公开(公告)号：US09913412B2

公开(公告)日：2018-03-06

申请号：US14308386

申请日：2014-06-18

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar S. Pennathur

IPC: H05K7/00 ,  H05K9/00 ,  H05K1/02 ,  H05K3/28 ,  H05K1/18 ,  H05K1/16

CPC classification number: H05K9/0024 ,  H01L2924/1815 ,  H01L2924/3025 ,  H05K1/0215 ,  H05K1/0218 ,  H05K3/284 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09972 ,  H05K2201/1056

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and conformally coating the insulating layer and trenches with a metal shielding layer. In some examples, trenches between subsystems can be formed using a laser source. In some examples, trenches between subsystems can have angled walls. In some examples, the metal shielding layer can be formed using at least one of electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition.

公开(公告)号：US20170263569A1

公开(公告)日：2017-09-14

申请号：US15403046

申请日：2017-01-10

Applicant: Apple Inc.

Inventor： Phillip R. Sommer ,  Shankar Pennathur ,  Meng Chi Lee ,  Shakti S. Chauhan ,  Yanfeng Chen

IPC: H01L23/552 ,  H01L25/065 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L21/3205 ,  H01L21/285 ,  H01L21/268 ,  H01L25/00 ,  H01L23/31 ,  H01L21/288

CPC classification number: H01L23/552 ,  H01L21/268 ,  H01L21/2855 ,  H01L21/2885 ,  H01L21/32051 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/7565 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01073 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.

公开(公告)号：US11266010B2

公开(公告)日：2022-03-01

申请号：US16720666

申请日：2019-12-19

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar S. Pennathur

IPC: H05K1/18 ,  H05K1/02 ,  H05K9/00 ,  H05K3/28 ,  H05K3/30

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

公开(公告)号：US10709018B2

公开(公告)日：2020-07-07

申请号：US16426443

申请日：2019-05-30

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar Pennathur ,  Mandar Painaik ,  Lan Hoang ,  Meng Chi Lee

IPC: H05K1/00 ,  H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H05K1/18 ,  H05K3/46 ,  H01L23/00 ,  H01L25/11

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

公开(公告)号：US20150271959A1

公开(公告)日：2015-09-24

申请号：US14308386

申请日：2014-06-18

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar S. Pennathur

IPC: H05K9/00

CPC classification number: H05K9/0024 ,  H01L2924/1815 ,  H01L2924/3025 ,  H05K1/0215 ,  H05K1/0218 ,  H05K3/284 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09972 ,  H05K2201/1056

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and conformally coating the insulating layer and trenches with a metal shielding layer. In some examples, trenches between subsystems can be formed using a laser source. In some examples, trenches between subsystems can have angled walls. In some examples, the metal shielding layer can be formed using at least one of electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition.

Abstract translation: 公开了一种封装在系统级封装中的便携式电子设备。 便携式电子设备可以包括基板和安装在基板上并包括在一个或多个子系统中的多个部件。 通过在部件之间设置绝缘层，在子系统之间形成窄沟槽，并用金属屏蔽层保形地涂覆绝缘层和沟槽，可以减少或消除子系统之间或外部源之间的干扰。 在一些示例中，子系统之间的沟槽可以使用激光源形成。 在一些示例中，子系统之间的沟槽可以具有成角度的壁。 在一些示例中，可以使用电镀，化学镀，化学气相沉积和物理气相沉积中的至少一种来形成金属屏蔽层。

公开(公告)号：US20200375033A1

公开(公告)日：2020-11-26

申请号：US16894463

申请日：2020-06-05

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar Pennathur ,  Mandar Painaik ,  Lan Hoang ,  Meng Chi Lee

IPC: H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H05K1/18 ,  H05K3/46 ,  H01L23/00 ,  H01L25/11

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

公开(公告)号：US20190306979A1

公开(公告)日：2019-10-03

申请号：US16426443

申请日：2019-05-30

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar Pennathur ,  Mandar Painaik ,  Lan Hoang ,  Meng Chi Lee

IPC: H05K1/14 ,  H05K3/46 ,  H05K3/00 ,  H05K3/28 ,  H05K1/18

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

公开(公告)号：US09899661B2

公开(公告)日：2018-02-20

申请号：US14040719

申请日：2013-09-29

Applicant: Apple Inc.

