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公开(公告)号：US09913412B2
公开(公告)日：2018-03-06
申请号：US14308386
申请日：2014-06-18
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar S. Pennathur
CPC classification number: H05K9/0024 , H01L2924/1815 , H01L2924/3025 , H05K1/0215 , H05K1/0218 , H05K3/284 , H05K9/0039 , H05K2201/0715 , H05K2201/0723 , H05K2201/09972 , H05K2201/1056
Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and conformally coating the insulating layer and trenches with a metal shielding layer. In some examples, trenches between subsystems can be formed using a laser source. In some examples, trenches between subsystems can have angled walls. In some examples, the metal shielding layer can be formed using at least one of electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition.
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公开(公告)号：US09820373B2
公开(公告)日：2017-11-14
申请号：US14503067
申请日：2014-09-30
Applicant: Apple Inc.
Inventor： Shankar S. Pennathur , Carlos A. S. Ribas , Deniz Teoman , Michael Eng
IPC: H01L23/552 , H01L23/31 , H05K7/20 , H05K1/02 , H05K3/28 , H05K3/30 , G06F1/20 , H01L23/36 , H01L23/433 , H01L23/34
CPC classification number: H05K1/0212 , G06F1/20 , H01L23/3121 , H01L23/3128 , H01L23/34 , H01L23/36 , H01L23/4334 , H01L23/552 , H01L2224/16227 , H01L2924/0002 , H01L2924/15192 , H01L2924/19105 , H01L2924/3025 , H05K1/0203 , H05K1/023 , H05K3/284 , H05K3/303 , H01L2924/00
Abstract: A compact portable electronic device packaged into a System-in-Package assembly and thermal solutions for the device is disclosed. The compact portable electronic device can be assembled into a single package to reduce size and enhance form factor. Several tens or hundreds of components including multiple dies, passive components, mechanical or optical components can be packaged into a single system on a printed circuit board. One or more of the components can dissipate a lot of power resulting in the generation of excess heat. To remove the excess heat, the device can include one or more thermal solutions such as internal thermal plugs, heat spreaders, internal embedded heat sinks, and/or external heat sinks. In some examples, the thermal solutions can dissipate heat via conduction to the bottom of the substrate or via convection to the top of the system or a combination of both.
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公开(公告)号：US20240074066A1
公开(公告)日：2024-02-29
申请号：US18144031
申请日：2023-05-05
Applicant: Apple Inc.
Inventor： Nitesh KUMBHAT , Yanfeng Chen , Mandar S. Painaik , Shankar S. Pennathur , Pierpaolo Lupo
CPC classification number: H05K3/284 , H01L21/565 , H05K2203/1316
Abstract: Various embodiments of a mold cavity structure of a transfer molding system are disclosed. The transfer molding system includes a first mold-forming structure and a second mold-forming structure. The second mold-forming structure includes a mold cavity. The mold cavity includes a gate region, a component region, and a vent region. The component region is configured to enclose an electrical component. A volume of the vent region is adjustable. The transfer molding system further includes an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the mold cavity during an operation of the transfer molding system.
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4.发明申请公开(公告)号：US20200154561A1
公开(公告)日：2020-05-14
申请号：US16720666
申请日：2019-12-19
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar S. Pennathur
Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.
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5.发明授权公开(公告)号：US09949359B2
公开(公告)日：2018-04-17
申请号：US14308463
申请日：2014-06-18
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar S. Pennathur
CPC classification number: H05K1/0216 , H01L2924/3025 , H05K1/0218 , H05K1/18 , H05K3/284 , H05K3/30 , H05K9/00 , H05K9/0081 , H05K2201/09972 , H05K2201/10371 , H05K2203/1322 , Y10T29/49146
Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.
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Patent Agency Ranking
公开(公告)号：US20140190930A1
公开(公告)日：2014-07-10
申请号：US13935250
申请日：2013-07-03
Applicant: Apple Inc.
Inventor： Sean A. Mayo , James H. Foster , Trevor J. Ness , Shankar S. Pennathur
IPC: H05K3/28
CPC classification number: H05K3/284 , H05K1/0209 , H05K3/288 , H05K2201/0108 , H05K2201/10106 , H05K2203/107 , H05K2203/1316 , H05K2203/1476
Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components.
