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    Circuit layout structure and method
    32.
    发明授权
    Circuit layout structure and method 有权
    电路布局结构及方法

    公开(公告)号：US07509615B2

    公开(公告)日：2009-03-24

    申请号：US11281477

    申请日：2005-11-18

    Applicant: Chih-Chien Hung ,  Ming-Che Wu

    Inventor： Chih-Chien Hung ,  Ming-Che Wu

    IPC: G06F17/50 ,  H01L23/48 ,  H01L23/52

    CPC classification number: H05K1/0228 ,  H01L23/49838 ,  H01L23/5225 ,  H01L23/528 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09672 ,  H01L2924/00

    Abstract: A symmetrical circuit layout structure includes a number of signal wires, a ground wire and a dielectric layer. The signal wires include a first portion placed on a first plane and a second portion placed on a second plane. The ground wire includes a first portion placed above the first portion of the signal wires and adjacent to the second portion of the signal wires, and a second portion placed below the second portion of the signal wires and adjacent to the first portion of the signal wires. The dielectric layer is placed between the first plane and the second plane.

    Abstract translation: 对称电路布局结构包括多个信号线，接地线和电介质层。 信号线包括放置在第一平面上的第一部分和放置在第二平面上的第二部分。 接地线包括放置在信号线的第一部分上方并与信号线的第二部分相邻的第一部分，第二部分放置在信号线的第二部分的下方并与信号线的第一部分相邻 。 电介质层位于第一平面和第二平面之间。

    PALLET ASSEMBLY
    33.
    发明申请
    PALLET ASSEMBLY 审中-公开
    托盘总成

    公开(公告)号：US20070131148A1

    公开(公告)日：2007-06-14

    申请号：US11306003

    申请日：2005-12-14

    Applicant: Ming-Che Wu

    Inventor： Ming-Che Wu

    IPC: B65D19/38

    CPC classification number: B65D19/0018 ,  B65D2519/00034 ,  B65D2519/00069 ,  B65D2519/00104 ,  B65D2519/00268 ,  B65D2519/00273 ,  B65D2519/00288 ,  B65D2519/00293 ,  B65D2519/00308 ,  B65D2519/00318 ,  B65D2519/00323 ,  B65D2519/00338 ,  B65D2519/00363 ,  B65D2519/00572 ,  B65D2519/00756

    Abstract: A pallet assembly is composed of multiple pallet pieces and multiple wedging elements. Each pallet piece has four corners with four individual legs and multiples engaging holes defined on sides of the pallet piece. Each leg is rectangular in transversal cross-section and selectively has a mortise or a tenon to detachably and engages with other corresponding leg on an adjacent stacked pallet piece in the pallet assembly. Moreover, each wedging element is clamped between two adjacent juxtaposed pallet pieces to widen the pallet assembly. Thereby, the pallet assembly is versatile in changing sizes, easy to be assembled and disassembled, stable in use and convenient in storage.

    Abstract translation: 托盘组件由多个托盘件和多个楔形元件组成。 每个托盘件具有四个角落，四个独立的腿和多个接合孔的接合孔定位在托盘片的两侧。 每个腿在横截面中是矩形的，并且选择性地具有榫眼或榫头以可拆卸地并且与托盘组件中的相邻堆叠的托盘件上的其他对应的腿接合。 此外，每个楔形元件夹紧在两个相邻并置的托盘件之间，以加宽托盘组件。 因此，托盘组件在改变尺寸，易于组装和拆卸，使用稳定和存储方便方面是通用的。

    Method for rapidly identifying porcine estrogen receptor marker
    36.
    发明授权
    Method for rapidly identifying porcine estrogen receptor marker 失效
    快速鉴定猪雌激素受体标记物的方法

    公开(公告)号：US06846632B2

    公开(公告)日：2005-01-25

    申请号：US10100141

    申请日：2002-03-19

    Applicant: Hsiu-Luan Chang ,  Ren-Bao Liaw ,  Ming-Che Wu

    Inventor： Hsiu-Luan Chang ,  Ren-Bao Liaw ,  Ming-Che Wu

    IPC: C12Q1/68

    CPC classification number: C12Q1/6888 ,  C12Q2600/156

    Abstract: A method for rapidly identifying porcine estrogen receptor (ESR) marker comprises using published primers to amplify the target DNA fragment by polymerase chain reaction (PCR). The DNA fragment is cloned and then sequenced. The key positions of the sequence are modified to generate three primers which are used to amplify different DNA fragments with different genotypes by PCR to eliminate extra restriction cut reaction. A long one of the primers is to specifically amplify non-prolific allele, a short one of the primers is to specifically amplify prolific allele, and the remaining one is mutual and complimentary to the sequence. After PCR and electrophoresis, the sample with 90 bp band is identified as prolific genotype, the sample with 110 bp band is identified as non-prolific genotype, and the sample with 90 bp and 110 bp bands is identified as hetero-genotype.

