active-matrix type organic EL display which uses transistors with less variation of characteristics (transistors in which active layer is a single crystal semiconductor) is made on a large area of a transparent base board at low cost. Plural unit of fine construction are formed on a silicon wafer in rows. This unit includes a driving element (switching transistor 34, driving transistor 37, capacity 36) of organic EL element (pixel) 35. Unit block 39 is produced by dividing this silicon wafer. This unit block 39 is disposed at a predetermined position of glass base board 52 (display base board). The driving element of each pixel 35 is connected by signal line 31, power supply line 32, scanning line 33, and capacity line 38.

摘要翻译： 在透明基板的大面积上以低成本制造使用特性差的晶体管（有源层为单晶半导体的晶体管）的有源矩阵型有机EL显示器。 在硅晶片上形成多个精细结构的单元。 该单元包括有机EL元件（像素）35的驱动元件（开关晶体管34，驱动晶体管37，电容36）。单元块39通过分割该硅晶片而制造。 该单元块39设置在玻璃基板52（显示基板）的预定位置。 每个像素35的驱动元件通过信号线31，电源线32，扫描线33和电容线38连接。

公开(公告)号：US06696785B2

公开(公告)日：2004-02-24

申请号：US09900520

申请日：2001-07-06

申请人： Tatsuya Shimoda ,  Satoru Miyashita ,  Satoshi Inoue

发明人： Tatsuya Shimoda ,  Satoru Miyashita ,  Satoshi Inoue

IPC分类号： H01J162

CPC分类号： H05B33/10 ,  H01L27/3255 ,  H01L51/56 ,  H01L2224/95136 ,  H01L2224/95146 ,  H01L2227/323 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H05B33/12

摘要： An object is to efficiently manufacture an organic EL display which uses microstructures. Microstructures are inlaid in a plurality of concavities in the surface of a nonconductive multi-holed substrate. On the multi-holed substrate, besides the concavities there is formed a plurality of through holes. The surface of the multi-holed substrate is covered with a nonconductive protective film. A transparent substrate on the surface of which is formed beforehand a transparent electrode layer is prepared, and the transparent substrate is attached to the rear face side of the multi-holed substrate. Contact holes are formed after which a luminous layer is formed inside the through holes by an ink jet method. The surface of the multi-holed substrate including the inside of the contact holes is covered with a metallic layer such as aluminum, and the metallic layer is then patterned, and negative electrodes and wiring are formed.

摘要翻译： 目的是有效地制造使用微结构的有机EL显示器。 微结构镶嵌在非导电多孔基板的表面中的多个凹部中。 在多孔基板上，除了凹部之外，还形成有多个通孔。 多孔基板的表面被非导电保护膜覆盖。 准备表面上由透明电极层形成的透明基板，将透明基板安装在多孔基板的背面侧。 形成接触孔，之后通过喷墨法在通孔内部形成发光层。 包括接触孔内部的多孔基板的表面被诸如铝的金属层覆盖，然后对金属层进行图案化，形成负电极和布线。

公开(公告)号：US20040026754A1

公开(公告)日：2004-02-12

申请号：US10214066

申请日：2002-08-07

发明人： Peikang Liu ,  Scott Wayne Ferguson ,  Dave N. Edwards ,  Yukihiko Sasaki

IPC分类号： H01L027/14

CPC分类号： H05K3/32 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/95 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H05K1/183 ,  H05K3/182 ,  H05K2203/0709 ,  H05K2203/1469 ,  Y10S428/901 ,  H01L2924/00

摘要： A device, such as a radio frequency identification (RFID) inlay structure for an RFID tag or label, includes a microstructure element, with leads coupling the microstructure element to other electrical or electronic components of the device. The leads may be electroless-plated leads, and may contact connectors of the microstructure element without the need for an intervening planarization layer.

摘要翻译： 用于RFID标签或标签的诸如射频识别（RFID）嵌体结构的装置包括微结构元件，其中引线将微结构元件耦合到器件的其它电子或电子部件。 引线可以是无电镀引线，并且可以接触微结构元件的连接器，而不需要中间的平坦化层。