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公开(公告)号：US12002725B2
公开(公告)日：2024-06-04
申请号：US18199215
申请日：2023-05-18
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
IPC分类号： H01L23/15 , G06V40/13 , H01L23/00 , H01L21/56 , H01L23/31 , H01L23/495 , H01L23/498
CPC分类号： H01L23/15 , G06V40/1329 , H01L24/48 , H01L21/561 , H01L23/3121 , H01L23/4952 , H01L23/49805 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/02166 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48105 , H01L2224/48165 , H01L2224/48227 , H01L2224/48992 , H01L2224/48997 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15313 , H01L2924/181 , H01L2224/97 , H01L2224/83 , H01L2224/97 , H01L2224/85 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2224/45099 , H01L2224/05647 , H01L2924/00015 , H01L2224/05624 , H01L2924/00015 , H01L2224/05639 , H01L2924/00015 , H01L2224/05644 , H01L2924/00015 , H01L2224/05655 , H01L2924/00015 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2224/92247 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2224/2919 , H01L2924/00014 , H01L2224/48091 , H01L2924/00014
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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公开(公告)号：US20230290699A1
公开(公告)日：2023-09-14
申请号：US18199215
申请日：2023-05-18
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
CPC分类号： H01L23/15 , H01L24/48 , G06V40/1329 , H01L23/49805
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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公开(公告)号：US20210111151A1
公开(公告)日：2021-04-15
申请号：US17080038
申请日：2020-10-26
IPC分类号： H01L23/00 , H01L23/31 , H01L23/12 , H01L23/498 , H01L21/56
摘要： Methods and systems for a thin bonded interposer package are disclosed and may, for example, include bonding a semiconductor die to a first surface of a substrate, forming contacts on the first surface of the substrate, encapsulating the semiconductor die, formed contacts, and first surface of the substrate using a mold material while leaving a top surface of the semiconductor die not encapsulated by mold material, forming vias through the mold material to expose the formed contacts. A bond line may be dispensed on the mold material and the semiconductor die for bonding the substrate to an interposer. A thickness of the bond line may be defined by standoffs formed on the top surface of the semiconductor die.
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公开(公告)号：US20240321658A1
公开(公告)日：2024-09-26
申请号：US18680167
申请日：2024-05-31
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
IPC分类号： H01L23/15 , G06V40/13 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/495 , H01L23/498
CPC分类号： H01L23/15 , G06V40/1329 , H01L24/48 , H01L21/561 , H01L23/3121 , H01L23/4952 , H01L23/49805 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/02166 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48105 , H01L2224/48165 , H01L2224/48227 , H01L2224/48992 , H01L2224/48997 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15313 , H01L2924/181
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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公开(公告)号：US11855000B2
公开(公告)日：2023-12-26
申请号：US17832952
申请日：2022-06-06
发明人： Young Woo Lee , Jae Ung Lee , Byong Jin Kim , EunNaRa Cho , Ji Hoon Oh , Young Seok Kim , Jin Young Khim , Tae Kyeong Hwang , Jin Seong Kim , Gi Jung Kim
IPC分类号： H01L23/31 , H01L23/552 , H01L23/00 , H01L23/498 , H01L21/48 , H01L21/56 , H01L23/538 , H01L25/065
CPC分类号： H01L23/552 , H01L21/486 , H01L21/4853 , H01L21/4889 , H01L21/565 , H01L23/3114 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L24/16 , H01L21/561 , H01L23/3128 , H01L23/49816 , H01L23/5383 , H01L23/5384 , H01L25/0655 , H01L2224/16227 , H01L2224/73204 , H01L2224/97 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H01L2224/97 , H01L2224/81 , H01L2924/181 , H01L2924/00012
摘要： An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package. In another embodiment, the electrical connection is made through the substrate.
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公开(公告)号：US20230118400A1
公开(公告)日：2023-04-20
申请号：US17977164
申请日：2022-10-31
发明人： Jin Seong Kim , Edwin J. Adlam , Ludovico E. Bancod , Gi Jung Kim , Robert Lanzone , Jae Ung Lee , Yung Woo Lee , Mi Kyeong Choi
IPC分类号： H01L25/065 , H01L23/552 , H01L23/31 , H01L21/56 , H01L21/48 , H01L23/498 , H01L25/00
摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
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公开(公告)号：US11355449B2
公开(公告)日：2022-06-07
申请号：US16857439
申请日：2020-04-24
发明人： Young Woo Lee , Jae Ung Lee , Byong Jin Kim , EunNaRa Cho , Ji Hoon Oh , Young Seok Kim , Jin Young Khim , Tae Kyeong Hwang , Jin Seong Kim , Gi Jung Kim
IPC分类号： H01L23/49 , H01L23/552 , H01L23/00 , H01L23/498 , H01L23/31 , H01L21/48 , H01L21/56 , H01L23/538 , H01L25/065
摘要： An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package. In another embodiment, the electrical connection is made through the substrate.
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公开(公告)号：US11158582B2
公开(公告)日：2021-10-26
申请号：US16703240
申请日：2019-12-04
发明人： Jin Seong Kim , Yeong Beom Ko , Kwang Seok Oh , Jo Hyun Bae , Sung Woo Lim , Yun Ah Kim , Yong Jae Ko , Ji Chang Lee
IPC分类号： H01L23/538 , H01L23/31 , H01L21/78 , H01L21/48 , H01L21/56
摘要： In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.
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公开(公告)号：US20210288010A1
公开(公告)日：2021-09-16
申请号：US17193478
申请日：2021-03-05
发明人： Gyu Wan Han , Jin Seong Kim , Byong Woo Cho
摘要： An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of making electronic devices, and electronic devices manufactured thereby, that comprise utilizing a compressed interconnection structure (e.g., a compressed solder ball, etc.) in an encapsulating process to form an aperture in an encapsulant. The compressed interconnection structure may then be reformed in the aperture.
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