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    OPTICAL ASSEMBLY INCLUDING PASSIVE OPTICAL ELEMENTS HAVING ALIGNMENT FEATURES
    45.
    发明申请
    OPTICAL ASSEMBLY INCLUDING PASSIVE OPTICAL ELEMENTS HAVING ALIGNMENT FEATURES 审中-公开
    光学组件，包括具有对准特征的被动光学元件

    公开(公告)号：US20160170166A1

    公开(公告)日：2016-06-16

    申请号：US14970795

    申请日：2015-12-16

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Jukka Alasirniö ,  Tobias Senn ,  Markus Rossi ,  Hartmut Rudmann ,  Ohad Meitav ,  Moshe Doron ,  Kai Engelhardt

    IPC: G02B7/00 ,  G02B7/02

    CPC classification number: G02B7/003 ,  G02B7/021 ,  G02B7/022

    Abstract: Optical assemblies include a stack of optical elements each of which has one or more alignment features. Each alignment feature traces a respective curve along a surface of one of the optical elements. The alignment feature(s) of one optical element fit within the alignment feature(s) of the other. In some cases, the alignment features can help establish more precise lateral alignment of the optical elements.

    Abstract translation: 光学组件包括一组光学元件，每个光学元件具有一个或多个对准特征。 每个对准特征沿着一个光学元件的表面跟踪相应的曲线。 一个光学元件的对准特征适合于另一个的对准特征。 在一些情况下，对准特征可以帮助建立光学元件的更精确的侧向对准。

    OPTICAL IMAGING APPARATUS, IN PARTICULAR FOR COMPUTATIONAL IMAGING, HAVING FURTHER FUNCTIONALITY
    46.
    发明申请
    OPTICAL IMAGING APPARATUS, IN PARTICULAR FOR COMPUTATIONAL IMAGING, HAVING FURTHER FUNCTIONALITY 有权
    光学成像装置，特别是用于计算成像，具有进一步的功能

    公开(公告)号：US20160006913A1

    公开(公告)日：2016-01-07

    申请号：US14768989

    申请日：2014-02-07

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： Ville Kettunen ,  Markus Rossi

    IPC: H04N5/225 ,  H04N5/369 ,  H01L27/146 ,  H04N9/04

    CPC classification number: H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14645 ,  H01L27/14685 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2257 ,  H04N5/2258 ,  H04N5/369 ,  H04N9/045 ,  H01L2924/00

    Abstract: The optical apparatus comprises a semiconductor substrate and at least one optics substrate. The semiconductor substrate comprises a first active region establishing a first image sensor, said semiconductor substrate further comprising an additional active region, different from said first active region. The additional active region establishes or is part of an additional sensor which is not an image sensor. And the at least one optics substrate comprises for said first image sensor at least one lens element for imaging light impinging on the optical apparatus from a front side onto the first image sensor. Preferably, at least two or rather at least three image sensors are provided, such that a computational camera can be realized. The additional sensor may comprise, e.g., an ambient light sensor and/or a proximity sensor.

    Abstract translation: 光学装置包括半导体衬底和至少一个光学衬底。 半导体衬底包括建立第一图像传感器的第一有源区，所述半导体衬底还包括不同于所述第一有源区的附加有源区。 额外的有源区域建立或者是不是图像传感器的附加传感器的一部分。 并且所述至少一个光学基板包括用于所述第一图像传感器的至少一个透镜元件，用于将入射到所述光学设备上的光从前侧成像到所述第一图像传感器上。 优选地，提供至少两个或至少三个图像传感器，使得可以实现计算摄像机。 附加传感器可以包括例如环境光传感器和/或接近传感器。

    Sensor Module and Method of Manufacturing the Same
    47.
    发明申请
    Sensor Module and Method of Manufacturing the Same 有权
    传感器模块及其制造方法

    公开(公告)号：US20150179827A1

    公开(公告)日：2015-06-25

    申请号：US14413890

    申请日：2013-07-09

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Markus Rossi

    IPC: H01L31/0232 ,  H01L27/144

    CPC classification number: G01D5/30 ,  G01L9/0077 ,  G01S7/4813 ,  G01S17/88 ,  H01L27/144 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/173 ,  H01L31/1876 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The opto-electronic module (1) comprises a first substrate member (P); a third substrate member (B); a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a′;5b;5b′); a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); a light detecting element (D) arranged on and electrically connected to said first substrate member (P); a light emission element (E) arranged on and electrically connected to said first substrate member (P); and a sensing element (8) comprised in or arranged at said third substrate member (B). Such modules (1) are particularly suitable as sensor modules for sensing a magnitude such as a pressure.

    Abstract translation: 光电模块（1）包括第一衬底构件（P）; 第三基板部件（B）; 布置在所述第一和第三基板构件之间并包括一个或多个透光部分（ta，tb）的第二基板构件（O），所述透光部分（ta，tb）通过所述透光部分，所述至少一个透明部分至少包括第一光学结构 '; 5b; 5b'）; 包括在所述第一衬底构件（P）中或包含在所述第二衬底构件（O）中或与之不同的第一间隔构件（S1），其包括至少一个开口（4a; 4b）; 包括在所述第二衬底构件（O）中或包括在所述第三衬底构件（B）中或与之不同的第二间隔构件（S2），其包括至少一个开口（3）; 布置在电连接到所述第一衬底构件（P）上的光检测元件（D）; 布置在电连接到所述第一衬底构件（P）上的发光元件（E）; 以及包含在所述第三衬底构件（B）中或布置在所述第三衬底构件 这种模块（1）特别适用于用于感测诸如压力的量值的传感器模块。

