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    Optical Device
    31.
    发明申请
    Optical Device 有权

    公开(公告)号：US20170141241A1

    公开(公告)日：2017-05-18

    申请号：US15353397

    申请日：2016-11-16

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  Sonja Hanselmann

    IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/0216 ,  G01J1/02 ,  H01L31/12

    CPC classification number: G01J1/0295 ,  G01J1/0209 ,  G01J1/0214 ,  G01J1/0271 ,  H01L31/173

    Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

    Opto-Electronic Module
    34.
    发明申请
    Opto-Electronic Module 有权
    光电模块

    公开(公告)号：US20130264586A1

    公开(公告)日：2013-10-10

    申请号：US13827264

    申请日：2013-03-14

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhoefer ,  Simon Gubser

    IPC: H01L31/12

    CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

    Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

    Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，所述发光器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。

    Optical devices and methods of making same
    39.
    发明授权
    Optical devices and methods of making same 有权

    公开(公告)号：US10190908B2

    公开(公告)日：2019-01-29

    申请号：US15984278

    申请日：2018-05-18

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  Sonja Hanselmann

    IPC: H01L31/02 ,  G01J1/02 ,  H01L31/173

    Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

    Molded Circuit Substrates
    40.
    发明申请
    Molded Circuit Substrates 审中-公开

    公开(公告)号：US20180302990A1

    公开(公告)日：2018-10-18

    申请号：US15766943

    申请日：2016-10-07

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Bojan Tesanovic ,  Simon Gubser ,  Robert Lenart ,  Mario Cesana

    IPC: H05K3/00 ,  H05K1/02 ,  H01L27/146 ,  H01L33/48 ,  H01L33/58

    Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.

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