公开(公告)号：US11799184B2

公开(公告)日：2023-10-24

申请号：US17140858

申请日：2021-01-04

申请人： Texas Instruments Incorporated

发明人： Baher Haroun ,  Juan Alejandro Herbsommer ,  Gerd Schuppener ,  Swaminathan Sankaran

IPC分类号： H01P5/08 ,  H01P11/00 ,  H01P3/16

CPC分类号： H01P5/087 ,  H01P3/16 ,  H01P11/001

摘要： An interposer acts as a buffer zone between a transceiver IC and a dielectric waveguide interconnect and establishes two well-defined reference planes that can be optimized independently. The interposer includes a block of material having: a first interface region to interface with an antenna coupled to an integrated circuit (IC); and a second interface region to interface to the dielectric waveguide. An interface waveguide is formed by a defined region positioned within the block of material between the first interface region and the second interface region.

公开(公告)号：US11777186B2

公开(公告)日：2023-10-03

申请号：US16647319

申请日：2018-09-14

申请人： ALLEN-VANGUARD CORPORATION

发明人： Sulav Adhikari ,  Ernst Wallisch, Jr.

IPC分类号： H01P1/213 ,  H01P1/207 ,  H01P3/12 ,  H04W88/08 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H01P1/208 ,  H01P11/00

CPC分类号： H01P1/2138 ,  H01P1/207 ,  H01P1/2088 ,  H01P3/121 ,  H01P11/007 ,  H04W88/08 ,  H05K1/115 ,  H05K1/18 ,  H05K3/3494 ,  H05K2201/015 ,  H05K2201/037 ,  H05K2201/09609 ,  H05K2201/09985

摘要： System, apparatuses and methods are disclosed which relate to the use of substrate integrated waveguide technology in front-end modules. An example circuit card assembly for use as a cellular base station front-end is disclosed which includes at least one component printed circuit board (PCB) layer having front-end module hardware components and at least one filter PCB layer including at least one substrate integrated waveguide (SIW) filter.

公开(公告)号：US11777185B2

公开(公告)日：2023-10-03

申请号：US17825749

申请日：2022-05-26

申请人： Skyworks Solutions, Inc.

发明人： John Kenneth Darling

IPC分类号： H01P1/205 ,  H01P7/04 ,  H01P11/00

CPC分类号： H01P1/2053 ,  H01P1/2056 ,  H01P7/04 ,  H01P11/007

摘要： Disclosed are embodiments of ceramic radiofrequency filters advantageous as RF components. The ceramic filters can include a ceramic impedance resonator, wherein the inner diameter of the ceramic stepped impedance resonator can vary from one end to another end. The inner diameter can be designed to provide different impedances in the ceramic resonator.

公开(公告)号：US20230307813A1

公开(公告)日：2023-09-28

申请号：US18312202

申请日：2023-05-04

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Jiun Yi WU ,  Chien-Hsun LEE ,  Chewn-Pu JOU ,  Fu-Lung HSUEH

IPC分类号： H01P3/08 ,  H01P11/00 ,  H01P3/02 ,  H01P3/06

CPC分类号： H01P3/082 ,  H01P11/003 ,  H01P3/026 ,  H01P3/06

摘要： A method of making a semiconductor device includes forming a first transmission line over a substrate. The method includes forming a second transmission line over the substrate. The method further includes depositing a high-k dielectric material between the first transmission line and the second transmission line, wherein the high-k dielectric material partially covers each of the first transmission line and the second transmission line. The method further includes depositing a dielectric material directly contacting the high-k dielectric material, wherein the dielectric material has a different dielectric constant from the high-k dielectric material, and the dielectric material directly contacts the first transmission line or the second transmission line.

公开(公告)号：US11764450B2

公开(公告)日：2023-09-19

申请号：US16922719

申请日：2020-07-07

申请人： California Institute of Technology

发明人： Sofia Rahiminejad ,  Maria A. Del Pino ,  Cecile D. Jung-Kubiak ,  Theodore J. Reck ,  Goutam Chattopadhyay

IPC分类号： H01P1/18 ,  H01Q3/38 ,  H01P11/00

CPC分类号： H01P1/182 ,  H01P11/002 ,  H01Q3/38

摘要： A phase shifter comprising an actuator coupled to a dielectric. When the dielectric is inserted into the waveguide in response to actuation by the actuator, the phase velocity of the incoming electromagnetic wave is decreased, resulting in a phase shift of the electromagnetic wave. A desired phase shift and a low insertion loss can be controlled by positioning of the dielectric and engineering the permittivity of the dielectric.

