Abstract:
A NAND cell unit includes memory cells which are connected in series. An erase operation is effected on all memory cells. Then, a soft-program voltage, which is opposite in polarity to the erase voltage applied in an erase operation, is applied to all memory cells, thereby setting all memory cells out of an over-erased state. Thereafter, a program voltage of 20V is applied to the control gate of a selected memory cell, 0V is applied to the control gates of the two memory cells provided adjacent to the selected memory cell, and 11V is applied to the control gates of the remaining memory cells. Data is thereby programmed into the selected memory cell. The time for which the program voltage is applied to the selected memory cell is adjusted in accordance with the data to be programmed into the selected memory cell. Hence, data “0” can be correctly programmed into the selected memory cell, multi-value data can be read from any selected memory cell at high speed.
Abstract:
A boost circuit includes: first transistors connected in series between a voltage input node and a voltage output node to constitute a charge transfer circuit; and first capacitors, one ends of which are coupled to the respective connection nodes between the first transistors, the other ends thereof being applied with clocks with plural phases, wherein a gate of a certain stage transistor corresponding to one of the first transistors in the charge transfer circuit is coupled to a drain of another stage transistor corresponding to another one of the first transistors, which is disposed nearer to the voltage output node than the certain stage transistor and driven by the same phase clock as that of the certain stage transistor, the certain stage transistor being disposed nearer to the voltage output node than an initial stage transistor.
Abstract:
In a semiconductor integrated circuit, an internal circuit is capable of executing a first operation and a second operation concurrently, and an output circuit outputs to the outside of the semiconductor integrated circuit information indicating whether or not the first operation is being executed and information indicating whether or not the second operation is executable.
Abstract:
A negative electrode for a lithium secondary cell having a collector composed of an electroconductive metal foil and, provided on the surface thereof, an active material layer containing active material particles containing silicon and/or a silicon alloy and a binder, characterized in that the binder has mechanical characteristics of a tensile strength of 50 N/mm2 or more, an elongation at break of 10% or more, a strain energy density of 2.5×10−3 J/mm3 or more and a coefficient of elasticity of 10000 N/mm2 or less, and preferably characterized in that the collector has mechanical characteristics of a tensile strength of 80 N/mm2 or more, a proportional limit 30 N/mm2 or more, an elongation at break of 1.0% or more and an elastic elongation limit of 0.03% or more.
Abstract translation:一种锂二次电池用负极,其具有由导电性金属箔构成的集电体,在其表面上设有包含含有硅和/或硅合金的活性物质粒子和粘合剂的活性物质层,其特征在于,所述粘合剂 拉伸强度为50N / mm 2以上,断裂伸长率为10%以上,应变能密度为2.5×10 -3 J / mm 3以上,弹性系数为10000N / mm 2的机械特性 其特征在于,集电体的拉伸强度为80N / mm 2以上,比例范围为30N / mm 2以上,断裂伸长率为1.0%以上,弹性伸长极限为 0.03%以上。
Abstract:
A network monitor and control apparatus for controlling the monitoring of a network are provided. The network monitor includes an error monitor including an error information gatherer for gathering error information of a monitor target apparatus; and a monitor result notifier for notifying of monitor results, wherein if there are N types of monitor target functions, the error monitor includes N error information gatherers for the respective N types of monitor target functions (N=1, 2, 3, . . . ) and wherein each of the N error information gatherers gathers the error information from one of an existing monitor target apparatus and a newly added monitor target apparatus on a per monitor target function basis.
Abstract:
A method for manufacturing a developing blade including a blade member located along one side edge of a support member, comprising providing a top mold with a cavity, sandblasting the cavity with an abrasive in a range of #150 to #1000, clamping together the top mold and a bottom mold while the top mold is in alignment with the bottom mold while at least a part of the support member is positioned in the cavity, and pouring a molding material from a gate to fill the cavity.
Abstract:
A semiconductor memory device comprises memory cells, a bitline connected to the memory cells, a read circuit including a precharge circuit, and a first transistor connected between the bitline and the read circuit, wherein a first voltage is applied to a gate of the first transistor when the precharge circuit precharges the bitline, and a second voltage which is different from the first voltage is applied to the gate of the first transistor when the read circuit senses a change in a voltage of the bitline.
Abstract:
A select gate transistor has a select gate electrode composed of a first-level conductive layer and a second-level conductive layer. The first-level conductive layer has contact areas. The second-level conductive layer has its portions removed that are located above the contact areas. Two adjacent select gate electrodes that are adjacent to each other in the column direction are arranged such that the contact areas of one select gate electrode are not opposed to the contact areas of the other select gate electrode. One select gate electrode has its first- and second-level conductive layers removed in their portions that are opposed to the contact areas of the other select gate electrode.
Abstract:
A non-volatile semiconductor device has a memory cell array having electrically erasable programmable non-volatile memory cells, reprogramming and retrieval circuits that temporarily store data to be programmed in the memory cell array and sense data retrieved from the memory cell array. Each reprogramming and retrieval circuit has first and second latches that are selectively connected to the memory cell array and transfer data. A controller controls the reprogramming and retrieval circuits on a data-reprogramming operation to and a data-retrieval operation from the memory cell array. Each reprogramming and retrieval circuit has a multilevel logical operation mode and a caching operation mode. In the multilevel logical operation mode, re-programming and retrieval of upper and lower bits of two-bit four-level data is performed using the first and the second latches to store the two-bit four-level data in one of the memory cells in a predetermined threshold level range. In the caching operation mode, data transfer between one of the memory cells selected in accordance with a first address and the first latch is performed while data transfer is performed between the second latch and input/output terminals in accordance with a second address with respect to one-bit two-level data to be stored in one of the memory cells.
Abstract:
A developing blade (11) comprises a blade member (14) located along one side edge of a support member (12) and having a surface shape defined by a maximum height roughness Ry of 0.35 to 4.5 μm and a length ratio under load tp (at a 30% cut level) of 15% or less. Such a developing blade is manufactured by bringing a top mold (2) having a mold surface (2A) with a cavity (4) formed for the formation of a blade member and a gate (6) in communication with the cavity (4) in alignment with a bottom mold (3) having a flat mold surface (3A) such that at least a part of the support member (12) is positioned in the cavity (4), clamping together both the top and bottom molds, and pouring a molding material from the gate (6) to fill in the cavity (4).