Abstract:
A dynamic semiconductor memory device comprising a substrate having one trench including two capacitors for memory cell capacitances of two bits, and two elements such as transistors for reading, writing, and storing information represented by charge, arranged symmetrically at the central portion of the trench so as to correspond to the memory cells for two bits, and a field oxide film formed at the center of the trench on the bottom and on the side walls for separating the capacitors and elements.
Abstract:
A semiconductor memory device comprises a plurality of memory cells arranged in a plurality of rows and columns, a plurality of row decoders for selecting one row of the plurality of rows, spare memory cells arranged in one row and a spare decoder for selecting the spare memory cells arranged in the one row. Each of the row decoders comprises a link element which can be melted by a laser beam. A plurality of decoder state determining logical circuits are provided corresponding to the plurality of row decoders. If and when a defective memory cell exists of the memory cells arranged in one row corresponding to each of the row decoders, the link element in the row decoder is melted in advance. When the row decoder having the link element melted in advance is selected by address signals, a corresponding decoder state determining logical circuit generates an SEE signal. The spare decoder is selected in place of the row decoder by the SEE signal.
Abstract:
A semiconductor memory device includes a plurality of operation mode control circuits provided on a memory chip of the device for respectively executing a corresponding plurality of writing/reading operation modes including at least a static column mode, a high speed page mode and a nibble mode, and a plurality of operation mode selection circuits provided on the memory chip, each of the operation mode selection circuits having a fuse element and a bonding pad for selecting one of the plurality of the operation mode control circuits when the fuse element is cut off or the bonding pad is selectively wired, so that various functions can be selectively effected on the same chip.
Abstract:
In the semiconductor memory device according to the present invention, a n type drain diffused region (9a) to be connected to a bit line (12) is formed on a p type semiconductor substrate (1) and a n type source diffused region (9b) is formed with a prescribed spacing from the n type drain region (9a). On the p type silicon substrate (1), a p type diffused region (16a) of high impurity density and p type diffused region (16b) of high impurity density are formed in such a manner that they are in contact with the n type drain diffused region (9a) and the n type source diffused region (9b), respectively, but not in the channel region of the n channel MOS transistor (18). Consequently, the .alpha. particle-generated charges can be decreased without changing the threshold voltage of the transfer gate transistor.
Abstract:
44Gate potentials of transistors Q.sub.R0 and Q.sub.R1 provided in an active pull-up circuit APo are always controlled to be appropriate values by a clock signal .phi..sub.p. As a result, reverse flow of electric charge from a capacitor C.sub.R0 or C.sub.R1 to a bit line LB or BL can be prevented and unfavorable influence due to such reverse flow of electric charge can be avoided in operation of the active pull-up circuit APo.
Abstract:
A semiconductor memory device comprises a data input switching circuit (20) connected between the output side of a write check bit generating circuit (2) and the input side of a check bit memory cell array (32), a data output switching circuit (30) connected to the input side of an address decoder (9), and an address switching circuit (10) connected to the output side of the address decoder (9). When a test mode is entered, the data input switching circuit (2), data output switching circuit (30) and address switching circuit (10) connect a data input signal line (l), data output signal line (m) and address signal line (n), respectively, to the check bit memory cell array (32), enabling the check bit memory cell array (32) to be accessed from the outside.
Abstract:
A semiconductor memory device comprises a plurality of row decoder circuits connected with word lines for selecting memory cells. The row decoder circuits include normal row decoder circuits and spare row decoder circuits which can be selected in place of a normal row decoder circuit in case where a fault occurs in a memory cell selected by a word line connected to the normal row decoder circuit. An RAS signal (precharge signal) is applied to an output line (12) of a normal row decoder circuit through a precharge bus (31). A link element (11p) is inserted in the precharge bus (31). The link element (11p) is an element which can be melted by a laser beam, whereby the normal row decoder circuit associated is maintained in a non-selective state. A clamp circuit (14) is also connected to the output line (12). The clamp circuit (14) is a circuit for maintaining the output line (12) at a prescribed low level when the link element (11p) is melted and the associated decoder circuit is brought into a non-selective state.
Abstract:
A semiconductor memory device in which at least a line decoder or a column decoder in multiplex form is provided to select one line selection signal or column selection signal. When the line decoder or column decoder is defective, or when the word line or bit line associated with the line decoder or column decoder involves a defective bit, the defective line decoder, column decoder, word line or bit line is inactivated. The inactivated line decoder or column decoder is replaced with an auxiliary line decoder or column decoder.
Abstract:
The disclosure described a substrate bias generating circuit in which an internal RAS (Row Address Strobe) signal and an internal CAS (Column Address Strobe) signal, both of which are synchronized with an external RAS signal and external CAS supplied from outside in addition to self-oscillator, activate circuits comprising capacitors and rectifying elements respectively so as to reduce wattage dissipation thereof during holding time of RAM and be obtained increased charge pump current during operation thereof.
Abstract:
A semiconductor memory device comprises two memory cell arrays (1a, 1b) in which a block divisional operation is performed. Two spare rows (2a, 2b) are provided corresponding to the two memory cell arrays (1a, 1b). Spare row decoders (5a, 5b) are provided for selecting the spare rows (2a, 2b), respectively. One spare row decoder selecting signal generation circuit (18) used in common by the spare row decoders (5a, 5b) is provided. The spare row decoder selecting signal generation circuit (18) can be previously set so as to generate a spare row decoder selecting signal (SRE) when a defective row exists in either of the memory cell arrays (1a, 1b) and the defective row is selected by row decoder groups (4a, 4b). Each of the spare row decoders (5a, 5b) is activated in response to the spare row decoder selecting signal (SRE) and a block control signal.