公开(公告)号：US10008670B2

公开(公告)日：2018-06-26

申请号：US15272741

申请日：2016-09-22

Applicant: JOLED INC.

Inventor： Kenichi Izumi ,  Keisuke Shimokawa ,  Shin Akasaka ,  Hiroyuki Abe ,  Shinpei Irie ,  Takatoshi Saito

IPC: H01L21/683 ,  H01L27/12 ,  H01L51/00 ,  H01L51/56 ,  B32B7/06 ,  B32B7/12 ,  B32B43/00

CPC classification number: H01L51/003 ,  B32B7/06 ,  B32B7/12 ,  B32B43/006 ,  B32B2457/20 ,  H01L21/6835 ,  H01L27/12 ,  H01L27/1218 ,  H01L27/1266 ,  H01L51/0024 ,  H01L51/0097 ,  H01L51/56 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68386 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338

Abstract: A method of peeling a laminate according to the disclosure includes: forming a first adhesive layer on a first substrate, the first adhesive layer having adhesive force that satisfies the following Expression (1) and one or both of the following Expressions (2) and (3); firmly attaching a second substrate onto the first adhesive layer; forming a first functional layer on the second substrate; and peeling off the first substrate from the second substrate. A