Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, method for manufacturing electronic device, and electronic device
    23.
    发明授权
    Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, method for manufacturing electronic device, and electronic device 有权
    图案形成方法,光化射线敏感或辐射敏感性树脂组合物,抗蚀剂膜,电子器件的制造方法和电子器件

    公开(公告)号:US09523913B2

    公开(公告)日:2016-12-20

    申请号:US14093781

    申请日:2013-12-02

    Abstract: A pattern forming method comprises (i) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition containing: (A) a resin containing a repeating unit having a group capable of decomposing by the action of an acid to produce a polar group, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and (C) a solvent, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern, wherein the content of a repeating unit represented by the following formula (I) is less than 20 mol % based on all repeating units in the resin (A) and the resin (A) contains a repeating unit having a non-phenolic aromatic group other than the repeating unit represented by the specific formula.

    Abstract translation: 图案形成方法包括:(i)通过使用光化射线敏感或辐射敏感性树脂组合物形成膜的步骤,所述树脂组合物包含:(A)含有具有能够通过酸的作用分解的基团的重复单元的树脂 以产生极性基团,(B)在用光化射线或辐射照射时能够产生酸的化合物,和(C)溶剂,(ii)暴露薄膜的步骤,和(iii)显影步骤 通过使用含有机溶剂的显影剂形成负图案的曝光膜,其中由下式(I)表示的重复单元的含量相对于树脂(A)中的所有重复单元和 树脂(A)含有除具有上述特定结构式的重复单元以外的非酚性芳香族基团的重复单元。

    Negative pattern forming method and resist pattern
    28.
    发明授权
    Negative pattern forming method and resist pattern 有权
    负图案形成方法和抗蚀剂图案

    公开(公告)号:US08859192B2

    公开(公告)日:2014-10-14

    申请号:US13904236

    申请日:2013-05-29

    CPC classification number: G03F7/20 G03F7/0397 G03F7/325 G03F7/40 Y10T428/24802

    Abstract: A negative pattern forming method, includes: (i) forming a film having a film thickness of 200 nm or more from a chemical amplification resist composition containing (A) a resin capable of increasing a polarity of the resin (A) by an action of an acid to decrease a solubility of the resin (A) for a developer containing one or more organic solvents, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and (C) a solvent; (ii) exposing the film, so as to form an exposed film; and (iii) developing the exposed film with a developer containing one or more organic solvents.

    Abstract translation: 负图案形成方法包括:(i)从含有(A)树脂(A)的树脂的树脂(A)的极性增加的树脂的化学放大抗蚀剂组合物形成膜厚度为200nm以上的膜, 降低对含有一种或多种有机溶剂的显影剂的树脂(A)的溶解度的酸,(B)在用光化射线或辐射照射时能够产生酸的化合物和(C)溶剂; (ii)使膜曝光,形成曝光膜; 和(iii)用含有一种或多种有机溶剂的显影剂显影曝光的薄膜。

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