公开(公告)号：US10020296B2

公开(公告)日：2018-07-10

申请号：US14929715

申请日：2015-11-02

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yoshiaki Oikawa ,  Shingo Eguchi

IPC: H01L27/02 ,  H01L27/12 ,  H01L27/13 ,  H01L23/66

CPC classification number: H01L27/0248 ,  H01L23/66 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/1255 ,  H01L27/1266 ,  H01L27/13 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/00

Abstract: To solve a problem in that an antenna or a circuit including a thin film transistor is damaged due to discharge of electric charge accumulated in an insulator (a problem of electrostatic discharge), a semiconductor device includes a first insulator, a circuit including a thin film transistor provided over the first insulator, an antenna which is provided over the circuit and is electrically connected to the circuit, and a second insulator provided over the antenna, a first conductive film provided between the first insulator and the circuit, and a second conductive film provided between the second insulator and the antenna.

公开(公告)号：US10008670B2

公开(公告)日：2018-06-26

申请号：US15272741

申请日：2016-09-22

Applicant: JOLED INC.

Inventor： Kenichi Izumi ,  Keisuke Shimokawa ,  Shin Akasaka ,  Hiroyuki Abe ,  Shinpei Irie ,  Takatoshi Saito

IPC: H01L21/683 ,  H01L27/12 ,  H01L51/00 ,  H01L51/56 ,  B32B7/06 ,  B32B7/12 ,  B32B43/00

CPC classification number: H01L51/003 ,  B32B7/06 ,  B32B7/12 ,  B32B43/006 ,  B32B2457/20 ,  H01L21/6835 ,  H01L27/12 ,  H01L27/1218 ,  H01L27/1266 ,  H01L51/0024 ,  H01L51/0097 ,  H01L51/56 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68386 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338

Abstract: A method of peeling a laminate according to the disclosure includes: forming a first adhesive layer on a first substrate, the first adhesive layer having adhesive force that satisfies the following Expression (1) and one or both of the following Expressions (2) and (3); firmly attaching a second substrate onto the first adhesive layer; forming a first functional layer on the second substrate; and peeling off the first substrate from the second substrate. A

公开(公告)号：US10003023B2

公开(公告)日：2018-06-19

申请号：US15483618

申请日：2017-04-10

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Takahiro Sato ,  Shunsuke Koshioka ,  Rihito Wada ,  Junko Suzawa

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/52 ,  H01L51/56 ,  H01L29/786

CPC classification number: H01L51/003 ,  H01L27/1218 ,  H01L27/1225 ,  H01L27/1266 ,  H01L27/3258 ,  H01L27/3262 ,  H01L27/3276 ,  H01L29/7869 ,  H01L51/0097 ,  H01L51/5237 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  Y02E10/549 ,  Y02P70/521

Abstract: To provide a highly flexible display device excellent in mass-productivity. A display device includes a flexible substrate, an adhesive layer over the substrate, a resin layer over the adhesive layer, an inorganic insulating layer over the resin layer, a transistor over the inorganic insulating layer, and a display element electrically connected to the transistor. The transistor includes an oxide semiconductor in a channel formation region. The resin layer includes sulfur.

公开(公告)号：US20180166524A1

公开(公告)日：2018-06-14

申请号：US15894117

申请日：2018-02-12

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Masakatsu OHNO ,  Hiroki ADACHI ,  Satoru IDOJIRI ,  Koichi TAKESHIMA

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56 ,  H01L51/00 ,  H01L27/12 ,  H01L29/66 ,  H01L29/786

CPC classification number: H01L27/3272 ,  B23K26/04 ,  B23K26/0617 ,  B23K26/0622 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/083 ,  H01L27/1225 ,  H01L27/1266 ,  H01L27/322 ,  H01L27/3244 ,  H01L27/3258 ,  H01L27/3262 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/7869 ,  H01L41/314 ,  H01L51/0024 ,  H01L51/0027 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5096 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5284 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2251/558 ,  Y02E10/549 ,  Y02P70/521

Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

公开(公告)号：US20180151841A1

公开(公告)日：2018-05-31

申请号：US15882169

申请日：2018-01-29

Applicant: PANASONIC CORPORATION

Inventor： Kenji OKUMOTO ,  Yuji TANAKA

IPC: H01L51/52 ,  H01L51/00 ,  H01L21/683 ,  H01L27/12

CPC classification number: H01L51/5268 ,  H01L21/6835 ,  H01L27/1266 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5253 ,  H01L2221/6835 ,  H01L2221/68381 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/249991

Abstract: A method for producing a light-emitting device includes preparing a supporting substrate forming a porous layer on or above the supporting substrate, the porous layer being an organic material layer and containing a plurality of pores, and forming a transparent substrate on or above the porous layer. The method further includes forming a light-emitting element on or above the transparent substrate, breaking the porous layer at a portion inside the porous layer or at an interface between the supporting substrate and the porous layer, and separating the supporting substrate from the transparent substrate while at least part of the broken porous layer is attached to the transparent substrate.

公开(公告)号：US20180096240A1

公开(公告)日：2018-04-05

申请号：US15704523

申请日：2017-09-14

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Konami IZUMI

IPC: G06K19/077 ,  H01Q1/38 ,  G06K19/04 ,  H01L27/12

CPC classification number: H01Q1/38 ,  G06K19/04 ,  G06K19/07749 ,  G06K19/07775 ,  H01L27/1214 ,  H01L27/1266

Abstract: The invention provides a wireless chip which can secure the safety of consumers while being small in size, favorable in communication property, and inexpensive, and the invention also provides an application thereof. Further, the invention provides a wireless chip which can be recycled after being used for managing the manufacture, circulation, and retail. A wireless chip includes a layer including a semiconductor element, and an antenna. The antenna includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer, and has a spherical shape, an ovoid shape, an oval spherical shape like a go stone, an oval spherical shape like a rugby ball, or a disc shape, or has a cylindrical shape or a polygonal prism shape in which an outer edge portion thereof has a curved surface.

