公开(公告)号：US20020070723A1

公开(公告)日：2002-06-13

申请号：US10001412

申请日：2001-10-25

Inventor： Patrick C. Herbert ,  Jeffrey R. Annis ,  Jun J. Yao ,  Winfred L. Morris ,  Henric Larsson ,  Richard D. Harris ,  Robert J. Kretschmann

IPC: G01R017/06

CPC classification number: H03H9/462 ,  B81B3/0072 ,  B81B2201/032 ,  B81B2203/0109 ,  B81B2203/051

Abstract: In a MEMS device employing a beam supported by transverse arms, potential bowing of the transverse arms caused by fabrication processes, temperature or local self-heating from resistive losses is accommodated by flexible terminations of the transverse arms. Alternatively, this bowing is controlled so as to provide selective biasing to the beam or mechanical advantage in the sensing of beam motion.

Abstract translation: 在使用由横臂支撑的光束的MEMS装置中，通过制造工艺引起的横向臂的电位弯曲，来自电阻损耗的温度或局部自加热由横向臂的柔性端接来适应。 或者，该弯曲被控制以便在光束运动的感测中提供对光束的选择偏置或机械优点。

公开(公告)号：US20020018334A1

公开(公告)日：2002-02-14

申请号：US09822128

申请日：2001-03-30

Inventor： Edward A. Hill ,  Ramaswamy Mahadevan

IPC: H01G005/01

CPC classification number: H01H1/0036 ,  B81B3/001 ,  B81B2201/032 ,  B81B2203/0118 ,  B81B2203/0307 ,  F03G7/06 ,  H01G5/16 ,  H01G5/18 ,  H01H59/0009 ,  H01H61/02 ,  H01H2059/0063 ,  H01H2059/0072 ,  H01H2059/0081 ,  H01H2061/006

Abstract: MEMS devices include a substrate, an anchor attached to the substrate, and a multilayer member attached to the anchor and spaced apart from the substrate. The multilayer member can have a first portion that is remote from the anchor and that curls away from the substrate and a second portion that is adjacent the anchor that contacts the substrate. Related methods are also disclosed.

Abstract translation: MEMS器件包括衬底，附接到衬底的锚固体和附接到锚固体并与衬底间隔开的多层构件。 所述多层构件可以具有远离所述锚固体并且远离所述基底的第一部分和邻近所述锚固体接触所述基底的第二部分。 还公开了相关方法。

公开(公告)号：US06327855B1

公开(公告)日：2001-12-11

申请号：US09498100

申请日：2000-02-04

Applicant: Edward A. Hill ,  Vijayakumar Rudrappa Dhuler

Inventor： Edward A. Hill ,  Vijayakumar Rudrappa Dhuler

IPC: F01B2910

CPC classification number: B81B3/004 ,  B81B2201/032 ,  B81B2203/0109 ,  B81B2203/033 ,  B81B2203/058 ,  G02B7/1821 ,  G02B26/0816 ,  H01H1/0036 ,  H01H61/00 ,  H01H2001/0063 ,  H01H2061/006

Abstract: A micromechanical system can include a substrate, an actuator, and an actuated element. In particular, the actuator can include a serpentine arrangement of alternating actuating and opposing segments anchored at a first end thereof to the substrate wherein the actuating segments deflect in response to actuation thereof so that a second end of the serpentine arrangement moves relative to the substrate upon deflection of the actuating segments. The actuated element is attached to the second end of the serpentine arrangement so that the actuated element moves relative to the substrate upon deflection of the actuating segments. Related methods and actuators are also discussed.

Abstract translation: 微机械系统可以包括基板，致动器和致动元件。 特别地，致动器可以包括蛇形结构，其交替的致动和相对的段在其第一端锚定到衬底，其中致动段响应于其致动而偏转，使得蛇形结构的第二端相对于衬底移动 致动段的偏转。 致动元件附接到蛇形结构的第二端，使得致动元件在致动段偏转时相对于基板移动。 还讨论了相关方法和执行器。

公开(公告)号：US12037239B2

公开(公告)日：2024-07-16

申请号：US17206116

申请日：2021-03-18

Applicant: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.

