公开(公告)号：US20220093200A1

公开(公告)日：2022-03-24

申请号：US17245075

申请日：2021-04-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiheung Kim ,  Sanguhn Cha ,  Junhyung Kim ,  Sungchul Park ,  Hyojin Jung ,  Kyung-Soo Ha

IPC: G11C29/42 ,  G11C29/44 ,  G11C29/20 ,  G11C11/406

Abstract: A semiconductor memory device includes a memory cell array, an error correction code (ECC) circuit, a fault address register, a scrubbing control circuit and a control logic circuit. The memory cell array includes memory cell rows. The scrubbing control circuit generates scrubbing addresses based on refresh operations performed on the memory cell array. The control logic circuit controls the ECC circuit such that the ECC circuit performs an error detection operation on a plurality of sub-pages in a first memory cell row to count a number of error occurrences, and determines whether to correct a codeword in which an error is detected based on the number of error occurrences. An uncorrected or corrected codeword is written back , and a row address of the first memory cell row may be stored in the fault address register as a row fault address based on the number of error occurrences.

公开(公告)号：US10885950B2

公开(公告)日：2021-01-05

申请号：US16363077

申请日：2019-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae-Sik Moon ,  Kyung-Soo Ha ,  Young-Soo Sohn ,  Ki-Seok Oh ,  Chang-Kyo Lee ,  Jin-Hoon Jang ,  Yeon-Kyu Choi ,  Seok-Hun Hyun

IPC: G11C7/10 ,  G11C7/22

Abstract: A method of operating memory devices disposed in different ranks of a multi-rank memory device and sharing a signal line includes receiving, in all of the memory devices included in the multi-rank memory device, on-die termination (ODT) state information of the signal line. The method further includes storing, in each of the memory devices of the multi-rank memory device, the ODT state information of the signal line in a mode register. The method further includes generating, in each of the memory devices of the multi-rank memory device, a control signal based on the ODT state information of the signal line stored in the mode register. The method further includes changing, in each of the memory devices of the multi-rank memory device, an ODT setting of the signal line in response to the control signal.

公开(公告)号：US10692554B2

公开(公告)日：2020-06-23

申请号：US16721131

申请日：2019-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Hoon Son ,  Si-Hong Kim ,  Chang-Kyo Lee ,  Jung-Hwan Choi ,  Kyung-Soo Ha

IPC: G11C7/10 ,  G11C7/24 ,  H03H7/38

Abstract: A method of controlling on-die termination (ODT) in a multi-rank system including a plurality of memory ranks is provided. The method includes: enabling ODT circuits of the plurality of memory ranks into an initial state when the multi-rank system is powered on; enabling the ODT circuits of a write target memory rank and non-target memory ranks among the plurality of memory ranks during a write operation; and disabling the ODT circuit of a read target memory rank among the plurality of memory ranks while enabling the ODT circuits of non-target memory ranks among the plurality of memory ranks during a read operation.

公开(公告)号：US10665558B2

公开(公告)日：2020-05-26

申请号：US16036198

申请日：2018-07-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sihong Kim ,  Young-Hoon Son ,  Taeyoung Oh ,  Kyung-Soo Ha

IPC: H01L23/00 ,  G11C5/06 ,  G11C8/10 ,  G11C5/04 ,  G11C5/02

Abstract: A semiconductor memory includes a plurality of first pads arranged in a first direction, a plurality of second pads arranged parallel to the plurality of first pads and in the first direction, a plurality of third pads arranged in a second direction perpendicular to the first direction, and a plurality of fourth pads arranged in the second direction. The semiconductor memory further includes first interconnection wires extending from the plurality of first pads in the second direction, the first interconnection wires being connected to the plurality of third pads, and second interconnection wires extending from the plurality of second pads in an opposite direction to the second direction, the second interconnection wires being connected to the plurality of fourth pads.

公开(公告)号：US10529407B2

公开(公告)日：2020-01-07

申请号：US16039400

申请日：2018-07-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Hwa Kim ,  Tae-Young Oh ,  Jin-Hun Jang ,  Seok-Jin Cho ,  Kyung-Soo Ha

IPC: G11C5/14 ,  G11C11/4074

Abstract: A memory device has a plurality of power rails, including: a first power rail for transmitting a high power voltage, a second power rail for transmitting a low power voltage, a third power rail for selectively receiving the high power voltage from the first power rail through a first dynamic voltage and frequency scaling (DVFS) switch and for selectively receiving the low power voltage from the second power rail through a second DVFS switch, a fourth power rail connected to a first power gating (PG) switch to selectively receive the high power voltage or the low power voltage from the third power rail, and a first circuit block connected to the fourth power rail to receive a power voltage to which the DVFS and PG are applied. When power gating is applied, supply of the power voltage to the fourth power rail is blocked.

