Thin film transistor array panel and method of manufacturing the same
    4.
    发明授权
    Thin film transistor array panel and method of manufacturing the same 有权
    薄膜晶体管阵列面板及其制造方法

    公开(公告)号:US09076691B2

    公开(公告)日:2015-07-07

    申请号:US13875722

    申请日:2013-05-02

    CPC classification number: H01L27/124 H01L27/1248 H01L27/322 H01L27/3248

    Abstract: A method of manufacturing a thin film transistor array panel includes: a gate insulating layer disposed on a gate electrode, a semiconductor disposed on the gate insulating layer, a source electrode opposite a drain electrode disposed on the semiconductor, a color filter disposed on the gate insulating layer, an overcoat disposed on the color filter and including an inorganic material. A first dry etching is performed using the photosensitive film pattern as a mask to etch the overcoat and provide a preliminary contact hole, through which a portion of the color filter is exposed. A second dry etching is performed using the overcoat as a mask to etch the color filter through the preliminary contact hole and to provide a contact hole, through which a portion of the drain electrode is exposed. A pixel electrode is connected to the drain electrode through the contact hole, on the overcoat.

    Abstract translation: 制造薄膜晶体管阵列面板的方法包括:设置在栅电极上的栅极绝缘层,设置在栅极绝缘层上的半导体,设置在半导体上的漏电极相对的源电极,设置在栅极上的滤色器 绝缘层,设置在滤色器上并包括无机材料的外涂层。 使用感光膜图案作为掩模进行第一干蚀刻,以蚀刻外涂层并提供初步接触孔,滤色片的一部分穿过该预接触孔。 使用外涂层作为掩模进行第二干蚀刻,以通过预接触孔蚀刻滤色器,并提供接触孔,漏电极的一部分暴露在该接触孔中。 像素电极通过外罩上的接触孔连接到漏电极。

    Display panel
    5.
    发明授权

    公开(公告)号:US11462573B2

    公开(公告)日:2022-10-04

    申请号:US16877596

    申请日:2020-05-19

    Abstract: A display panel includes a base substrate, a pixel including a thin film transistor and a display element, a first signal line connected to the pixel, and a second signal line disposed on a layer different from the first signal line. At least one of the first signal line and the second signal line includes a lower layer including a conductive material and an upper layer disposed on the lower layer and including a conductive material. The upper layer has an etch selectivity in a range equal to or greater than about 0.5 and equal to or smaller than about 3 with respect to the lower layer.

    Connecting structure of a conductive layer

    公开(公告)号:US11276580B2

    公开(公告)日:2022-03-15

    申请号:US16296646

    申请日:2019-03-08

    Abstract: A connecting structure of a conductive layer includes a first conductive layer, a first insulating layer disposed on the first conductive layer and including a first opening overlapping the first conductive layer, a connecting conductor disposed on the first insulating layer and connected to the first conductive layer through the first opening, an insulator island disposed on the connecting conductor, a second insulating layer disposed on the first insulating layer and including a second opening overlapping the connecting conductor and the insulator island, and a second conductive layer disposed on the second insulating layer and connected to a connecting electrode through the second opening. A sum of a thickness of the first insulating layer and a thickness of the second insulating layer is greater than or equal to 1 μm, and each of the thicknesses of the first and second insulating layers is less than 1 μm.

    Display device, manufacturing method thereof, and electrode forming method

    公开(公告)号:US10748943B2

    公开(公告)日:2020-08-18

    申请号:US16124356

    申请日:2018-09-07

    Abstract: A display device includes: a substrate; first and second transistors provided on the substrate to be spaced apart from each other, the first and second transistors being electrically connected to each other; and a display unit electrically connected to the first transistor, wherein the first transistor includes a first semiconductor layer including crystalline silicon, a first gate electrode, a first source electrode, and a first drain electrode, wherein the second transistor includes a second semiconductor layer including an oxide semiconductor, a second gate electrode, a second source electrode, and a second drain electrode, wherein each of the second source electrode and the second drain electrode includes a first layer that includes molybdenum and is provided on the second semiconductor layer, a second layer that includes aluminum and is provided on the first layer, and a third layer that includes titanium and is provided on the second layer.

    Transistor array panel and manufacturing method thereof

    公开(公告)号:US10741589B2

    公开(公告)日:2020-08-11

    申请号:US16215520

    申请日:2018-12-10

    Abstract: A transistor array panel is manufactured by a method that reduces or obviates the need for highly selective etching agents or complex processes requiring multiple photomasks to create contact holes. The panel includes: a substrate; a buffer layer positioned on the substrate; a semiconductor layer positioned on the buffer layer; an intermediate insulating layer positioned on the semiconductor layer; and an upper conductive layer positioned on the intermediate insulating layer, wherein the semiconductor layer includes a first contact hole, the intermediate insulating layer includes a second contact hole positioned in an overlapping relationship with the first contact hole, and the upper conductive layer is in contact with a side surface of the semiconductor layer in the first contact hole.

    Display device
    9.
    发明授权

    公开(公告)号:US10510900B2

    公开(公告)日:2019-12-17

    申请号:US15686415

    申请日:2017-08-25

    Abstract: A display device according to an exemplary embodiment of the present invention includes: a substrate; a gate line and a data line that are provided on the substrate and are insulated from each other; a thin film transistor that is connected with the gate line and the data line; and a pixel electrode that is connected with the thin film transistor, in which at least one of the gate line and the data line includes a metal layer and a blocking layer that contacts the metal layer, and the blocking layer includes a first metal from a first group including molybdenum (Mo) and tungsten (W), a second metal from a second group including vanadium (V), niobium (Nb), zirconium (Zr), and tantalum (Ta), and oxygen (O).

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