公开(公告)号：US12218850B2

公开(公告)日：2025-02-04

申请号：US17587028

申请日：2022-01-28

Applicant: MEDIATEK INC.

Inventor： Yuan-Ting Huang ,  Kai-Wen Liu ,  Yu-Hua Huang

IPC: H04L47/25

Abstract: A transmission rate management method is provided. The transmission rate management method is applied to a transmission rate management device. The transmission rate management method includes the steps of calculating a total available data traffic of the transmission rate management device based on a data plan for the transmission rate management device, wherein the total available data traffic corresponds to a period of time; allocating to each of one or more client devices currently connected to the transmission rate management device one available data traffic corresponding to the period of time according to the total available data traffic; and adjusting a transmission rate of a client device of the one or more client devices based on a remaining data traffic of the available data traffic of the client device.

公开(公告)号：US20230280913A1

公开(公告)日：2023-09-07

申请号：US18078047

申请日：2022-12-08

Applicant: MEDIATEK INC.

Inventor： Yu-Hua Huang ,  Po-Chao Fang ,  Wei-Yu Ma ,  Chung-Hsin Huang

IPC: G06F3/06 ,  G11C11/406 ,  G11C11/4074 ,  G11C11/4093

CPC classification number: G06F3/0625 ,  G11C11/40615 ,  G11C11/4074 ,  G11C11/4093 ,  G06F3/0611 ,  G06F3/0673 ,  G06F3/0659

Abstract: An electronic device includes a semiconductor chip and a first memory device. The semiconductor chip includes an input/output (I/O) interface circuit. The first memory device is external to the semiconductor chip. The semiconductor chip communicates with the first memory device via the I/O interface circuit. The semiconductor chip stores at least one hardware setting of the semiconductor chip into the first memory device before a power-off event of the semiconductor chip.

公开(公告)号：US11582822B2

公开(公告)日：2023-02-14

申请号：US16662177

申请日：2019-10-24

Applicant: MEDIATEK INC.

Inventor： Yu-Hua Huang ,  Chin-Wei Hsu

IPC: H04W60/00 ,  H04W76/16 ,  H04W80/08 ,  H04W8/20 ,  H04W76/27

Abstract: A mobile communication device including a Radio Frequency (RF) device and a controller is provided. The controller activates a predetermine Application (APP), and provides a Packet-Switched (PS) data service for the predetermined APP using a first subscriber identity via the RF device. Also, the controller establishes a Radio Resource Control (RRC) connection using a second subscriber identity via the RF device to enable the mobile communication device to enter an RRC connected mode after the predetermined APP is activated, and keeps the mobile communication device in the RRC connected mode associated with the second subscriber identity while providing the PS data service for the predetermined APP using the first subscriber identity.

公开(公告)号：US11140593B2

公开(公告)日：2021-10-05

申请号：US16513884

申请日：2019-07-17

Applicant: MEDIATEK INC.

Inventor： Guan-Jie Huang ,  Tzu-Wen Chang ,  Kuan-Wei Chen ,  Yu-Hua Huang ,  Teng Ma ,  Sheng-Kai Chang

IPC: H04W36/00 ,  H04W8/08 ,  H04W76/19 ,  H04W76/27 ,  H04W68/00 ,  H04W36/14 ,  H04W36/24

Abstract: A communications apparatus communicating with at least one cellular network includes a radio transceiver and a processor. The radio transceiver is capable of transmitting or receiving wireless radio frequency signals to or from an air interface in the cellular network. The processor is configured to determine whether an inter-RAT change will be triggered in a subsequent procedure when the communications apparatus is in a connected mode. When the processor determines that an inter-RAT change procedure will be triggered, the processor is configured to selectively perform a predetermined procedure instead of the subsequent procedure to avoid the inter-RAT change.

公开(公告)号：US09947624B2

公开(公告)日：2018-04-17

申请号：US15393387

申请日：2016-12-29

Applicant: MediaTek Inc.

Inventor： Ming-Tzong Yang ,  Cheng-Chou Hung ,  Wei-Che Huang ,  Yu-Hua Huang ,  Tzu-Hung Lin ,  Kuei-Ti Chan ,  Ruey-Beei Wu ,  Kai-Bin Wu

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/48 ,  H01L21/768 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/5384 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/14 ,  H01L25/0657 ,  H01L2224/16146 ,  H01L2225/06541 ,  H01L2225/06544

Abstract: The invention provides a semiconductor package assembly with a TSV interconnect. The semiconductor package assembly includes a first semiconductor package mounted on a base, having: a semiconductor die, a semiconductor substrate, and a first array of TSV interconnects and a second array of TSV interconnects formed through the semiconductor substrate, wherein the first array and second array of TSV interconnects are separated by an interval region. The assembly further includes a second semiconductor die mounted on the first semiconductor package, having a ground pad thereon. One of the TSV interconnects of the first semiconductor package has a first terminal coupled to the ground pad of the second semiconductor die and a second terminal coupled to an interconnection structure disposed on a front side of the semiconductor substrate.

