Abstract:
A magnetic shield is presented. The shield may be used to protect a microelectronic device from stray magnetic fields. The shield includes at least two layers. A first layer includes a magnetic material that may be used to block DC magnetic fields. A second layer includes a conductive material that may be used to block AC magnetic fields. Depending on the type of material that the first and second layers include, a third layer may be inserted in between the first and second layers. The third layer may include a non-conductive material that may be used to ensure that separate eddy current regions form in the first and second layers.
Abstract:
A nonvolatile memory and a method of operating the memory are described. The memory includes memory cells that may each include a magnetoresistive memory bit. The memory includes toggle circuitry for altering the resistive states of memory cells within the memory without changing the logical states of the memory cells. The memory may be toggled to balance resistive decay associated with operating a memory bit under certain conditions or in extreme environments.
Abstract:
The semiconductor industry seeks to replace traditional volatile memory devices with improved non-volatile memory devices. The increased demand for a significantly advanced, efficient, and non-volatile data retention technique has driven the development of integrated Giant-Magneto-resistive (GMR) structures. The present teachings relates to integrated latch memory and logic devices and, in particular, concerns a spin dependent logic device that may be integrated with conventional semiconductor-based logic devices to construct high-speed non-volatile static random access memory (SRAM) cells.
Abstract:
In a method of fabricating a giant magnetoresistive (GMR) device a plurality of magnetoresistive device layers is deposited on a first silicon nitride layer formed on a silicon oxide layer. An etch stop is formed on the magnetoresistive device layers, and a second layer of silicon nitride is formed on the etch stop. The magnetoresistive device layers are patterned to define a plurality of magnetic bits having sidewalls. The second silicon nitride layer is patterned to define electrical contact portions on the etch stop in each magnetic bit. The sidewalls of the magnetic bits are covered with a photoresist layer. A reactive ion etch (RIE) process is used to etch into the first silicon nitride and silicon oxide layers to expose electrical contacts. The photoresist layer and silicon nitride layers protect the magnetoresistive layers from exposure to oxygen during the etching into the silicon oxide layer.
Abstract:
The semiconductor industry seeks to replace traditional volatile memory devices with improved non-volatile memory devices. The increased demand for a significantly advanced, efficient, and non-volatile data retention technique has driven the development of integrated Giant-Magneto-resistive (GMR) structures. The present teachings relates to integrated latch memory and logic devices and, in particular, concerns a spin dependent logic device that may be integrated with conventional semiconductor-based logic devices to construct high-speed non-volatile static random access memory (SRAM) cells.
Abstract:
A nonvolatile memory and a method of operating the memory are described. The memory includes memory cells that may each include a magnetoresistive memory bit. The memory includes toggle circuitry for altering the resistive states of memory cells within the memory without changing the logical states of the memory cells. The memory may be toggled to balance resistive decay associated with operating a memory bit under certain conditions or in extreme environments.
Abstract:
A magnetoresistive apparatus and method of operation with improved switching characteristics is provided. Switching of a magnetic direction of a magnetic layer of a magnetoresistive bit is promoted by parallel rotation of local magnetic direction of ends of the bit toward alignment with a hard-axis of the bit. Thus, an embodiment provides for expanded hard-axis magnetic volume of the bit ends to support hard-axis magnetization through bit shape alteration or doping, for example. A method provides for applying a hard-axis magnetic field to the bit ends for initiating switching and applying an easy-axis magnetic field for completing switching.
Abstract:
In a method of fabricating a giant magnetoresistive (GMR) device a plurality of magnetoresistive device layers is deposited on a first silicon nitride layer formed on a silicon oxide layer. An etch stop is formed on the magnetoresistive device layers, and a second layer of silicon nitride is formed on the etch stop. The magnetoresistive device layers are patterned to define a plurality of magnetic bits having sidewalls. The second silicon nitride layer is patterned to define electrical contact portions on the etch stop in each magnetic bit. The sidewalls of the magnetic bits are covered with a photoresist layer. A reactive ion etch (RIE) process is used to etch into the first silicon nitride and silicon oxide layers to expose electrical contacts. The photoresist layer and silicon nitride layers protect the magnetoresistive layers from exposure to oxygen during the etching into the silicon oxide layer.
Abstract:
A bias-adjusted giant magnetoresistive (GMR) device includes a ferromagnetic reference layer, which has a magnetization that remains relatively fixed when a range of magnetic fields is applied, and a ferromagnetic switching layer, which has a magnetization that can be changed by applying a relatively small magnetic field. In MRAM applications, the switching layer stores data in the form of the particular orientation of its magnetization relative to the magnetization of the reference layer. At least one of the reference and switching layers is split into at least two ferromagnetic layers separated by one or more layers of a nonmagnetic conductor, such that the hysteresis curve of resistance versus applied magnetic field is substantially symmetric about zero applied magnetic field.
Abstract:
The invention relates to improving the switching reliability of a magnetic memory cell in a magnetic random access memory (MRAM). Embodiments of the invention add an antiferromagnet to a magnetic memory cell. An antiferromagnetic layer can be formed adjacent to a soft layer in the MRAM on a side of the soft layer that is opposite to a hard layer of the MRAM. One embodiment further includes an additional interlayer of non-antiferromagnetic material between the antiferromagnetic layer and the soft layer.