Apparatus and method for processing substrate using ion beam
    21.
    发明授权
    Apparatus and method for processing substrate using ion beam 有权
    使用离子束处理衬底的设备和方法

    公开(公告)号:US09312102B2

    公开(公告)日:2016-04-12

    申请号:US13315567

    申请日:2011-12-09

    IPC分类号: H01J37/302 H01J37/305

    摘要: A method of processing a substrate in an apparatus including a substrate holder which holds the substrate, an ion source which emits an ion beam, a neutralizer which emits electrons, and a shutter which is arranged between a space in which the ion source and the neutralizer are arranged and a space in which the substrate holder is arranged, and configured to shield the ion beam traveling toward the substrate, includes adjusting an amount of electrons which are emitted by the neutralizer and reach the substrate holder during movement of the shutter.

    摘要翻译: 一种在包括保持衬底的衬底保持器,发射离子束的离子源,发射电子的中和器和快门的设备中处理衬底的方法,该快门设置在离子源和中和器之间的空间中 布置有衬底保持器布置的空间,并且被构造成屏蔽朝向衬底行进的离子束,包括调节由中和器发射的电子的量并且在快门移动期间到达衬底保持器。

    Inline-type wafer conveyance device
    22.
    发明授权
    Inline-type wafer conveyance device 有权
    直列型晶片输送装置

    公开(公告)号:US08016537B2

    公开(公告)日:2011-09-13

    申请号:US12750955

    申请日:2010-03-31

    IPC分类号: H01L21/677

    摘要: A structure is provided in which a load lock chamber (51) for carrying in an unprocessed wafer from outside and carrying out a processed wafer to outside, a first end conveyance chamber (54a) to be connected to the load lock chamber, at least one intermediate conveyance chamber (54b), a plurality of sets of a pair of process modules (52a, 52b) provided adjacent to each other and capable of independent processing, and a second end conveyance chamber (54c) disposed at the end part on the opposite side of the load lock chamber are connected in series. Each set of process modules (52a, 52b, 52c and 52d) is arranged one by one between the first end conveyance chamber and the intermediate conveyance chamber, between the intermediate conveyance chambers, and between the intermediate conveyance chamber and the second end conveyance chamber, respectively.

    摘要翻译: 提供了一种结构,其中用于从外部携带未加工的晶片并将经处理的晶片运送到外部的负载锁定室(51),要连接到负载锁定室的第一端部输送室(54a),至少一个 中间传送室(54b),彼此相邻设置并且能够独立处理的多组一对处理模块(52a,52b)和设置在相对的端部的第二端部传送室(54c) 负载锁定室的一侧串联连接。 每组处理模块(52a,52b,52c和52d)在第一端部输送室和中间输送室之间,中间输送室之间以及中间输送室和第二端部输送室之间一个接一个地布置, 分别。

    APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING ION BEAM
    23.
    发明申请
    APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING ION BEAM 有权
    使用离子束处理基板的装置和方法

    公开(公告)号:US20120145535A1

    公开(公告)日:2012-06-14

    申请号:US13315567

    申请日:2011-12-09

    IPC分类号: H01L21/02 B44C1/22 C23C14/34

    摘要: A method of processing a substrate in an apparatus including a substrate holder which holds the substrate, an ion source which emits an ion beam, a neutralizer which emits electrons, and a shutter which is arranged between a space in which the ion source and the neutralizer are arranged and a space in which the substrate holder is arranged, and configured to shield the ion beam traveling toward the substrate, includes adjusting an amount of electrons which are emitted by the neutralizer and reach the substrate holder during movement of the shutter.

    摘要翻译: 一种在包括保持衬底的衬底保持器,发射离子束的离子源,发射电子的中和器和快门的设备中处理衬底的方法,该快门设置在离子源和中和器之间的空间中 布置有衬底保持器布置的空间,并且被构造成屏蔽朝向衬底行进的离子束,包括调节由中和器发射的电子的量并且在快门移动期间到达衬底保持器。

    Substrate processing apparatus and cleaning method of the same
    24.
    发明授权
    Substrate processing apparatus and cleaning method of the same 有权
    基板处理装置及其清洗方法

    公开(公告)号:US08053747B2

    公开(公告)日:2011-11-08

    申请号:US12579636

    申请日:2009-10-15

    IPC分类号: H01L21/00

    摘要: A method for cleaning a substrate processing apparatus in which a first ion beam generator and a second ion beam generator are arranged opposite to each other to sandwich a plane on which a substrate is to be placed, and which processes two surfaces of the substrate, comprises steps of retreating the substrate from a position between the first ion beam generator and the second ion beam generator, and cleaning the second ion beam generator by emitting an ion beam from the first ion beam generator to the second ion beam generator.