Abstract translation: 所描述的实施例一般涉及电子设备，更具体地涉及用于选择性地封装电子设备中包含的电路板和其它电子元件的方法。 第一封装层可以使用包括模制，激光烧蚀，蚀刻，研磨等在内的各种工艺限于电路板的特定区域。 然后可以在去除封装层的区域中进行二次组装步骤。 在一些实施例中，具有各种热，电和光特性的次级密封剂可以填充留在第一封装层中的开口以帮助底层部件的操作。
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7.发明授权公开(公告)号：US11266010B2
公开(公告)日：2022-03-01
申请号：US16720666
申请日：2019-12-19
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar S. Pennathur
Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.
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公开(公告)号：US09618564B2
公开(公告)日：2017-04-11
申请号：US14164769
申请日：2014-01-27
Applicant: Apple Inc.
Inventor： Sean A. Mayo , Shankar S. Pennathur
CPC classification number: G01R31/2818 , H05K1/0268 , H05K1/147 , H05K2201/09036 , H05K2201/09163
Abstract: Electrical components may be soldered to a printed circuit. The printed circuit may have an edge with an opening. Printed circuit contacts in the opening may be configured to form electrical connections with mating contacts on a flexible printed circuit or other external structure. A tester may test the electrical components by conveying signals through the contacts. Following testing, the external structure may be removed from the opening. The opening may then be filled with dielectric to isolate the printed circuit contacts. A printed circuit may have traces that extend under a ground on a surface of the printed circuit, may have edge test points formed from contacts that are cut in half when removing portions of the printed circuit, or may have through-mold vias that are formed through encapsulant over the electrical components.
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公开(公告)号：US09485870B2
公开(公告)日：2016-11-01
申请号：US13935250
申请日：2013-07-03
Applicant: Apple Inc.
Inventor： Sean A. Mayo , James H. Foster , Trevor J. Ness , Shankar S. Pennathur
CPC classification number: H05K3/284 , H05K1/0209 , H05K3/288 , H05K2201/0108 , H05K2201/10106 , H05K2203/107 , H05K2203/1316 , H05K2203/1476
Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components.
Abstract translation: 所描述的实施例一般涉及电子设备，更具体地涉及用于选择性地封装电子设备中包含的电路板和其它电子元件的方法。 第一封装层可以使用包括模制，激光烧蚀，蚀刻，研磨等在内的各种工艺限于电路板的特定区域。 然后可以在去除封装层的区域中进行二次组装步骤。 在一些实施例中，具有各种热，电和光特性的次级密封剂可以填充留在第一封装层中的开口以帮助底层部件的操作。
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公开(公告)号：US09484228B2
公开(公告)日：2016-11-01
申请号：US14563798
申请日：2014-12-08
Applicant: Apple Inc.
Inventor： Scott L. Gooch , Shankar S. Pennathur
CPC classification number: H01L21/565 , B29C45/02 , B29C45/14655 , B29C45/27 , B29C45/766 , B29C2945/76006 , B29C2945/7611 , B29C2945/762 , B29C2945/76381 , B29C2945/76498 , B29C2945/76595 , B29C2945/76678 , B29C2945/76859 , B29L2031/3425 , H01L21/563 , H01L21/568 , H01L2924/181 , H05K3/0091 , H05K3/284 , H05K2203/1316 , H01L2924/00012
Abstract: Molding assemblies and methods for dual side package molding are described. In an embodiment, a molding compound is injected into a front cavity with a first actuator, and a molding compound is injected into a back cavity with a second actuator, with the first and second actuator assemblies being independently controlled. In an embodiment, the molding compound flows through a through-hole in a molding substrate from a front side of the molding substrate to a back side of the molding substrate, and into the back cavity.
Abstract translation: 描述了用于双面包装成型的成型组件和方法。 在一个实施例中，将模塑料注入到具有第一致动器的前腔中，并且将模塑料注入具有第二致动器的后腔中，其中第一和第二致动器组件被独立地控制。 在一个实施方案中，模塑料从模塑基材的前侧流过成型基材的通孔到模制基材的背面，并流入后腔。
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