Lithographic apparatus and device manufacturing method
    21.
    发明授权
    Lithographic apparatus and device manufacturing method 有权
    平版印刷设备和器件制造方法

    公开(公告)号:US09429853B2

    公开(公告)日:2016-08-30

    申请号:US14664360

    申请日:2015-03-20

    CPC classification number: G03F7/70716 G03F7/70341 G03F7/70808

    Abstract: A lithographic apparatus, including a movable table, a projection system configured to project a patterned radiation beam onto a substrate, and a liquid supply system configured to provide liquid to a space between a final element of the projection system and the table, the liquid supply system including an inlet configured to provide liquid to the space, the inlet including an array of inlet orifices located below a bottom surface of the final element and configured to provide an essentially horizontal flow of liquid therefrom, the array of inlet orifices extending along a side of an exposure field of the patterned radiation beam, and an extractor configured to remove liquid from the space, the extractor including a two dimensional array of outlet orifices, extending at least partly in a horizontal direction, through which the liquid can be extracted from the space.

    Abstract translation: 一种光刻设备,包括可移动台,配置成将图案化辐射束投影到基板上的投影系统以及被配置为向投影系统的最终元件和台之间的空间提供液体的液体供应系统,液体供应 系统,其包括被配置为向该空间提供液体的入口,入口包括位于最终元件的底表面下方的入口孔阵列,并被配置为从其提供基本上水平的液体流,沿着一侧延伸的入口孔阵列 所述图案化辐射束的曝光区域以及被配置为从所述空间移除液体的提取器,所述提取器包括至少部分地沿水平方向延伸的出口孔的二维阵列,通过所述出口孔可以从 空间。

    THERMAL CONDITIONING UNIT, LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD
    22.
    发明申请
    THERMAL CONDITIONING UNIT, LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD 有权
    热调节单元,平面设备和设备制造方法

    公开(公告)号:US20150070666A1

    公开(公告)日:2015-03-12

    申请号:US14395461

    申请日:2013-04-16

    Abstract: A thermal conditioning unit to thermally condition a substrate, the thermal conditioning unit including: a thermal conditioning element having a first layer, in use, facing the substrate and including a material having a thermal conductivity of 100 W/mK or more, a second layer and a heat transfer component positioned between the first and second layers; and a stiffening member which is stiffer than the thermal conditioning element and configured to support the thermal conditioning element so as to reduce mechanical deformation thereof, wherein the thermal conditioning element is thermally isolated from the stiffening member.

    Abstract translation: 一种用于对基材进行热调节的热调节单元,所述热调节单元包括:热调节元件,其在使用中具有面向所述基板的第一层,并且包括具有100W / mK以上的导热率的材料,第二层 和位于第一和第二层之间的传热部件; 以及加热构件,其比所述热调节元件更硬,并且构造成支撑所述热调节元件,以便减小其机械变形,其中所述热调节元件与所述加强构件热隔离。

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