    摘要翻译: 一种清洗基板处理装置的方法,其中第一离子束发生器和第二离子束发生器彼此相对布置以夹持其上放置基板的平面,并且处理基板的两个表面,包括 从第一离子束发生器和第二离子束发生器之间的位置退回衬底的步骤,以及通过从第一离子束发生器向第二离子束发生器发射离子束来清洁第二离子束发生器。

    INLINE-TYPE WAFER CONVEYANCE DEVICE
    25.
    发明申请
    INLINE-TYPE WAFER CONVEYANCE DEVICE 有权
    在线式波浪输送装置

    公开(公告)号:US20100215460A1

    公开(公告)日:2010-08-26

    申请号:US12750955

    申请日:2010-03-31

    IPC分类号: H01L21/677

    摘要: A structure is provided in which a load lock chamber (51) for carrying in an unprocessed wafer from outside and carrying out a processed wafer to outside, a first end conveyance chamber (54a) to be connected to the load lock chamber, at least one intermediate conveyance chamber (54b), a plurality of sets of a pair of process modules (52a, 52b) provided adjacent to each other and capable of independent processing, and a second end conveyance chamber (54c) disposed at the end part on the opposite side of the load lock chamber are connected in series. Each set of process modules (52a, 52b, 52c and 52d) is arranged one by one between the first end conveyance chamber and the intermediate conveyance chamber, between the intermediate conveyance chambers, and between the intermediate conveyance chamber and the second end conveyance chamber, respectively.

    摘要翻译: 提供了一种结构,其中用于从外部携带未加工的晶片并将经处理的晶片运送到外部的负载锁定室(51),要连接到负载锁定室的第一端部输送室(54a),至少一个 中间传送室(54b),彼此相邻设置并且能够独立处理的多组一对处理模块(52a,52b)和设置在相对的端部的第二端部传送室(54c) 负载锁定室的一侧串联连接。 每组处理模块(52a,52b,52c和52d)在第一端部输送室和中间输送室之间,中间输送室之间以及中间输送室和第二端部输送室之间一个接一个地布置, 分别。

    Inline-type wafer conveyance device
    26.
    发明授权
    Inline-type wafer conveyance device 有权
    直列型晶片输送装置

    公开(公告)号:US08092139B2

    公开(公告)日:2012-01-10

    申请号:US12728588

    申请日:2010-03-22

    IPC分类号: H01L21/677

    摘要: There are comprised a load chamber (51) for carrying in a wafer from outside, an unload chamber (53) for carrying out a wafer to outside, and a plurality of conveyance chambers (54a, 54b, 54c) and a plurality of process modules (52a, 52b) connected in series between the load chamber and the unload chamber. The conveyance chambers and the process modules are connected alternately and the plurality of conveyance chambers includes a first end conveyance chamber (54a) connected to the load chamber, a second end conveyance chamber (54c) connected to the unload chamber, and another one or a plurality of intermediate conveyance chambers (54b).

    摘要翻译: 包括用于从外部承载晶片的负载室(51),用于将晶片运送到外部的卸载室(53)和多个输送室(54a,54b,54c)和多个处理模块 (52a,52b)串联连接在负载室和卸载室之间。 传送室和处理模块交替连接,多个传送室包括连接到装载室的第一端部传送室(54a),连接到卸载室的第二端部传送室(54c),以及另一个或 多个中间输送室(54b)。

    INLINE-TYPE WAFER CONVEYANCE DEVICE
    27.
    发明申请
    INLINE-TYPE WAFER CONVEYANCE DEVICE 有权
    在线式波浪输送装置

    公开(公告)号:US20100239394A1

    公开(公告)日:2010-09-23

    申请号:US12728588

    申请日:2010-03-22

    IPC分类号: H01L21/677

    摘要: There are comprised a load chamber (51) for carrying in a wafer from outside, an unload chamber (53) for carrying out a wafer to outside, and a plurality of conveyance chambers (54a, 54b, 54c) and a plurality of process modules (52a, 52b) connected in series between the load chamber and the unload chamber. The conveyance chambers and the process modules are connected alternately and the plurality of conveyance chambers includes a first end conveyance chamber (54a) connected to the load chamber, a second end conveyance chamber (54c) connected to the unload chamber, and another one or a plurality of intermediate conveyance chambers (54b).

    摘要翻译: 包括用于从外部承载晶片的负载室(51),用于将晶片输送到外部的卸载室(53)和多个输送室(54a,54b,54c)和多个处理模块 (52a,52b)串联连接在负载室和卸载室之间。 传送室和处理模块交替连接,多个传送室包括连接到装载室的第一端部传送室(54a),连接到卸载室的第二端部传送室(54c),以及另一个或 多个中间输送室(54b)。