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31.发明授权Resonator device including electrodes with buried temperature compensating layers 有权谐振器器件包括具有埋入温度补偿层的电极公开(公告)号：US09197185B2
公开(公告)日：2015-11-24
申请号：US13601384
申请日：2012-08-31
Applicant: Qiang Zou , Zhiqiang Bi , Kristina Lamers , Richard C. Ruby
Inventor： Qiang Zou , Zhiqiang Bi , Kristina Lamers , Richard C. Ruby
CPC classification number: H03H3/04 , H03H9/02102 , H03H9/131 , H03H9/173 , H03H9/175
Abstract: An acoustic resonator includes a substrate and a first composite electrode disposed over the substrate. The first composite electrode includes first and second electrically conductive layers and a first temperature compensating layer disposed between the first and second electrically conductive layers. The second electrically conductive layer forms a first electrical contact with the first electrically conductive layer on at least one side of the first temperature compensating layer, and the first electrical contact electrically shorts a first capacitive component of the first temperature compensating layer.
Abstract translation: 声谐振器包括衬底和设置在衬底上的第一复合电极。 第一复合电极包括第一和第二导电层和设置在第一和第二导电层之间的第一温度补偿层。 所述第二导电层在所述第一温度补偿层的至少一侧与所述第一导电层形成第一电接触，并且所述第一电接触使所述第一温度补偿层的第一电容分量电短路。
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公开(公告)号：US08390397B2
公开(公告)日：2013-03-05
申请号：US12748640
申请日：2010-03-29
Applicant: Tiberiu Jamneala , Richard C. Ruby
Inventor： Tiberiu Jamneala , Richard C. Ruby
Abstract: In accordance with a representative embodiment, a BAW resonator structure, comprises a first BAW resonator, comprising: a first lower electrode having a first electrical resistance; a first upper electrode having a second electrical resistance; and a first piezoelectric layer disposed between the first lower electrode and the first upper electrode. The BAW resonator structure also comprises a second BAW resonator, comprising: a second lower electrode having the second electrical resistance; a second upper electrode having the first electrical resistance; and a second piezoelectric layer disposed between the second lower electrode and the second upper electrode. The BAW resonator structure also comprises an acoustic coupling layer disposed between the first BAW resonator and the second BAW resonator. The first electrical resistance is less than the second electrical resistance. An communication device comprising a coupled resonator filter (CRF) is also disclosed.
Abstract translation: 根据代表性实施例，BAW谐振器结构包括第一BAW谐振器，包括：具有第一电阻的第一下电极; 具有第二电阻的第一上电极; 以及设置在第一下电极和第一上电极之间的第一压电层。 BAW谐振器结构还包括第二BAW谐振器，包括：具有第二电阻的第二下电极; 具有第一电阻的第二上电极; 以及设置在第二下电极和第二上电极之间的第二压电层。 BAW谐振器结构还包括设置在第一BAW谐振器和第二BAW谐振器之间的声耦合层。 第一电阻小于第二电阻。 还公开了一种包括耦合谐振滤波器（CRF）的通信设备。
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33.发明授权Packaged device with acoustic resonator and electronic circuitry and method of making the same 有权具有声谐振器和电子电路的封装器件及其制造方法公开(公告)号：US08232845B2
公开(公告)日：2012-07-31
申请号：US12891039
申请日：2010-09-27
Applicant: Richard C. Ruby , Martha K. Small
Inventor： Richard C. Ruby , Martha K. Small
IPC: H03B1/00
CPC classification number: H03H9/1014 , H01L23/10 , H01L2924/0002 , H03H9/0538 , H03L1/04 , H01L2924/00
Abstract: A device includes: a base substrate having a bonding pad and a peripheral pad, the peripheral pad encompassing the bonding pad; an acoustic resonator on the base substrate; a cap substrate having a bonding pad seal and a peripheral pad seal, the bonding pad seal bonding around the perimeter of the bonding pad and the peripheral pad seal bonding with the peripheral pad to define a hermetically sealed volume between the cap substrate and the base substrate, the cap substrate having a through hole therein over the bonding pad providing access for a connection to the bonding pad; a low-resistivity material layer region disposed on a portion of a surface of the cap substrate disposed inside the hermetically sealed volume, the material layer region being isolated from the bonding pad seal; and electronic circuitry disposed in the material layer region and electrical connected with the acoustic resonator.
