-
公开(公告)号：US09091568B2
公开(公告)日：2015-07-28
申请号：US14518197
申请日：2014-10-20
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Jens Geiger , Daniel Reymann
CPC classification number: G01D5/34707 , G01D5/34715 , G01D5/3473
Abstract: An optical encoder system includes a module that has a light emitting element and a light detecting element, wherein the light detecting element is operable to detect light at a wavelength emitted by the light emitting element. The optical encoder system also includes a code wheel that has facets on its surface. Each facet has a surface that provides diffuse reflectance, with adjacent facets being inclined by different amounts. The code wheel can be disposed with respect to the module so that at least some light emitted by the light emitting element is reflected by the facets back toward the module, wherein an amount of reflected light detected by the light detecting element in the module depends at least in part on the rotational position of the code wheel.
Abstract translation: 光学编码器系统包括具有发光元件和光检测元件的模块，其中光检测元件可操作以检测由发光元件发射的波长的光。 光学编码器系统还包括在其表面上具有刻面的编码轮。 每个小面具有提供漫反射率的表面，其中相邻小面倾斜不同的量。 代码轮可以相对于模块设置，使得由发光元件发射的至少一些光被小面反射回模块，其中由模块中的光检测元件检测到的反射光的量取决于 至少部分地在码轮的旋转位置。
-
22.发明申请OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES 有权具有遮光以减少光泄漏或光照的光电模块，以及用于这些模块的制造方法公开(公告)号：US20150034975A1
公开(公告)日：2015-02-05
申请号：US14339657
申请日：2014-07-24
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L31/16 , H01L27/146
CPC classification number: H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
Abstract translation: 描述了包括光电子器件（例如，发光或光检测元件）和透明盖的各种光电模块。 在透明盖的侧壁上设置不透明材料，在一些实施方式中，这可以帮助减少透明盖的侧面的光泄漏，或有助于防止杂散光进入模块。 还描述了制造模块的制造技术。
-
公开(公告)号：US10199426B2
公开(公告)日：2019-02-05
申请号：US15828664
申请日：2017-12-01
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L27/146 , H01L31/0203 , H01L31/0232 , H01L33/58
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
-
公开(公告)号：US20180124327A1
公开(公告)日：2018-05-03
申请号：US15121459
申请日：2015-02-23
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Jukka Alasirnio , Tobias Senn , Ohad Meitav , Moshe Doron , Alireza Yasan , Mario Cesana , Florin Cutu , Hartmut Rudmann , Markus Rossi , Peter Roentgen , Daniel Perez Calero , Bassam Hallal , Jens Geiger
Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
-
公开(公告)号：US20170248472A1
公开(公告)日：2017-08-31
申请号：US15510085
申请日：2015-09-08
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Peter Roentgen , Jens Geiger , Markus Rossi
IPC: G01J9/00 , H01L27/144 , H01L31/0232 , G01J3/28
CPC classification number: G01J9/00 , G01J1/0488 , G01J1/4257 , G01J3/2803 , G01J3/36 , G01J2003/1213 , H01L27/1443 , H01L27/1446 , H01L27/14621 , H01L27/14647 , H01L31/02327
Abstract: The present disclosure describes optical radiation sensors and detection techniques that facilitate assigning a specific wavelength to a measured photocurrent. The techniques can be used to determine the spectral emission characteristics of a radiation source. In one aspect, a method of determining spectral emission characteristics of incident radiation includes sensing at least some of the incident radiation using a light detector having first and second photosensitive regions whose optical responsivity characteristics differ from one another. The method further includes identifying a wavelength of the incident radiation based on a ratio of a photocurrent from the first region and a photocurrent from the second region.
-
Patent Agency Ranking
公开(公告)号：US09658109B2
公开(公告)日：2017-05-23
申请号：US14774533
申请日：2014-03-12
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Jens Geiger
CPC classification number: G01J5/0806 , G01J5/0215 , G01J5/04 , G01J5/046 , G01J5/06 , G01J5/0815 , G01J5/10
Abstract: Compact thermal sensor modules, which in some implementations can be manufactured in wafer-level fabrication processes, include features composed of or coated with a low-emissivity material to reduce or prevent detection by a sensor of radiation emitted by other parts of the module. For example, spacers that separate an optics substrate and a sensor package from one another can be composed of or coated with such a low emissivity material. In some cases, the low emissivity material has an emissivity of no more than 0.1.