Inventor： Lili Huang ,  Richard M. Mank ,  Yanfeng Chen

IPC: H01M4/04 ,  H01M4/1391 ,  H01M4/36 ,  H01M4/525 ,  C23C14/08 ,  C23C14/34 ,  H01M10/052

CPC classification number: H01M4/0426 ,  C23C14/08 ,  C23C14/3492 ,  H01M4/1391 ,  H01M4/366 ,  H01M4/525 ,  H01M10/052

Abstract: A method for improving the lithium cobalt oxide (LiCoO2) film (such as films in thin film batteries) morphology includes using oxygen (O2) and argon (Ar) gases during sputtering deposition of the LiCoO2 film. This may allow for the manufacturing of thicker LiCoO2 films. Such a method may also significantly reduce or eliminate cracking and obvious columnar structures within the resulting LiCoO2 film layer. Sputtering using a mixture of O2 and Ar also may produce a LiCoO2 film layer that requires lower annealing temperatures to reach good utilization and has higher lithium diffusion rates.

公开(公告)号：US20140272560A1

公开(公告)日：2014-09-18

申请号：US14040719

申请日：2013-09-29

Applicant: Apple Inc.

Inventor： Lili Huang ,  Richard M. Mank ,  Yanfeng Chen

IPC: H01M4/04

CPC classification number: H01M4/0426 ,  C23C14/08 ,  C23C14/3492 ,  H01M4/1391 ,  H01M4/366 ,  H01M4/525 ,  H01M10/052

Abstract: A method for improving the lithium cobalt oxide (LiCoO2) film (such as films in thin film batteries) morphology includes using oxygen (O2) and argon (Ar) gases during sputtering deposition of the LiCoO2 film. This may allow for the manufacturing of thicker LiCoO2 films. Such a method may also significantly reduce or eliminate cracking and obvious columnar structures within the resulting LiCoO2 film layer. Sputtering using a mixture of O2 and Ar also may produce a LiCoO2 film layer that requires lower annealing temperatures to reach good utilization and has higher lithium diffusion rates.

Abstract translation: 用于改善锂钴氧化物（LiCoO 2）膜（例如薄膜电池中的膜）形态的方法包括在LiCoO 2膜的溅射沉积期间使用氧（O 2）和氩（Ar）气体。 这可能允许制造较厚的LiCoO 2膜。 这种方法也可以显着地减少或消除所得LiCoO 2膜层内的裂纹和明显的柱状结构。 使用O 2和Ar的混合物的溅射也可能产生需要较低退火温度以达到良好利用率并具有较高锂扩散速率的LiCoO 2膜层。

公开(公告)号：US20240074665A1

公开(公告)日：2024-03-07

申请号：US18147628

申请日：2022-12-28

Applicant: Apple Inc.

Inventor： Daniel J. Hiemstra ,  Jeffrey W. Buchholz ,  Xiaofan Niu ,  James C. Clements ,  Wei Lin ,  Habib S. Karaki ,  Paul Mansky ,  Boyi Fu ,  Yanfeng Chen ,  Edmilson Besseler

IPC: A61B5/01 ,  A61B5/00 ,  G01K13/20

CPC classification number: A61B5/01 ,  A61B5/681 ,  A61B5/7203 ,  A61B5/7246 ,  G01K13/20 ,  A61B2562/0271 ,  A61B2562/12

Abstract: An electronic device includes a housing defining an internal volume, a front opening, and a rear opening. The electronic device can include a display component disposed at the front opening and a rear cover disposed at the rear opening. A logic board can be disposed in the internal volume. The device can also include a thin film thermopile including a cold junction bonded to the logic board and a hot junction bonded to the rear cover.