公开(公告)号：US20230268630A1

公开(公告)日：2023-08-24

申请号：US18309944

申请日：2023-05-01

申请人： Infineon Technologies AG

发明人： Markus Josef LANG

IPC分类号： H01P3/12 ,  H05K1/18 ,  H05K3/00 ,  H01P11/00 ,  G01S7/03 ,  G01S7/35

CPC分类号： H01P3/121 ,  G01S7/032 ,  G01S7/35 ,  H01P11/002 ,  H05K1/181 ,  H05K3/0026 ,  H05K3/0044 ,  H05K2201/10098

摘要： A method for producing a waveguide in a multilayer substrate involves producing at least one cutout corresponding to a lateral course of the waveguide in a surface of a first layer arrangement comprising one or a plurality of layers. A metallization is produced on surfaces of the cutout. A second layer arrangement comprising one or a plurality of layers is applied on the first layer arrangement. The second layer arrangement comprises, on a surface thereof, a metallization which, after the second layer arrangement has been applied on the first layer arrangement, is arranged above the cutout and together with the metallization on the surfaces of the cutout forms the waveguide.

公开(公告)号：US11715870B2

公开(公告)日：2023-08-01

申请号：US17203761

申请日：2021-03-17

申请人： Taiwan Inpaq electronic Co., Ltd.

发明人： Kai-Hsiang Tsai ,  Wei-Lin Liu ,  Ta-Fu Cheng

IPC分类号： H01P3/12 ,  H01P11/00 ,  G03B21/20

CPC分类号： H01P3/12 ,  H01P11/002 ,  G03B21/2033

摘要： A waveguide structure and a method of manufacturing the same, and an electronic device are provided. The electronic device includes a control module, an antenna module and a waveguide structure connected between the control module and the antenna module. The waveguide structure includes an insulating carrier component and a conductive metal component. The insulating carrier component includes a first insulating carrier and a second insulating carrier matching with the first insulating carrier. The first insulating carrier includes a first groove, and the second insulating carrier includes a second groove in communication with the first groove. The conductive metal component includes a first conductive body accommodated in the first groove of the first insulating carrier and a second conductive body accommodated in the second groove of the second insulating carrier, and the conductive metal component includes a penetrating channel passing therethrough.

公开(公告)号：US11715693B2

公开(公告)日：2023-08-01

申请号：US16397923

申请日：2019-04-29

申请人： Intel Corporation

发明人： Georgios Dogiamis ,  Aleksandar Aleksov ,  Adel A. Elsherbini ,  Henning Braunisch ,  Johanna M. Swan ,  Telesphor Kamgaing

IPC分类号： H01L23/538 ,  H01L23/66 ,  G02B6/30 ,  H01P3/16 ,  H01P11/00

CPC分类号： H01L23/538 ,  G02B6/30 ,  H01L23/66 ,  H01P3/16 ,  H01P11/006 ,  H01L2223/6627

摘要： Embodiments may relate to a semiconductor package that includes a package substrate coupled with a die. The package may further include a waveguide coupled with the first package substrate. The waveguide may include two or more layers of a dielectric material with a waveguide channel positioned between two layers of the two or more layers of the dielectric material. The waveguide channel may convey an electromagnetic signal with a frequency greater than 30 gigahertz (GHz). Other embodiments may be described or claimed.

公开(公告)号：US11710886B2

公开(公告)日：2023-07-25

申请号：US17013470

申请日：2020-09-04

申请人： Avery Dennison Retail Information Services, LLC

发明人： Ian J. Forster ,  Peter Cockerell ,  Norman Howard

IPC分类号： B23K26/00 ,  B32B38/00 ,  G06K19/00 ,  B32B37/00 ,  H01P11/00 ,  B23K26/364 ,  B32B38/10 ,  G06K19/077 ,  G06K19/07 ,  B32B37/12

CPC分类号： H01P11/003 ,  B23K26/364 ,  B32B38/10 ,  G06K19/0723 ,  G06K19/0775 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/07754 ,  G06K19/07786 ,  B32B37/12 ,  B32B38/145 ,  B32B2305/10 ,  B32B2307/302 ,  B32B2317/12 ,  B32B2519/02 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49156 ,  Y10T29/5317 ,  Y10T29/53174 ,  Y10T156/1052 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/2809 ,  Y10T428/2817

摘要： The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

公开(公告)号：US11678431B2

公开(公告)日：2023-06-13

申请号：US17376406

申请日：2021-07-15

申请人： BOARDTEK ELECTRONICS CORPORATION

发明人： Chien-Cheng Lee

IPC分类号： H01P3/12 ,  H05K1/02 ,  H01P11/00

CPC分类号： H05K1/024 ,  H01P3/121 ,  H01P11/002 ,  H05K2201/037

摘要： A method of manufacturing a circuit board having waveguides including forming a waveguiding structure by injection molding. The waveguiding structure includes a plurality of waveguides arranged at intervals and at least one connecting portion connecting two adjacent waveguides. Each waveguide includes a waveguiding substrate and at least one protrusion on the waveguiding substrate. The connecting portion is removed to obtain at least two waveguides. A metal layer is formed to wrap the whole outer surface of each waveguide. A plurality of receiving grooves is formed to penetrate a wiring board. Each waveguide wrapped by the metal layer is embedded in one of the receiving grooves. The waveguides and the wiring board are fixed. A portion of the metal layer on a surface of each protrusion facing away from the waveguiding substrate is removed. A circuit board is also provided.