Inventor： You Qian ,  Humberto Campanella-Pineda ,  Rakesh Kumar

IPC: B81C1/00 ,  B06B1/06 ,  B81B3/00 ,  H10N30/06 ,  H10N30/074 ,  H10N30/093 ,  H10N30/87 ,  H10N39/00 ,  H10N30/853 ,  H10N30/88

CPC classification number: B81C1/00246 ,  B06B1/06 ,  B81B3/0021 ,  H10N30/06 ,  H10N30/074 ,  H10N30/875 ,  H10N39/00 ,  B81B2201/0271 ,  B81B2201/032 ,  B81B2207/015 ,  B81B2207/096 ,  B81B2207/115 ,  B81C2201/0105 ,  B81C2203/0735 ,  B81C2203/0771 ,  H10N30/093 ,  H10N30/853 ,  H10N30/883

Abstract: A method of forming a monolithic integrated PMUT and CMOS with a coplanar elastic, sealing, and passivation layer in a single step without bonding and the resulting device are provided. Embodiments include providing a CMOS wafer with a metal layer; forming a dielectric over the CMOS; forming a sacrificial structure in a portion of the dielectric; forming a bottom electrode; forming a piezoelectric layer over the CMOS; forming a top electrode over portions of the bottom electrode and piezoelectric layer; forming a via through the top electrode down to the bottom electrode and a second via down to the metal layer through the top electrode; forming a second metal layer over and along sidewalls of the first and second via; removing the sacrificial structure, an open cavity formed; and forming a dielectric layer over a portion of the CMOS, the open cavity sealed and an elastic layer and passivation formed.

公开(公告)号：US20240195005A1

公开(公告)日：2024-06-13

申请号：US18360807

申请日：2023-07-28

Applicant: SK On Co., Ltd.

Inventor： John Cronin ,  Yong Bok MOON ,  Soo Min PARK ,  Hyung Ju PAIK ,  Hae Ryong JEON

IPC: H01M50/308 ,  B81B5/00 ,  H01M10/48

CPC classification number: H01M50/308 ,  B81B5/00 ,  H01M10/48 ,  B81B2201/032

Abstract: A battery cell includes a case accommodating an electrode assembly, a cap plate covering the case, an electrode terminal disposed on the cap plate and electrically connected to the electrode assembly, and a venting part including an active venting device configure to be opened to discharge gas from inside the case according to an electrical signal generated under a preset condition.

公开(公告)号：US11879784B2

公开(公告)日：2024-01-23

申请号：US17250852

申请日：2019-09-13

Applicant: Hahn-Schickard-Gesellschaft für angewandte Forschung e. V.

Inventor： Alfons Dehé ,  Achim Bittner ,  Daniel Biesinger

IPC: G01N21/17 ,  G01J5/08 ,  G01J3/10 ,  G01N21/3504 ,  B81B7/02

CPC classification number: G01J5/0896 ,  B81B7/02 ,  G01J3/108 ,  G01N21/1702 ,  G01N21/3504 ,  B81B2201/032 ,  B81B2201/033 ,  H05B2203/032

Abstract: The invention relates to a modulatable infrared emitter comprising a MEMS heating element and an actuator, wherein the actuator triggers shape and/or structure changes of the MEMS heating element. Said change in shape and/or structure of the MEMS heating element may vary the ratio of the emitting area to the total area, thereby producing a change in intensity of the emitted infrared beam. The invention further relates to a manufacturing method for the infrared emitter, a method for modulated emission of infrared radiation using the infrared emitter, and preferred uses of the infrared emitter. In further preferred aspects the invention relates to a system comprising the infrared emitter and a control device for regulating the actuator.

公开(公告)号：US20180117910A1

公开(公告)日：2018-05-03

申请号：US15800904

申请日：2017-11-01

Applicant: ROHM Co., LTD.

Inventor： Nobufumi MATSUO

IPC: B41J2/14 ,  B81C1/00 ,  B81B1/00 ,  B41J2/16

CPC classification number: B41J2/1433 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2/1642 ,  B41J2002/14491 ,  B81B1/004 ,  B81B2201/032 ,  B81B2201/052 ,  B81C1/00087 ,  B81C3/001 ,  B81C2203/032

Abstract: There is provided a nozzle substrate including a nozzle hole penetrating in a thickness direction. The nozzle substrate includes a main substrate including a first surface and a second surface, an oxidation film formed on the second surface of the main substrate, and a water repellent film formed on a surface at an opposite side to the main substrate side of the oxidation film. The nozzle hole includes a first through hole penetrating the main substrate in a thickness direction, a second through hole penetrating the oxidation film and being connected to the first through hole, and a third through hole penetrating the water repellent film and being connected to the second through hole. An inner circumference surface of the second through hole and an inner circumference surface of the third through hole are approximately flush.