    Opto-Electronic Module for Emitting Light of Variable Intensity Distribution
    48.
    发明申请
    Opto-Electronic Module for Emitting Light of Variable Intensity Distribution 审中-公开
    用于发射可变强度分布的光电模块

    公开(公告)号：US20150155270A1

    公开(公告)日：2015-06-04

    申请号：US14413891

    申请日：2013-07-09

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Markus Rossi

    IPC: H01L25/075 ,  H01L25/00 ,  F21V14/04 ,  F21V14/06 ,  F21V5/04 ,  F21V7/00

    Abstract: The opto-electronic module (1) comprises—a first substrate member (P); —a second substrate member (O); —a first spacer member (S) comprised in said first substrate member or comprised in said second substrate member or distinct from and located between these, which comprises at least one opening (4); —a light emission element (E) arranged on said first substrate member; —a first passive optical component (8); at least one of said first and second substrate members comprising one or more transparent portions (t) through which light can pass, said first passive optical component (8) being comprised in or distinct from said one or more transparent portions, and wherein said first passive optical component has adjustable optical properties. Such modules (1) are well mass-producible in high precision and can be used in photo cameras, e.g., as flashes.

    Abstract translation: 光电模块（1）包括：第一衬底构件（P）; - 第二衬底构件（O）; - 包括在所述第一衬底构件中或包含在所述第二衬底构件中的第一间隔构件（S）或与所述第一衬底构件不同且位于所述第一衬底构件中的第一间隔构件（S），其包括至少一个开口（4）; - 配置在所述第一基板部件上的发光元件（E） - 第一无源光学部件（8）; 所述第一和第二衬底构件中的至少一个包括一个或多个透光部分，光可通过该透明部分，所述第一无源光学部件包括在或不同于所述一个或多个透明部分，并且其中所述第一 无源光学元件具有可调光学特性。 这样的模块（1）可以高精度地良好地批量生产，并且可以用于照相机，例如作为闪光。

    Optical Devices and Opto-electronic Modules and Methods for Manufacturing The Same
    49.
    发明申请
    Optical Devices and Opto-electronic Modules and Methods for Manufacturing The Same 有权
    光器件和光电模块及其制造方法

    公开(公告)号：US20140339664A1

    公开(公告)日：2014-11-20

    申请号：US14366770

    申请日：2012-12-18

    Applicant: Heptagon Micro Optics Pte. Ltd. ,  Heptagon Oy

    Inventor： Markus Rossi ,  Hartmut Rudmann ,  Stephan Heimgartner ,  Alexander Bietsch ,  Robert Lenart

    IPC: H01L27/146

    CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L27/14818 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The optical device comprises a first substrate (SI) comprising at least one optical structure (1) comprising a main portion (2) and a surrounding portion (3) at least partially surrounding said main portion. The device furthermore comprises non-transparent material (5, 5a, 5b) applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

    Abstract translation: 光学装置包括包括至少一个光学结构（1）的第一基板（S1），该至少一个光学结构（1）包括主要部分（2）和至少部分地围绕所述主要部分的环绕部分（3）。 该装置还包括施加到所述周围部分上的不透明材料（5,5a，5b）。 所述光电模块包括包含在所述第一衬底中的多个这些光学器件。 制造光学器件的方法包括以下步骤：a）提供包括至少一个光学结构的第一衬底，该至少一个光学结构包括至少部分地围绕所述主要部分的主要部分和环绕部分; 以及b）将不透明材料施加到至少所述周围部分上。 所述不透明材料存在于仍在最终光学装置中的至少所述周围部分上。

    METHOD FOR WAFER-LEVEL MANUFACTURING OF OBJECTS AND CORRESPONDING SEMI-FINISHED PRODUCTS
    50.
    发明申请
    METHOD FOR WAFER-LEVEL MANUFACTURING OF OBJECTS AND CORRESPONDING SEMI-FINISHED PRODUCTS 审中-公开
    用于水平制造物体和相关半成品的方法

    公开(公告)号：US20140295122A1

    公开(公告)日：2014-10-02

    申请号：US14346804

    申请日：2012-10-01

    Applicant: Heptagon Micro Optics Pte. Ltd

    Inventor： Peter Riel ,  Hartmut Rudmann ,  Markus Rossi

    IPC: B81B7/04 ,  B81C1/00

    CPC classification number: B81B7/04 ,  B81C1/00904 ,  H01L27/14618 ,  H01L27/14685 ,  H01L27/14696 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T428/18 ,  H01L2924/00

    Abstract: The method for manufacturing an object comprises the steps of (a) providing a wafer comprising a multitude of semi-finished objects; (b) separating said wafer into parts referred to as sub- wafers, at least one of said sub-wafers comprising a plurality of said semi-finished objects; (c) processing at least a portion of said plurality of semi-finished objects by subjecting said at least one sub-wafer to at least one processing step; and preferably also the step of (d) separating said at least one sub-wafer into a plurality of parts.

    Abstract translation: 制造物体的方法包括以下步骤：（a）提供包括多个半成品的晶片; （b）将所述晶片分离成称为子晶片的部件，所述子晶片中的至少一个包括多个所述半成品; （c）通过对所述至少一个子晶片进行至少一个处理步骤来处理所述多个半成品的至少一部分; 并且还优选地（d）将所述至少一个子晶片分成多个部分的步骤。

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