    Abstract translation: 用于快速鉴定猪雌激素受体（ESR）标记的方法包括使用已发表的引物通过聚合酶链反应（PCR）扩增靶DNA片段。 克隆DNA片段，然后进行测序。 修改序列的关键位置以产生三个引物，用于通过PCR扩增不同基因型的不同DNA片段以消除额外的限制性切割反应。 一个长的引物是特异性扩增非产生的等位基因，一个简短的引物是特异性扩增多产等位基因，剩下的一个与序列相互互补。 PCR和电​​泳后，将具有90bp条带的样品鉴定为多产基因型，将具有110bp条带的样品鉴定为非多产性基因型，将具有90bp和110bp条带的样品鉴定为杂基因型。

    Chip level EMI shielding structure and manufacture method thereof
    38.
    发明授权
    Chip level EMI shielding structure and manufacture method thereof 有权
    芯片级EMI屏蔽结构及其制造方法

    公开(公告)号：US09287218B2

    公开(公告)日：2016-03-15

    申请号：US13053528

    申请日：2011-03-22

    Applicant: Ming-Che Wu

    Inventor： Ming-Che Wu

    IPC: H01L23/52 ,  H01L23/552 ,  H01L23/498 ,  H01L25/00 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

    CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/49805 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2224/81 ,  H01L2924/00

    Abstract: A chip level EMI shielding structure and manufacture method thereof are provided. The chip level EMI shielding structure includes a semiconductor substrate, at least one ground conductor line, a ground layer, and a connection structure. The ground conductor line is disposed on a first surface of the semiconductor substrate, and the ground layer is disposed on a second surface of the semiconductor substrate. The connection structure is formed on a lateral wall of the semiconductor substrate for connecting the ground conductor lines with the ground layer to form a shielding. With such arrangement, the chip level EMI shielding structure can reduce the chip size and the manufacturing cost.

    Abstract translation: 提供了一种芯片级EMI屏蔽结构及其制造方法。 芯片级EMI屏蔽结构包括半导体衬底，至少一个接地导体线，接地层和连接结构。 接地导体线设置在半导体衬底的第一表面上，并且接地层设置在半导体衬底的第二表面上。 连接结构形成在半导体衬底的侧壁上，用于将接地导体线与接地层连接以形成屏蔽。 通过这样的布置，芯片级EMI屏蔽结构可以减小芯片尺寸和制造成本。

    Tungsten-Filament-Like Light-Emitting Diode Lamp Structure
    39.
    发明申请
    Tungsten-Filament-Like Light-Emitting Diode Lamp Structure 审中-公开
    钨丝状发光二极管灯结构

    公开(公告)号：US20150184833A1

    公开(公告)日：2015-07-02

    申请号：US14141853

    申请日：2013-12-27

    Applicant: Ming-Che Wu

    Inventor： Ming-Che Wu

    IPC: F21V13/12 ,  F21K99/00 ,  F21V29/00

    CPC classification number: F21V13/12 ,  F21K9/232 ,  F21K9/60 ,  F21V7/0016 ,  F21V29/70 ,  F21Y2115/10

    Abstract: A tungsten-filament-like LED lamp structure includes a lamp shade, a heat dissipating frame, a lamp holder, a LED substrate, a LED light source and a light spreader assembly. The light spreader assembly includes a reflective device and a diverging element, wherein light rays transmitting through a light-permeable portion of the reflective device are diverged by the diverging element to generate frontward lighting, and reflective surfaces of the reflective device control the reflected light rays to generate sideward lighting and backward lighting and thus generate an optical field similar to that of a conventional tungsten filament lamp. Thus, the properties of energy saving, vibration resistant and long lifetime better than those of the conventional lamp can be achieved, and the invention can be directly applied to the conventional lamp structure to decrease the production and maintenance costs.

    Abstract translation: 钨丝状LED灯结构包括灯罩，散热框架，灯座，LED基板，LED光源和散光器组件。 散光器组件包括反射装置和发散元件，其中透射通过反射装置的透光部分的光线由发散元件发散以产生向前照明，并且反射装置的反射表面控制反射光线 产生侧向照明和向后照明，从而产生类似于常规钨丝灯的光场。 因此，可以实现节能，耐振动和长寿命的性能比常规灯的性能更好，并且本发明可以直接应用于传统的灯具结构，从而降低生产和维护成本。

    Multi-wavelength LED array package module and method for packaging the same
    40.
    发明申请
    Multi-wavelength LED array package module and method for packaging the same 失效
    多波长LED阵列封装模块及其封装方法相同

    公开(公告)号：US20090166647A1

    公开(公告)日：2009-07-02

    申请号：US12003689

    申请日：2007-12-31

    Applicant: Ming-Che Wu

    Inventor： Ming-Che Wu

    IPC: H01L33/00

    CPC classification number: B41J2/45

    Abstract: A method for packaging a multi-wavelength LED array package module includes: forming at least one concave groove on a drive IC structure; arranging a multi-wavelength LED array set in the at least one concave groove; solidifying a plurality of liquid conductive materials to form a plurality of conductive elements that is electrically connected between the drive IC structure and the multi-wavelength LED array set by a printing, a coating, a stamping, or a stencil printing process; arranging the drive IC structure on a PCB with at least one input/output pad; and then forming a conductive structure that is electrically connected between the drive IC structure and the at least one input/output pad.

    Abstract translation: 一种用于封装多波长LED阵列封装模块的方法包括：在驱动IC结构上形成至少一个凹槽; 布置在所述至少一个凹槽中的多波长LED阵列; 固化多个液体导电材料以形成电连接在驱动IC结构和通过印刷，涂层，冲压或模版印刷工艺组合的多波长LED阵列之间的多个导电元件; 将驱动IC结构布置在具有至少一个输入/输出垫的PCB上; 然后形成电连接在驱动IC结构和至少一个输入/输出焊盘之间的导电结构。

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