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    Methods and heat distribution devices for thermal management of chip assemblies
    21.
    发明授权
    Methods and heat distribution devices for thermal management of chip assemblies 有权

    公开(公告)号：US11600548B2

    公开(公告)日：2023-03-07

    申请号：US17333607

    申请日：2021-05-28

    Applicant: Google LLC

    Inventor： Woon-Seong Kwon ,  Yuan Li ,  Zhi Yang

    IPC: H01L23/373 ,  H01L23/00 ,  H05K3/34 ,  H05K7/20 ,  H01L25/065

    Abstract: According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may extend around the microelectronic element. The stiffener element may include a first material that has a first coefficient of thermal expansion (“CTE”). A surface of the stiffener element may face toward the heat distribution device. The heat distribution device may include a second material that has a second CTE. The first material may be different than the second material. The first CTE of the first material of the stiffener element may be greater than the second CTE of the second material of the heat distribution device.

    Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies
    22.
    发明申请
    Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies 有权

    公开(公告)号：US20210375715A1

    公开(公告)日：2021-12-02

    申请号：US17333607

    申请日：2021-05-28

    Applicant: Google LLC

    Inventor： Woon-Seong Kwon ,  Yuan Li ,  Zhi Yang

    IPC: H01L23/373 ,  H01L23/00

    Abstract: According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may extend around the microelectronic element. The stiffener element may include a first material that has a first coefficient of thermal expansion (“CTE”). A surface of the stiffener element may face toward the heat distribution device. The heat distribution device may include a second material that has a second CTE. The first material may be different than the second material. The first CTE of the first material of the stiffener element may be greater than the second CTE of the second material of the heat distribution device.

    Direct Liquid Cooling With O-Ring Sealing
    23.
    发明申请
    Direct Liquid Cooling With O-Ring Sealing 有权

    公开(公告)号：US20210366807A1

    公开(公告)日：2021-11-25

    申请号：US16880417

    申请日：2020-05-21

    Applicant: Google LLC

    Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

    IPC: H01L23/433 ,  H01L25/065

    Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

    LEARNING UNIFIED EMBEDDING
    24.
    发明申请
    LEARNING UNIFIED EMBEDDING 审中-公开

    公开(公告)号：US20200090039A1

    公开(公告)日：2020-03-19

    申请号：US16494842

    申请日：2017-11-17

    Applicant: Google LLC

    Inventor： Yang Song ,  Yuan Li ,  Bo Wu ,  Chao-Yeh Chen ,  Xiao Zhang ,  Hartwig Adam

    IPC: G06N3/08 ,  G06N20/00 ,  G06K9/32

    Abstract: A computer-implemented method for generating a unified machine learning model using a neural network on a data processing apparatus is described. The method includes the data processing apparatus determining respective learning targets for each of a plurality of object verticals. The data processing apparatus determines the respective learning targets based on two or more embedding outputs of the neural network. The method also includes the data processing apparatus training the neural network to identify data associated with each of the plurality of object verticals. The data processing apparatus trains the neural network using the respective learning targets and based on a first loss function. The data processing apparatus uses the neural network trained to generate a unified machine learning model, where the model is configured to identify particular data items associated with each of the plurality of object verticals.

    COOLING ELECTRONIC DEVICES IN A DATA CENTER
    25.
    发明申请
    COOLING ELECTRONIC DEVICES IN A DATA CENTER 审中-公开

    公开(公告)号：US20190327859A1

    公开(公告)日：2019-10-24

    申请号：US15957161

    申请日：2018-04-19

    Applicant: Google LLC

    Inventor： Madhusudan Krishnan Iyengar ,  Christopher Gregory Malone ,  Yuan Li ,  Jorge Padilla ,  Woon Seong Kwon ,  Teckgyu Kang ,  Norman Paul Jouppi

    IPC: H05K7/20

    Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

    System and method for associating images with semantic entities
    26.
    发明授权
    System and method for associating images with semantic entities 有权

    公开(公告)号：US10268703B1

    公开(公告)日：2019-04-23

    申请号：US15372568

    申请日：2016-12-08

    Applicant: Google LLC

    Inventor： Maks Ovsjanikov ,  Yuan Li ,  Hartwig Adam ,  Charles Joseph Rosenberg

    IPC: G06F17/30

    Abstract: A system and computer-implemented method for associating images with semantic entities and providing search results using the semantic entities. An image database contains one or more source images associated with one or more images labels. A computer may generate one or more documents containing the labels associated with each image. Analysis may be performed on the one or more documents to associate the source images with semantic entities. The semantic entities may be used to provide search results. In response to receiving a target image as a search query, the target image may be compared with the source images to identify similar images. The semantic entities associated with the similar images may be used to determine a semantic entity for the target image. The semantic entity for the target image may be used to provide search results in response to the search initiated by the target image.

    Direct liquid cooling with O-ring sealing
    27.
    发明授权
    Direct liquid cooling with O-ring sealing 有权

    公开(公告)号：US12272619B2

    公开(公告)日：2025-04-08

    申请号：US17971087

    申请日：2022-10-21

    Applicant: Google LLC

    Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

    IPC: H01L23/433 ,  H01L25/065

    Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

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