Abstract translation: 一种器件包括：具有接合焊盘和外围焊盘的基底衬底，所述外围焊盘包围所述接合焊盘; 在基底基板上的声共振器; 具有接合焊盘密封件和外围焊盘密封件的盖衬底，所述接合焊盘密封件围绕所述接合焊盘的周边结合，并且所述外围焊盘密封件与所述外围焊盘接合，以限定所述盖基板和所述基板之间的气密密封体积 所述盖基板在所述焊盘上方具有通孔，所述通孔提供用于与所述焊盘的连接的通路; 所述低电阻率材料层区域设置在所述盖衬底的设置在所述密封体内的表面的一部分上，所述材料层区域与所述焊盘密封件隔离; 以及设置在材料层区域中并与声谐振器电连接的电子电路。
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34.发明授权Method of fabricating an acoustic resonator comprising a filled recessed region 有权制造包括填充凹陷区域的声谐振器的方法公开(公告)号：US08230562B2
公开(公告)日：2012-07-31
申请号：US11938078
申请日：2007-11-09
Applicant: Ronald S. Fazzio , Richard C. Ruby
Inventor： Ronald S. Fazzio , Richard C. Ruby
CPC classification number: H03H9/132 , H03H9/02149 , H03H9/13 , H03H9/173 , H03H9/175 , Y10T29/42 , Y10T29/49005 , Y10T29/49155
Abstract: A method for fabricating an acoustic resonator comprises providing a substrate; fabricating a first electrode adjacent the substrate; fabricating a piezoelectric layer adjacent the first electrode; depositing electrode material to form a second electrode up to a first thickness adjacent the piezoelectric layer; depositing a first photo mask over the second electrode; depositing additional electrode material to form the second electrode up to a second thickness; removing the photo mask thereby forming a recessed region in the second electrode; and filling the recessed region with a fill material.
Abstract translation: 一种用于制造声谐振器的方法包括：提供一个基片; 制造邻近衬底的第一电极; 制造邻近第一电极的压电层; 沉积电极材料以形成第二电极，直到邻近压电层的第一厚度; 在第二电极上沉积第一光掩模; 沉积额外的电极材料以形成第二电极直到第二厚度; 去除所述光掩模，从而在所述第二电极中形成凹陷区域; 并用填充材料填充凹陷区域。
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公开(公告)号：US07868522B2
公开(公告)日：2011-01-11
申请号：US11223386
申请日：2005-09-09
Applicant: Richard C. Ruby
Inventor： Richard C. Ruby
IPC: H01L41/04
CPC classification number: H03H9/02102 , H03H3/04 , H03H9/585 , H03H9/587 , H03H2003/021 , H03H2003/0407 , H03H2003/0471
Abstract: A temperature compensated pair of resonators. The temperature compensated pair of resonators comprises a first resonator configured to resonate at a first frequency and having a first frequency temperature coefficient and a second resonator configured to resonate at a second frequency and having a second frequency temperature coefficient. The second frequency is greater than the first frequency; the second frequency temperature coefficient is less than the first frequency temperature coefficient; and the first and the second resonators are fabricated on a common substrate.
Abstract translation: 一个温度补偿的谐振器对。 温度补偿对谐振器包括被配置为以第一频率谐振并具有第一频率温度系数的第一谐振器和被配置为以第二频率谐振并具有第二频率温度系数的第二谐振器。 第二频率大于第一频率; 第二频率温度系数小于第一频率温度系数; 并且第一和第二谐振器被制造在公共衬底上。
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Patent Agency Ranking
公开(公告)号：US07800457B2
公开(公告)日：2010-09-21
申请号：US11950644
申请日：2007-12-05
Applicant: Mark A. Unkrich , Richard C. Ruby , Wei Pang
Inventor： Mark A. Unkrich , Richard C. Ruby , Wei Pang
IPC: H03B5/32
Abstract: A self-calibrating temperature compensated oscillator includes a monolithic structure having a first resonator, a second resonator, and a heating element to heat the first and second resonators. The temperature coefficient of the second resonator is substantially greater than the temperature coefficient of the first resonator. A first oscillator circuit operates with the first resonator and outputs a first oscillator output signal having a first oscillating frequency. A second oscillator circuit operates with the second resonator and outputs a second oscillator output signal having a second oscillating frequency. A temperature determining circuit determines the temperature of the first resonator using the second oscillating frequency. A temperature compensator provides a control signal to the first oscillator in response to the determined temperature to adjust the first oscillating frequency and maintain it at a desired operating frequency.
Abstract translation: 自校准温度补偿振荡器包括具有第一谐振器，第二谐振器和加热元件的单片结构，以加热第一和第二谐振器。 第二谐振器的温度系数基本上大于第一谐振器的温度系数。 第一振荡器电路与第一谐振器一起工作并输出具有第一振荡频率的第一振荡器输出信号。 第二振荡器电路与第二谐振器一起工作并输出具有第二振荡频率的第二振荡器输出信号。 温度确定电路使用第二振荡频率确定第一谐振器的温度。 温度补偿器响应于所确定的温度向第一振荡器提供控制信号，以调整第一振荡频率并将其保持在期望的工作频率。
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公开(公告)号：US07795997B2
公开(公告)日：2010-09-14
申请号：US11526948
申请日：2006-09-25
Applicant: John D. Larson, III , Storrs T. Hoen , Annette C. Grot , Richard C. Ruby , Graham M. Flower
Inventor： John D. Larson, III , Storrs T. Hoen , Annette C. Grot , Richard C. Ruby , Graham M. Flower
IPC: H03H9/00
CPC classification number: G01N29/022 , G01N29/036 , G01N2291/0253 , G01N2291/0256 , G01N2291/02845 , G01N2291/0426
Abstract: A sensor senses an environmental condition. The sensor includes a film bulk acoustic resonator that includes a layer of material that causes resonant frequency and/or quality factor shifts of the film bulk acoustic resonator in response to changes in the environmental condition. The environmental condition may be relative humidity and the layer of material may be a moisture absorptive material.