-
27.发明授权公开(公告)号：US09613939B2
公开(公告)日：2017-04-04
申请号：US14760059
申请日：2014-01-02
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Markus Rossi , Jens Geiger
IPC: H01L25/16 , H01L33/58 , H01L31/0232
CPC classification number: H01L25/167 , H01L25/165 , H01L31/02325 , H01L33/58 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
Abstract: Opto-electronic modules, which can be fabricated in a wafer-scale process, include light emitting and/or light sensing devices mounted on or in a substrate. The modules, which can include various features to help reduce the occurrence of optical cross-talk and help prevent interference from stray light, can be used in a wide range of applications, including medical and health-related applications. For example, performing a measurement on a human body can include bringing a portion of the human body into direct contact with an exterior surface of the opto-electronic module and using a differential optical absorption spectroscopy technique to obtain an indication of a physical condition of the human body.
-
28.发明授权公开(公告)号：US09608181B2
公开(公告)日：2017-03-28
申请号：US14649425
申请日：2013-12-17
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Jens Geiger , René Kromhof
IPC: H01L27/15 , H01L29/267 , H01L31/12 , H01L33/00 , H01L33/58 , H01L33/48 , G02B5/00 , G03B15/04 , H04N1/60 , H01L33/60 , G03B29/00 , G03B7/16 , G03B15/05 , H01L33/44
CPC classification number: H01L33/58 , G02B5/003 , G03B7/16 , G03B15/04 , G03B15/05 , G03B29/00 , G03B2215/05 , H01L33/44 , H01L33/483 , H01L33/486 , H01L33/60 , H04N1/6086
Abstract: Opto-electronic modules include masking features that can help reduce the visibility of interior components or enhance the outer appearance of the module or of an appliance incorporating the module as a component. The modules can include an optical diode or saturable optical absorber.
-
29.发明申请OPTOELECTRONIC MODULES HAVING FEATURES FOR REDUCING THE VISUAL IMPACT OF INTERIOR COMPONENTS 审中-公开具有减少内部组件视觉冲击的特性的光电模块公开(公告)号：US20170047487A1
公开(公告)日：2017-02-16
申请号：US15304269
申请日：2015-04-14
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Markus Rossi , Jens Geiger , Jonathan Hobbis , René Kromhof , Olivier Ripoll
IPC: H01L33/50 , F21V9/16 , F21V9/08 , F21V23/06 , G02B5/23 , G03B15/06 , H01L33/48 , H01L33/58 , H01L33/60 , F21V3/04 , F21V7/22
CPC classification number: H01L33/502 , F21V3/04 , F21V7/22 , F21V9/08 , F21V9/30 , F21V23/06 , F21Y2115/10 , G02B5/23 , G03B15/05 , G03B15/06 , G03B2215/0567 , G03B2215/0582 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/58 , H01L33/60
Abstract: Light emitting modules, such as flash modules, include features to help reduce the visual impact of interior components and shield them from view. The features also may enhance the outer appearance of the module or of an appliance incorporating the module.
Abstract translation: 诸如闪光灯模块的发光模块包括有助于减少内部组件的视觉冲击并屏蔽它们的功能。 这些特征还可以增强模块或结合模块的装置的外观。
-
30.发明申请公开(公告)号：US20160223746A1
公开(公告)日：2016-08-04
申请号：US15014244
申请日：2016-02-03
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Simon Gubser , Frank Sobel , Alexander Bietsch , Jens Geiger
CPC classification number: G02B6/0065 , B29D11/00663
Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.
Abstract translation: 波导结构可以在晶片级制造，并且包括保持结构和每个具有芯和两个端面的第一和第二波导。 保持结构包括布置在第一和第二波导之间的分离结构，并且在第一和第二波导的端面之间的区域中提供第一和第二波导之间的光学隔离。 用于制造具有至少一个波导的这种波导结构的方法包括通过工具结构对复制材料进行成形以获得端面，硬化复制材料并从包括多个如此获得的波导的波导结构晶片中去除工具结构 。
-
-
-
-
-
-
-
-
-
Search Results
43
records
(took 0.027 seconds)
