Flexible Temperature Sensing Devices for Body Temperature Sensing

    公开(公告)号:US20220087534A1

    公开(公告)日:2022-03-24

    申请号:US17031559

    申请日:2020-09-24

    申请人: Apple Inc.

    IPC分类号: A61B5/01 A61B5/00

    摘要: Embodiments include a temperature sensing device that includes a temperature sensor stack that includes a flexible substrate and an array of temperature sensors coupled to the flexible substrate. Each temperature sensor in the array of temperature sensors can include a conductive material defining a continuous pattern extending from a first node to a second node, a first set of conductive traces coupled to the flexible substrate, and a second set of conductive traces coupled to the flexible substrate. The temperature sensing device can include a processing circuit configured to apply an electrical signal across the conductive material of each temperature sensor using the first set of conductive traces, detect an effect of the conductive material of each temperature sensor on the electrical signal using the second set of conductive traces, and determine a temperature for the temperature sensors in the array using the detected effects of the conductive material on the electrical signal.

    Localized Deflection Using a Bending Haptic Actuator

    公开(公告)号:US20170357325A1

    公开(公告)日:2017-12-14

    申请号:US15622017

    申请日:2017-06-13

    申请人: Apple Inc.

    IPC分类号: G06F3/01 G06F3/041 G06F3/044

    摘要: An electronic device configured to provide localized haptic feedback to a user on one or more regions or sections of a surface of the electronic device. A support structure is positioned below the surface, and one or more haptic actuators are coupled to the support structure. In some examples, the support structure is shaped or configured to amplify a response to a haptic actuator. When a haptic actuator is actuated, the support structure deflects, which causes the surface to bend or deflect at a location that substantially corresponds to the location of the activated haptic actuator. In some examples, prior to providing haptic feedback, at least one haptic actuator is electrically pre-stressed to place the haptic actuator(s) in a pre-stressed state. When haptic feedback is to be provided, at least one haptic actuator transitions from the pre-stressed state to a haptic output state to produce one or more deflections in the surface. In other examples, a haptic structure incorporates a piezoelectric element that is shaped to reduce the overall cost of the haptic structure while still providing high actuation performance.

    Encapsulated Metal Nanowires
    8.
    发明申请
    Encapsulated Metal Nanowires 审中-公开
    封装金属纳米线

    公开(公告)号:US20170068359A1

    公开(公告)日:2017-03-09

    申请号:US14847063

    申请日:2015-09-08

    申请人: Apple Inc.

    IPC分类号: G06F3/047 G06F3/044 G06F3/041

    摘要: An optically-transparent conductive structure is disclosed. The optically-transparent conductive structure can be used within a display stack of an electronic device. The optically-transparent conductive structure may be formed by depositing a metal nanowire layer that on a surface of a polarizing layer within the display stack. An encapsulation layer is disposed over the metal nanowire layer that protects the metal nanowire from corrosion. An electrical coupling is provided through or within the encapsulation layer and electrically couples to the metal nanowire layer. The electrical coupling is connected to an electrical circuit within the electronic device.

    摘要翻译: 公开了一种透光导电结构。 光学透明导电结构可以用在电子设备的显示堆叠内。 透光性导电结构体可以通过在显示层叠体内的偏光层的表面上沉积金属纳米线层来形成。 封装层设置在金属纳米线层上,保护金属纳米线免受腐蚀。 电耦合通过或在封装层内提供,并电耦合到金属纳米线层。 电耦合器连接到电子设备内的电路。

    Flexible temperature sensing devices for body temperature sensing

    公开(公告)号:US11771329B2

    公开(公告)日:2023-10-03

    申请号:US17031559

    申请日:2020-09-24

    申请人: Apple Inc.

    IPC分类号: A61B5/01 A61B5/00 G01K13/20

    摘要: Embodiments include a temperature sensing device that includes a temperature sensor stack that includes a flexible substrate and an array of temperature sensors coupled to the flexible substrate. Each temperature sensor in the array of temperature sensors can include a conductive material defining a continuous pattern extending from a first node to a second node, a first set of conductive traces coupled to the flexible substrate, and a second set of conductive traces coupled to the flexible substrate. The temperature sensing device can include a processing circuit configured to apply an electrical signal across the conductive material of each temperature sensor using the first set of conductive traces, detect an effect of the conductive material of each temperature sensor on the electrical signal using the second set of conductive traces, and determine a temperature for the temperature sensors in the array using the detected effects of the conductive material on the electrical signal.