Abstract translation: 传感器感测环境条件。 传感器包括膜体声波谐振器，其包括响应于环境条件的变化而引起膜体声波谐振器的谐振频率和/或质量因子偏移的材料层。 环境条件可以是相对湿度，并且材料层可以是吸湿材料。
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公开(公告)号：US20090273415A1
公开(公告)日：2009-11-05
申请号：US12112633
申请日：2008-04-30
Applicant: Michael L. Frank , Richard C. Ruby , Tiberiu Jamneala
Inventor： Michael L. Frank , Richard C. Ruby , Tiberiu Jamneala
IPC: H03H9/54
CPC classification number: H03H9/587 , H03H9/0095 , H03H9/132 , H03H9/583
Abstract: An electrical impedance transformer comprises a first film bulk acoustic resonator (FBAR), having a first electrical impedance and a first resonance frequency. The electrical impedance transformer also comprises: a second FBAR, having a second electrical impedance and a second resonance frequency, and being disposed over the first FBAR. The electrical impedance transformer also includes a decoupling layer disposed between the first and the second FBARs. The first electrical impedance differs from the second electrical impedance and the first and second resonance frequencies are substantially the same.
Abstract translation: 电阻抗变压器包括具有第一电阻抗和第一谐振频率的第一膜体声波谐振器（FBAR）。 电阻抗变压器还包括：第二FBAR，具有第二电阻抗和第二谐振频率，并且设置在第一FBAR上。 电阻抗变压器还包括设置在第一和第二FBAR之间的去耦层。 第一电阻抗与第二电阻抗不同，第一和第二谐振频率基本上相同。
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公开(公告)号：US07563475B2
公开(公告)日：2009-07-21
申请号：US11203003
申请日：2005-08-11
Applicant: Richard C. Ruby , John D. Larson, III
Inventor： Richard C. Ruby , John D. Larson, III
IPC: B05D5/12
CPC classification number: H03H9/605 , H03H9/587 , H03H9/60 , Y10T29/42 , Y10T29/49005 , Y10T29/49155
Abstract: An apparatus including vertically separated acoustic resonators are disclosed. The apparatus includes a first acoustic resonator on a substrate and a second acoustic resonator vertically separated above the first acoustic resonator. Because the resonators are vertically separated above another, total area required to implement the resonators is reduced thereby savings in die size and cost are realized. The vertically separated resonators are supported by standoffs that are fabricated on the substrate, or on a resonator.
Abstract translation: 公开了一种包括垂直分离的声谐振器的装置。 该装置包括在基板上的第一声谐振器和在第一声谐振器之上垂直分离的第二声谐振器。 由于谐振器在另一个上方垂直分离，所以实现谐振器所需的总面积减小，从而实现了芯片尺寸和成本的节省。 垂直分离的谐振器由制造在衬底上或在谐振器上的支座支撑。
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公开(公告)号：US20090146746A1
公开(公告)日：2009-06-11
申请号：US11950644
申请日：2007-12-05
Applicant: Mark A. Unkrich , Richard C. Ruby , Wei Pang
Inventor： Mark A. Unkrich , Richard C. Ruby , Wei Pang
IPC: H03L1/04
Abstract: A self-calibrating temperature compensated oscillator includes a monolithic structure having a first resonator, a second resonator, and a heating element to heat the first and second resonators. The temperature coefficient of the second resonator is substantially greater than the temperature coefficient of the first resonator. A first oscillator circuit operates with the first resonator and outputs a first oscillator output signal having a first oscillating frequency. A second oscillator circuit operates with the second resonator and outputs a second oscillator output signal having a second oscillating frequency. A temperature determining circuit determines the temperature of the first resonator using the second oscillating frequency. A temperature compensator provides a control signal to the first oscillator in response to the determined temperature to adjust the first oscillating frequency and maintain it at a desired operating frequency.
Abstract translation: 自校准温度补偿振荡器包括具有第一谐振器，第二谐振器和加热元件的单片结构，以加热第一和第二谐振器。 第二谐振器的温度系数基本上大于第一谐振器的温度系数。 第一振荡器电路与第一谐振器一起工作并输出具有第一振荡频率的第一振荡器输出信号。 第二振荡器电路与第二谐振器一起工作并输出具有第二振荡频率的第二振荡器输出信号。 温度确定电路使用第二振荡频率确定第一谐振器的温度。 温度补偿器响应于所确定的温度向第一振荡器提供控制信号，以调整第一振荡频率并将其保持在期望的工作频率。
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