公开(公告)号：US09640489B2

公开(公告)日：2017-05-02

申请号：US14320725

申请日：2014-07-01

Applicant: MediaTek Inc.

Inventor： Cheng-Chou Hung ,  Tung-Hsing Lee ,  Yu-Hua Huang ,  Ming-Tzong Yang

IPC: H01L21/02 ,  H01L23/00 ,  H01L23/58 ,  H01L29/94 ,  H01L27/08

CPC classification number: H01L23/562 ,  H01L23/564 ,  H01L23/585 ,  H01L27/0805 ,  H01L29/94 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor substrate of a first conductivity type having a chip region enclosed by a seal ring region. An insulating layer is on the semiconductor substrate. A seal ring structure is embedded in the insulating layer corresponding to the seal ring region. And, a plurality of doping regions are located beneath the first seal ring structure.

公开(公告)号：US09607894B2

公开(公告)日：2017-03-28

申请号：US14621682

申请日：2015-02-13

Applicant: MediaTek Inc.

Inventor： Ming-Tzong Yang ,  Cheng-Chou Hung ,  Tung-Hsing Lee ,  Wei-Che Huang ,  Yu-Hua Huang

IPC: H01L23/66 ,  H01L23/12 ,  H01L25/04 ,  H01L21/768 ,  H01L23/522 ,  H01L31/18 ,  H01L23/48 ,  H01L23/00 ,  H01L21/02 ,  H01L21/268 ,  H01L21/306

CPC classification number: H01L21/76898 ,  H01L21/02107 ,  H01L21/268 ,  H01L21/30625 ,  H01L23/481 ,  H01L23/5227 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L31/18 ,  H01L2223/6616 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/11 ,  H01L2924/12042 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device package has a base and an electronic device chip mounted on the base. The electronic device chip includes a semiconductor substrate having a front side and a back side, a electronic component disposed on the front side of the semiconductor substrate, an interconnect structure disposed on the electronic component, a through hole formed through the semiconductor substrate from the back side of the semiconductor substrate, connecting to the interconnect structure, and a TSV structure disposed in the through hole. The interconnect structure is electrically connected to the RF component, and a thickness of the semiconductor substrate is less than that of the interconnect structure.

公开(公告)号：US09570399B2

公开(公告)日：2017-02-14

申请号：US14963451

申请日：2015-12-09

Applicant: MediaTek Inc.

Inventor： Ming-Tzong Yang ,  Cheng-Chou Hung ,  Wei-Che Huang ,  Yu-Hua Huang ,  Tzu-Hung Lin ,  Kuei-Ti Chan ,  Ruey-Beei Wu ,  Kai-Bin Wu

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/48 ,  H01L21/768 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/5384 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/14 ,  H01L25/0657 ,  H01L2224/16146 ,  H01L2225/06541 ,  H01L2225/06544

Abstract: The invention provides a semiconductor package assembly with a TSV interconnect. The semiconductor package assembly includes a first semiconductor die mounted on a base. The first semiconductor die includes a semiconductor substrate. A first array of TSV interconnects and a second array of TSV interconnects are formed through the semiconductor substrate, wherein the first array and second array of TSV interconnects are separated by an interval region. A first ground TSV interconnect is disposed within the interval region. A second semiconductor die is mounted on the first semiconductor die, having a ground pad thereon. The first ground TSV interconnect of the first semiconductor die has a first terminal coupled to the ground pad of the second semiconductor die and a second terminal coupled to an interconnection structure disposed on a front side of the semiconductor substrate.

Abstract translation: 本发明提供一种具有TSV互连的半导体封装组件。 半导体封装组件包括安装在基座上的第一半导体管芯。 第一半导体管芯包括半导体衬底。 通过半导体衬底形成TSV互连的第一阵列和TSV互连的第二阵列，其中TSV互连的第一阵列和第二阵列被间隔区隔开。 第一接地TSV互连设置在间隔区域内。 第二半导体管芯安装在第一半导体管芯上，其上具有接地焊盘。 第一半导体管芯的第一接地TSV互连具有耦合到第二半导体管芯的接地焊盘的第一端子和耦合到布置在半导体衬底的前侧上的互连结构的第二端子。