公开(公告)号：US20170221961A1

公开(公告)日：2017-08-03

申请号：US15487132

申请日：2017-04-13

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Alexander Bietsch ,  Hartmut Rudmann ,  Markus Rossi ,  Simon Gubser

IPC: H01L27/146 ,  G02B13/00

CPC classification number: H01L27/14687 ,  G01J3/0208 ,  G01J3/0256 ,  G02B13/0085 ,  G02B21/367 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/0547 ,  H01L2924/0002 ,  Y02E10/52 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  H01L2924/00

Abstract: A method for manufacturing one or more optical devices, each comprising a first member and a second member, and a spacer arranged between the first and second members. The method includes manufacturing a spacer wafer including a multitude of the spacers. Manufacturing the spacer wafer includes providing a replication tool having spacer replication sections; bringing the replication tool in contact with a first surface of another wafer; bringing a vacuum sealing chuck into contact with a second surface of the other wafer while the other wafer remains in contact with the replication tool; and injecting a liquid, viscous or plastically deformable material through an inlet of the vacuum sealing chuck so as to substantially fill the spacer replication sections.

公开(公告)号：US20140339664A1

公开(公告)日：2014-11-20

申请号：US14366770

申请日：2012-12-18

Applicant: Heptagon Micro Optics Pte. Ltd. ,  Heptagon Oy

Inventor： Markus Rossi ,  Hartmut Rudmann ,  Stephan Heimgartner ,  Alexander Bietsch ,  Robert Lenart

IPC: H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L27/14818 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The optical device comprises a first substrate (SI) comprising at least one optical structure (1) comprising a main portion (2) and a surrounding portion (3) at least partially surrounding said main portion. The device furthermore comprises non-transparent material (5, 5a, 5b) applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

Abstract translation: 光学装置包括包括至少一个光学结构（1）的第一基板（S1），该至少一个光学结构（1）包括主要部分（2）和至少部分地围绕所述主要部分的环绕部分（3）。 该装置还包括施加到所述周围部分上的不透明材料（5,5a，5b）。 所述光电模块包括包含在所述第一衬底中的多个这些光学器件。 制造光学器件的方法包括以下步骤：a）提供包括至少一个光学结构的第一衬底，该至少一个光学结构包括至少部分地围绕所述主要部分的主要部分和环绕部分; 以及b）将不透明材料施加到至少所述周围部分上。 所述不透明材料存在于仍在最终光学装置中的至少所述周围部分上。

公开(公告)号：US20140167196A1

公开(公告)日：2014-06-19

申请号：US14177552

申请日：2014-02-11

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: H01L27/146 ,  H01L31/18

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

公开(公告)号：US10101555B2

公开(公告)日：2018-10-16

申请号：US14905391

申请日：2014-07-16

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasirnio ,  Hartmut Rudmann ,  Mario Cesana ,  Stephan Heimgartner

IPC: H04N5/225 ,  G02B7/02 ,  G03B17/02 ,  G03B29/00

Abstract: Camera modules include a lens, a lens stack and/or an array of lenses. One or more of the lenses have a non-circular shape, which in some cases can provide greater flexibility in the dimensions of the module and can result in a very small camera module.

公开(公告)号：US10096644B2

公开(公告)日：2018-10-09

申请号：US15487132

申请日：2017-04-13

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Alexander Bietsch ,  Hartmut Rudmann ,  Markus Rossi ,  Simon Gubser

IPC: H04N5/225 ,  H01L27/146 ,  G02B13/00 ,  H01L31/0203 ,  H01L31/0232 ,  G02B21/36 ,  H01L31/054

Abstract: A method for manufacturing one or more optical devices, each comprising a first member and a second member, and a spacer arranged between the first and second members. The method includes manufacturing a spacer wafer including a multitude of the spacers. Manufacturing the spacer wafer includes providing a replication tool having spacer replication sections; bringing the replication tool in contact with a first surface of another wafer; bringing a vacuum sealing chuck into contact with a second surface of the other wafer while the other wafer remains in contact with the replication tool; and injecting a liquid, viscous or plastically deformable material through an inlet of the vacuum sealing chuck so as to substantially fill the spacer replication sections.

公开(公告)号：US20180102394A1

公开(公告)日：2018-04-12

申请号：US15828664

申请日：2017-12-01

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L27/146 ,  H01L33/58 ,  H01L31/0203 ,  H01L31/0232

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

公开(公告)号：US09826131B2

公开(公告)日：2017-11-21

申请号：US15024133

申请日：2014-09-17

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasirniö ,  Stephan Heimgartner

IPC: H04N5/225 ,  H01L27/146 ,  H05K3/28

CPC classification number: H04N5/2257 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2924/19105 ,  H04N5/2252 ,  H05K3/284 ,  H01L2924/00014

Abstract: Compact camera module can include auxiliary spacers to facilitate use of dam-and-fill encapsulation techniques. An encapsulant disposed on side edges of the auxiliary spacer can close off a gap between the auxiliary spacer and a support on which an image sensor is mounted so as to substantially seal off an area in which bond wires or other components are located. In some cases, the thickness of a transmissive substrate in the module can be reduced near its periphery to provide more head room for the bond wires, which can result in a smaller overall footprint for the module.

公开(公告)号：US09793152B2

公开(公告)日：2017-10-17

申请号：US14408890

申请日：2013-06-28

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Stephan Heimgartner ,  John A. Vidallon

IPC: H01L21/68 ,  H01L21/683 ,  B32B37/18 ,  B32B37/12 ,  B32B38/18

CPC classification number: H01L21/6838 ,  B32B37/12 ,  B32B37/18 ,  B32B38/1858 ,  B32B2457/00 ,  B32B2551/00

Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.

公开(公告)号：US20170139178A1

公开(公告)日：2017-05-18

申请号：US15322884

申请日：2015-06-09

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Markus Rossi ,  Stephan Heimgartner

IPC: G02B7/02 ,  G02B27/09 ,  G02B1/04

Abstract: According to embodiments of the present invention, an apparatus comprising a beam shaping element (lens) is provided. The apparatus comprises a substrate; a beam shaping element; and an elastic intermediate layer disposed between, and in contact with, the substrate and the beam shaping element, wherein the elastic intermediate layer has a Young's Modulus in a range of 2-600 MPa and a Poisson's ratio in a range of 0.2-0.5. Techniques for reducing thermal distortion of lens are described.

公开(公告)号：US20170077162A1

公开(公告)日：2017-03-16

申请号：US15341210

申请日：2016-11-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Markus Rossi ,  Hartmut Rudmann ,  Stephan Heimgartner ,  Alexander Bietsch ,  Robert Lenart

IPC: H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L27/14818 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The optical device comprises a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion. The device furthermore comprises non-transparent material applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate.The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

Abstract translation: 所述不透明材料存在于仍在最终光学装置中的至少所述周围部分上。