公开(公告)号：US12211581B2

公开(公告)日：2025-01-28

申请号：US18047614

申请日：2022-10-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Donghun Lee ,  Daesik Moon ,  Young-Soo Sohn ,  Young-Hoon Son ,  Ki-Seok Oh ,  Changkyo Lee ,  Hyun-Yoon Cho ,  Kyung-Soo Ha ,  Seokhun Hyun

IPC: G11C7/10 ,  G06F3/06 ,  G11C29/02 ,  G11C29/50

Abstract: A memory device includes a driver that drives a data line connected with an external device, an internal ZQ manager that generates an internal ZQ start signal, a selector that selects one of the internal ZQ start signal and a ZQ start command from the external device, based on a ZQ mode, a ZQ calibration engine that generates a ZQ code by performing ZQ calibration in response to a selection result of the selector, and a ZQ code register that loads the ZQ code onto the driver in response to a ZQ calibration command from the external device.

公开(公告)号：US12033686B2

公开(公告)日：2024-07-09

申请号：US18314243

申请日：2023-05-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae-Sik Moon ,  Gil-Hoon Cha ,  Ki-Seok Oh ,  Chang-Kyo Lee ,  Yeon-Kyu Choi ,  Jung-Hwan Choi ,  Kyung-Soo Ha ,  Seok-Hun Hyun

IPC: G11C11/4076 ,  G06F3/06 ,  G11C7/22 ,  G11C11/409

CPC classification number: G11C11/4076 ,  G06F3/0604 ,  G06F3/0653 ,  G06F3/0659 ,  G06F3/0673 ,  G11C7/222 ,  G11C11/409

Abstract: A memory device includes a clock receiver configured to receive, from a memory controller, a write clock that is used to receive write data during a data write operation, a duty monitor configured to generate first monitoring information by monitoring a duty of the write clock, and a duty adjuster configured to adjust the duty of the write clock in response to a duty control signal and output an adjusted write clock. The memory device provides the first monitoring information to the memory controller, and receives the duty control signal, generated using the first monitoring information, from the memory controller.

公开(公告)号：US11423971B2

公开(公告)日：2022-08-23

申请号：US17564564

申请日：2021-12-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae-Sik Moon ,  Gil-Hoon Cha ,  Ki-Seok Oh ,  Chang-Kyo Lee ,  Yeon-Kyu Choi ,  Jung-Hwan Choi ,  Kyung-Soo Ha ,  Seok-Hun Hyun

IPC: G11C11/40 ,  G11C11/4076 ,  G11C11/409 ,  G06F3/06 ,  G11C7/22

Abstract: A memory device includes a clock receiver configured to receive, from a memory controller, a write clock that is used to receive write data during a data write operation, a duty monitor configured to generate first monitoring information by monitoring a duty of the write clock, and a duty adjuster configured to adjust the duty of the write clock in response to a duty control signal and output an adjusted write clock. The memory device provides the first monitoring information to the memory controller, and receives the duty control signal, generated using the first monitoring information, from the memory controller.

公开(公告)号：US11327838B2

公开(公告)日：2022-05-10

申请号：US16389080

申请日：2019-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-Hwan Park ,  Tae-Young Oh ,  Hyung-Joon Chi ,  Kyung-Soo Ha ,  Hyong-Ryol Hwang

IPC: G06F11/10 ,  G11C7/22

Abstract: A memory device includes: a first memory bank and a second memory bank; a control logic configured to receive a command and control an internal operation of the memory device; and an error correction code (ECC) circuit configured to retain in a latch circuit first read data read from the first memory bank in response to a first masked write (MWR) command for the first memory bank based on a latch control signal from the control logic, generate a first parity from data in which the first read data retained in the latch circuit is merged with first write data corresponding to the first MWR command in response to a first write control signal received from the control logic, and control an ECC operation to retain in the latch circuit second read data read from the second memory bank based on the latch control signal.

公开(公告)号：US11211102B2

公开(公告)日：2021-12-28

申请号：US17104114

申请日：2020-11-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae-Sik Moon ,  Kyung-Soo Ha ,  Young-Soo Sohn ,  Ki-Seok Oh ,  Chang-Kyo Lee ,  Jin-Hoon Jang ,  Yeon-Kyu Choi ,  Seok-Hun Hyun

IPC: G11C7/10 ,  G11C7/22

Abstract: A method of operating memory devices disposed in different ranks of a multi-rank memory device and sharing a signal line includes receiving, in all of the memory devices included in the multi-rank memory device, on-die termination (ODT) state information of the signal line. The method further includes storing, in each of the memory devices of the multi-rank memory device, the ODT state information of the signal line in a mode register. The method further includes generating, in each of the memory devices of the multi-rank memory device, a control signal based on the ODT state information of the signal line stored in the mode register. The method further includes changing, in each of the memory devices of the multi-rank memory device, an ODT setting of the signal line in response to the control signal.