公开(公告)号：US20180085859A1

公开(公告)日：2018-03-29

申请号：US15707017

申请日：2017-09-18

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Seiji YASUMOTO ,  Naoto GOTO ,  Satoru IDOJIRI

IPC: B23K26/57 ,  H01L27/12 ,  H01L27/32 ,  G02F1/1362

CPC classification number: B23K26/57 ,  G02F1/136286 ,  G02F2001/13613 ,  G02F2201/44 ,  H01L27/1218 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/1266 ,  H01L27/3276 ,  H01L51/003 ,  H01L2227/326

Abstract: The yield of a manufacturing process of a semiconductor device is increased. The mass productivity of the semiconductor device is increased. The semiconductor device is manufactured by performing a step of performing plasma treatment on a first surface of a substrate; a step of forming a first layer over the first surface with the use of a material containing a resin or a resin precursor; a step of forming a resin layer by performing heat treatment on the first layer; and a step of separating the substrate and the resin layer from each other. In the plasma treatment, the first surface is exposed to an atmosphere containing one or more of hydrogen, oxygen, and water vapor.

公开(公告)号：US09929220B2

公开(公告)日：2018-03-27

申请号：US12651734

申请日：2010-01-04

Applicant: Shunpei Yamazaki ,  Masahiro Katayama ,  Shingo Eguchi ,  Yoshiaki Oikawa ,  Ami Nakamura ,  Satoshi Seo ,  Kaoru Hatano

Inventor： Shunpei Yamazaki ,  Masahiro Katayama ,  Shingo Eguchi ,  Yoshiaki Oikawa ,  Ami Nakamura ,  Satoshi Seo ,  Kaoru Hatano

IPC: H01L27/32 ,  H05B33/02 ,  H05B33/04 ,  H05B33/12 ,  H01L27/12 ,  H01L29/786 ,  H01L51/00 ,  H01L51/52

CPC classification number: H01L27/3246 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/1266 ,  H01L29/7869 ,  H01L51/003 ,  H01L51/52 ,  H01L51/524 ,  H01L51/5253 ,  H01L2251/5338 ,  H05B33/02 ,  H05B33/04 ,  H05B33/12

Abstract: Thinned and highly reliable light emitting elements are provided. Further, light emitting devices in which light emitting elements are formed over flexible substrates are manufactured with high yield. One light emitting device includes a flexible substrate, a light emitting element formed over the flexible substrate, and a resin film covering the light emitting element, and in the light emitting element, an insulating layer serving as a partition has a convex portion and the convex portion is embedded in the resin film, that is, the resin film covers an entire surface of the insulating layer and an entire surface of the second electrode, whereby the light emitting element can be thinned and highly reliable. In addition, a light emitting device can be manufactured with high yield in a manufacturing process thereof.

公开(公告)号：US09917062B1

公开(公告)日：2018-03-13

申请号：US15266972

申请日：2016-09-15

Applicant: Qualcomm Incorporated

Inventor： Sinan Goktepeli

IPC: H01L23/544 ,  H01L27/12 ,  H01L21/683 ,  H01L21/84 ,  H01L21/762 ,  H01L27/13

CPC classification number: H01L23/544 ,  H01L21/6835 ,  H01L21/76224 ,  H01L21/84 ,  H01L21/845 ,  H01L27/0694 ,  H01L27/1203 ,  H01L27/1211 ,  H01L27/1266 ,  H01L27/13 ,  H01L2221/6835

Abstract: An integrated circuit structure may include an alignment column on a front-side surface of an isolation layer. The alignment column may extend through a backside surface opposite the front-side surface of the isolation layer. The integrated circuit structure may also include front-side transistors on the front-side surface of the isolation layer. The integrated circuit structure may further include backside transistors on the backside surface of the isolation layer. A first front-side transistor is aligned with a first backside transistor according to the alignment column.

公开(公告)号：US20180040849A1

公开(公告)日：2018-02-08

申请号：US15552029

申请日：2016-02-12

Applicant: SHARP KABUSHIKI KAISHA

Inventor： MAMORU ISHIDA ,  TETSUYA OKAMOTO ,  TAKESHI HIRASE ,  TOHRU SENOO ,  TOHRU SONODA ,  DAICHI NISHIKAWA

IPC: H01L51/52 ,  H05B33/06 ,  H01L27/32 ,  H01L51/56 ,  H05B33/04 ,  H01L27/12

CPC classification number: H01L51/5246 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/3241 ,  H01L51/50 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/566 ,  H05B33/04 ,  H05B33/06

Abstract: An organic EL display 1 includes a sealing film 2 provided on a plastic substrate 10 to cover an organic EL element 4. The sealing film 2 includes a first sealing layer 25 on a surface of the plastic substrate 10, three stress relief layers 26, 27, and 28 on a surface of the first sealing layer 25, and a second sealing layer 29 on a surface of the stress relief layer 28. The stress relief layers 26, 27, and 28 each have a higher coefficient of thermal expansion than the first and second sealing layers 25 and 29. The stress relief layer 27 interposed between the stress relief layers 26 and 28 has a higher coefficient of thermal expansion than the stress relief layers 26 and 28.