Abstract:
A display apparatus includes: a substrate defining transistor and wiring areas; a thin film transistor in the transistor area and including a gate electrode, an active layer, and source and drain electrodes; an etch prevention layer in the transistor area, absent in the wiring area and covering the active layer, and first and second contact holes defined in the etch prevention layer and through which the active layer is electrically coupled to the source and drain electrodes; a first wiring layer in the wiring area; a first insulating layer which covers the gate electrode and the first wiring layer, and a third contact hole defined in the first insulating layer in the wiring area and exposing the first wiring layer; and a second wiring layer on the first insulating layer and in the wiring area, and electrically coupled to the first wiring layer via the third contact hole.
Abstract:
A thin film transistor array panel includes a substrate, gate lines, each including a gate pad, a gate insulating layer, data lines, each including a data pad connected to a source and drain electrode, a first passivation layer disposed on the data lines and the drain electrode, a first electric field generating electrode, a second passivation layer disposed on the first electric field generating electrode, and a second electric field generating electrode. The gate insulating layer and the first and second passivation layers include a first contact hole exposing a part of the gate pad, the first and second passivation layers include a second contact hole exposing a part of the data pad, and at least one of the first and second contact holes have a positive taper structure having a wider area at an upper side than at a lower side.
Abstract:
A thin film transistor according to an exemplary embodiment of the present invention includes an oxide semiconductor. A source electrode and a drain electrode face each other. The source electrode and the drain electrode are positioned at two opposite sides, respectively, of the oxide semiconductor. A low conductive region is positioned between the source electrode or the drain electrode and the oxide semiconductor. An insulating layer is positioned on the oxide semiconductor and the low conductive region. A gate electrode is positioned on the insulating layer. The insulating layer covers the oxide semiconductor and the low conductive region. A carrier concentration of the low conductive region is lower than a carrier concentration of the source electrode or the drain electrode.
Abstract:
A thin film transistor according to an exemplary embodiment of the present invention includes an oxide semiconductor. A source electrode and a drain electrode face each other. The source electrode and the drain electrode are positioned at two opposite sides, respectively, of the oxide semiconductor. A low conductive region is positioned between the source electrode or the drain electrode and the oxide semiconductor. An insulating layer is positioned on the oxide semiconductor and the low conductive region. A gate electrode is positioned on the insulating layer. The insulating layer covers the oxide semiconductor and the low conductive region. A carrier concentration of the low conductive region is lower than a carrier concentration of the source electrode or the drain electrode.
Abstract:
An manufacturing method of a display device may include the following steps: forming a transistor on a substrate; forming an insulating layer on the transistor; forming a conductive layer including silver on the insulating layer; forming a photosensitive member on the conductive layer; forming an electrode of a light-emitting element by etching the conductive layer; performing plasma treatment on a structure that comprises the electrode, the plasma treatment using a gas including a halogen; and removing a product that is resulted from the plasma treatment.
Abstract:
A method for etching an insulating layer includes: sequentially forming a first gate insulating layer, an amorphous silicon layer, a first interlayer insulating layer, and a second interlayer insulating layer on a substrate; applying a photoresist on the second interlayer insulating layer, and patterning the photoresist through a photo-process; first etching the second interlayer insulating layer and the first interlayer insulating layer until at least a portion of the amorphous silicon layer is exposed by using the patterned photoresist as a mask; second etching the second interlayer insulating layer and the first interlayer insulating layer; third etching the amorphous silicon layer; and fourth etching the first gate insulating layer, wherein an etching gas used in the second etching includes a material having a higher etching selection ratio of the first and second interlayer insulating layers to the amorphous silicon layer than an etching gas used in the first etching.
Abstract:
An electronic device includes a display panel including a plurality of pixels. A first detection insulating layer is disposed on the display panel. A first conductive pattern is disposed on the first detection insulating layer. A compensation pattern is disposed on the first detection insulating layer. A second detection insulating layer is disposed on the first detection insulating layer and covers the first detection insulating layer, the compensation pattern and the first conductive pattern. A second conductive pattern is disposed on the second detection insulating layer. The first conductive pattern includes a lower surface in contact with the first detection insulating layer. An upper surface faces the lower surface and contacts the second detection insulating layer. Lateral side surfaces extend between the lower surface and the upper surface. The compensation pattern contacts the lateral side surfaces of the first conductive pattern.
Abstract:
A transistor array panel is manufactured by a method that reduces or obviates the need for highly selective etching agents or complex processes requiring multiple photomasks to create contact holes. The panel includes: a substrate; a buffer layer positioned on the substrate; a semiconductor layer positioned on the buffer layer; an intermediate insulating layer positioned on the semiconductor layer; and an upper conductive layer positioned on the intermediate insulating layer, wherein the semiconductor layer includes a first contact hole, the intermediate insulating layer includes a second contact hole positioned in an overlapping relationship with the first contact hole, and the upper conductive layer is in contact with a side surface of the semiconductor layer in the first contact hole.
Abstract:
A display device and a method for manufacturing a display device, the device including a semiconductor layer on a substrate; a gate insulation layer and an interlayer insulation layer that overlap the semiconductor layer; contact holes that penetrate the gate insulation layer and the interlayer insulation layer; a source electrode and a drain electrode that are electrically connected with the semiconductor layer through the contact holes; a light emitting diode that is connected with the drain electrode; and first spacers and second spacers between the source electrode and the interlayer insulation layer and between the drain electrode and the interlayer insulation layer in the contact holes.
Abstract:
A TFT array panel of a display device includes a first substrate, a first electrode disposed on the first substrate, a first insulating layer including a first hole, the first insulating layer disposed on the first electrode, a second insulating layer disposed on the first insulating layer and including a second hole corresponding to the first hole, and a capping layer including a first inner portion, the capping layer disposed on an inner lateral surface forming the second hole, where an end portion of the first inner portion disposed in the second hole is separated from the first electrode.