- Patent Title: Pattern forming method, method for producing electronic device, and actinic ray-sensitive or radiation-sensitive resin composition for organic solvent development
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Application No.: US15657295Application Date: 2017-07-24
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Publication No.: US10859914B2Publication Date: 2020-12-08
- Inventor: Naoya Hatakeyama , Akiyoshi Goto , Michihiro Shirakawa , Keita Kato , Keiyu Ou
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2015-036685 20150226; JP2015-152934 20150731; JP2015-255232 20151225
- Main IPC: G03F7/075
- IPC: G03F7/075 ; G03F7/004 ; G03F7/38 ; G03F7/039 ; G03F7/20 ; G03F7/32 ; G03F7/16

Abstract:
A method for producing an electronic device includes the pattern forming method, and an actinic ray-sensitive or radiation-sensitive resin composition for organic solvent development. Specifically, provided is a pattern forming method, including a film forming step of forming a film by an actinic ray-sensitive or radiation-sensitive resin composition, an exposure step of irradiating the film, and a development step of developing the film using a developer containing an organic solvent, in which the composition contains a resin containing a repeating unit having an Si atom and a repeating unit having an acid-decomposable group and a compound capable of generating an acid upon irradiation with actinic rays or radiation, the content of Si atoms in the resin is 1.0 to 30 mass %, and the content of the resin in the total solid content of the composition is 20 mass % or more.
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