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公开(公告)号：US20210185831A1
公开(公告)日：2021-06-17
申请号：US17160909
申请日：2021-01-28
Applicant: Apple Inc.
Inventor： Maryam Rahimi , Meng Chi Lee , Wyeman Chen , Leilei Zhang , Jason P. Marsh , Lan Hoang , Yashar Abdollahian
Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.
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公开(公告)号：US10522475B2
公开(公告)日：2019-12-31
申请号：US16142137
申请日：2018-09-26
Applicant: Apple Inc.
Inventor： Meng Chi Lee , Shakti S. Chauhan , Flynn P. Carson , Jun Chung Hsu , Tha-An Lin
IPC: H01L23/552 , H01L23/528 , H01L23/31 , H01L23/522 , H01L21/48 , H01L21/56 , H01L23/00
Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.
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公开(公告)号：US10356903B1
公开(公告)日：2019-07-16
申请号：US15939097
申请日：2018-03-28
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar Pennathur , Mandar Painaik , Lan Hoang , Meng Chi Lee
Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
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公开(公告)号：US10296058B2
公开(公告)日：2019-05-21
申请号：US15180087
申请日：2016-06-13
Applicant: Apple Inc.
Inventor： Meng Chi Lee , Ayewin Oung , Eric S. Jol
Abstract: Connectors having contact structures that may generate a low amount of EMI outside of an electronic device housing the connector structure, may further provide isolation from EMI present outside of the electronic device, and reduce the chance of a user or user's property encountering a power supply on an exposed contact.
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公开(公告)号：US20190027445A1
公开(公告)日：2019-01-24
申请号：US16142137
申请日：2018-09-26
Applicant: Apple Inc.
Inventor： Meng Chi Lee , Shakti S. Chauhan , Flynn P. Carson , Jun Chung Hsu , Tha-An Lin
IPC: H01L23/552 , H01L21/48 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/522 , H01L23/528
CPC classification number: H01L23/552 , H01L21/4853 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/568 , H01L23/3128 , H01L23/3157 , H01L23/5226 , H01L23/528 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/16227 , H01L2224/97 , H01L2924/10253 , H01L2924/1431 , H01L2924/1434 , H01L2924/1436 , H01L2924/15311 , H01L2924/1815 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2924/014 , H01L2924/00014 , H01L2224/81
Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.
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Patent Agency Ranking
公开(公告)号：US10147685B2
公开(公告)日：2018-12-04
申请号：US15403046
申请日：2017-01-10
Applicant: Apple Inc.
Inventor： Phillip R. Sommer , Shankar Pennathur , Meng Chi Lee , Shakti S. Chauhan , Yanfeng Chen
IPC: H01L23/552 , H01L23/31 , H01L25/065 , H01L23/498 , H01L21/288 , H01L21/3205 , H01L21/285 , H01L21/268 , H01L23/00 , H01L21/56
Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.
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公开(公告)号：US20180159183A1
公开(公告)日：2018-06-07
申请号：US15880371
申请日：2018-01-25
Applicant: Apple Inc.
Inventor： Daniel W. Jarvis , David M. DeMuro , Hongli Dai , Julian Malinski , Julien Marcil , Meng Chi Lee , Richard Hung Minh Dinh , Rishabh Bhargava , Steven D. Sterz , Richard M. Mank , Soundarajan Manthiri , Vijayasekaran Boovaragavan
CPC classification number: H01M10/4257 , G01R31/382 , H01M10/44 , H01M10/445 , H01M10/48 , H01M2010/4271 , H01M2220/30
Abstract: Methods and systems for detecting and compensating for expansion of rechargeable batteries over time. An expansion detector may be coupled to or positioned proximate a rechargeable battery to monitor for expansion thereof. After expansion exceeding a selected threshold is detected, the expansion detector may report the expansion to an associated processing unit. The processing unit may undertake to arrest further rechargeable battery expansion by modifying or changing one or more characteristics of charging and/or discharging circuitry coupled to the rechargeable battery. For example, the processing unit may charge the rechargeable battery at a lower rate or with reduced voltage after detecting expansion.
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公开(公告)号：US20180092213A1
公开(公告)日：2018-03-29
申请号：US15710579
申请日：2017-09-20
Applicant: Apple Inc.
Inventor： Corey S. Provencher , Meng Chi Lee , Derek J. Walters , Ian A. Spraggs , Flynn P. Carson , Shakti S. Chauhan , Daniel W. Jarvis , David A. Pakula , Jun Zhai , Michael V. Yeh , Alex J. Crumlin , Dennis R. Pyper , Amir Salehi , Vu T. Vo , Gregory N. Stephens
CPC classification number: H05K1/181 , H05K1/0298 , H05K1/113 , H05K1/115 , H05K1/144 , H05K3/0014 , H05K3/284 , H05K3/341 , H05K3/3436 , H05K2201/10159 , H05K2201/10674 , H05K2203/1316 , Y02P70/611
Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.
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公开(公告)号：US09839133B2
公开(公告)日：2017-12-05
申请号：US14730250
申请日：2015-06-04
Applicant: APPLE INC.
Inventor： Meng Chi Lee , Shankar Pennathur , Scott L. Gooch , Dennis R. Pyper , Amir Salehi
CPC classification number: H05K1/189 , H01L23/4012 , H01L25/0652 , H01L25/0655 , H05K1/141 , H05K1/144 , H05K1/181 , H05K3/284 , H05K3/361 , H05K3/4015 , H05K2201/10318 , H05K2201/10378 , H05K2203/1316 , Y10T29/49128
Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer for providing an interconnection between a system-in-a-package module and other components in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.
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公开(公告)号：US20160021756A1
公开(公告)日：2016-01-21
申请号：US14730250
申请日：2015-06-04
Applicant: APPLE INC.
Inventor： Meng Chi Lee , Shankar Pennathur , Scott L. Gooch , Dennis R. Pyper , Amir Salehi
CPC classification number: H05K1/189 , H01L23/4012 , H01L25/0652 , H01L25/0655 , H05K1/141 , H05K1/144 , H05K1/181 , H05K3/284 , H05K3/361 , H05K3/4015 , H05K2201/10318 , H05K2201/10378 , H05K2203/1316 , Y10T29/49128
Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer for providing an interconnection between a system-in-a-package module and other components in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.
Abstract translation: 易于修改和可定制的低面积架空互连结构，用于在系统级封装模块和电子设备中的其他组件之间形成连接。 一个示例可以提供用于在电子设备中的系统级封装模块和其它部件之间提供互连的插入器。 另一个可以提供多个导电引脚或触点以在模块和其它部件之间形成互连路径。
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