公开(公告)号：US09864189B2

公开(公告)日：2018-01-09

申请号：US14330452

申请日：2014-07-14

Applicant: FUJIFILM Corporation

Inventor： Takayuki Naono

IPC: G02B26/08 ,  H01L41/187 ,  B81B7/00 ,  G02B26/10 ,  B81B7/02 ,  B81B3/00 ,  H01L41/09

CPC classification number: G02B26/0858 ,  B81B3/0043 ,  B81B7/008 ,  B81B7/02 ,  B81B2201/032 ,  B81B2201/042 ,  B81B2201/045 ,  B81B2203/04 ,  G02B26/105 ,  H01L41/0933 ,  H01L41/1876

Abstract: In a mirror drive device, a first and second actuator sections are arranged on both sides of a mirror supporting section that supports a mirror section so as to sandwich the mirror supporting section. Division of an upper and lower electrodes of each of the first and second actuator sections is performed correspondingly to stress distribution of principal stresses in a piezoelectric body in resonant mode vibration, and a piezoelectric body portion corresponding to positions of a first and third upper electrode sections, and a piezoelectric body portion corresponding to positions of a second and fourth upper electrode sections have stresses in opposite directions to each other. Division of the lower electrodes is performed similar to the upper electrodes, and drive voltages having the same phase can be respectively applied to the upper and lower electrode sections of the piezoelectric body portions that are different due to a division arrangement.

公开(公告)号：US20170041719A1

公开(公告)日：2017-02-09

申请号：US15305089

申请日：2014-08-26

Applicant: GOERTEK INC.

Inventor： Quanbo ZOU ,  Zhe WANG ,  Jifang TAO ,  Guanxun QIU

IPC: H04R19/02 ,  B81C1/00 ,  B81B7/00 ,  H04R31/00

CPC classification number: H04R19/02 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2201/032 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00158 ,  B81C2201/0197 ,  H04R7/06 ,  H04R19/013 ,  H04R31/00 ,  H04R31/003 ,  H04R2201/003 ,  H04R2307/025 ,  H04R2307/027

Abstract: The present invention provides a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate to obtain an insulating layer thereon and providing a metal layer on the insulating layer; providing a sacrificial layer on the metal layer; providing a first thermal bimorph layer on the sacrificial layer; providing a second thermal bimorph layer on the first thermal bimorph layer; providing a metal connecting layer at the positions on the metal layer where the sacrificial layer is not provided; forming corresponding back holes on the substrate and the insulating layer and releasing the sacrificial layer; forming the thermal bimorph diaphragm which is warped with the first thermal bimorph layer and the second thermal bimorph layer after the sacrificial layer is released.

Abstract translation: 本发明提供了一种制造具有热双压电晶片的热双压电晶片和MEMS扬声器的方法，其中该方法包括以下步骤：对衬底进行热氧化以在其上获得绝缘层并在绝缘层上提供金属层; 在所述金属层上提供牺牲层; 在牺牲层上提供第一热双压电晶片; 在第一热双压电晶片层上提供第二热双压电晶片层; 在不设置牺牲层的金属层上的位置提供金属连接层; 在基板和绝缘层上形成相应的后孔并释放牺牲层; 在牺牲层被释放之后形成与第一热双压电晶片层和第二热双压电晶片层翘曲的热双压电晶片。

公开(公告)号：US20160195893A1

公开(公告)日：2016-07-07

申请号：US14978965

申请日：2015-12-22

Applicant: Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Thierry HILT

IPC: G05G11/00 ,  H01L41/08

CPC classification number: G05G11/00 ,  B81B3/0051 ,  B81B2201/032 ,  B81B2201/037 ,  B81B2203/051 ,  H01H1/0036 ,  H01H2001/0078 ,  H01L41/08

Abstract: An actuator comprising two devices each comprising an out-of-plane deformable element, said deformable element comprising a first fixed end anchored on a substrate and a second free end relative to the substrate, said device also comprising means to guide the second free end in in-plane translation along a first direction, the first deformable element being capable of deforming out-of-plane through application of a stimulus so that the second free end draws close to the first fixed end following in-plane translational movement. The actuator also comprises an element mobile in rotation about an axis orthogonal to the plane and mechanically linked to the free ends of the deformable elements, and a translationally mobile element mechanically linked to the rotationally mobile element.

Abstract translation: 一种致动器，包括两个装置，每个装置均包括一个面外可变形元件，所述可变形元件包括锚定在基板上的第一固定端和相对于基板的第二自由端，所述装置还包括将第二自由端引导到 沿着第一方向的平面内平移，第一可变形元件能够通过施加刺激而在平面外变形，使得第二自由端在平面内平移运动之后接近第一固定端。 所述致动器还包括可围绕垂直于所述平面的轴线旋转的元件，并机械地连接到所述可变形元件的自由端，以及与所述旋转移动元件机械连接的平移移动元件。