公开(公告)号：US09986636B2

公开(公告)日：2018-05-29

申请号：US15476235

申请日：2017-03-31

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler ,  Ralf Otremba

IPC: H05K3/02 ,  H05K1/03 ,  H05K1/02 ,  H05K3/40 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/036 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/0094 ,  H05K3/02 ,  H05K3/105 ,  H05K3/4038 ,  H05K3/4626 ,  H05K2201/0104 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0281 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10T29/49126 ,  Y10T428/24909

Abstract: A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer. The polymer includes at least one of a carbon layer structure and a carbon-like layer structure.

公开(公告)号：US09947432B2

公开(公告)日：2018-04-17

申请号：US14876297

申请日：2015-10-06

Applicant: FLEXcon Company, Inc.

Inventor： Kenneth Burnham ,  Richard Skov

IPC: H01B1/22 ,  H01B1/24 ,  C09J9/02 ,  H05K1/09 ,  B82Y30/00

CPC classification number: H01B1/24 ,  B82Y30/00 ,  C09J9/02 ,  H05K1/095 ,  H05K2201/0245 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/105 ,  H05K2203/1136

Abstract: A method of forming an electrically conductive composite is disclosed that includes the steps of providing a first dielectric material and a second conductive material that is substantially dispersed within the first dielectric material; and applying an electric field through at least a portion of the combined first dielectric material and second conductive material such that the second conductive material undergoes electrophoresis and forms at least one electrically conductive path through the electrically conductive composite along the direction of the applied electric field.

公开(公告)号：US09865370B2

公开(公告)日：2018-01-09

申请号：US14105535

申请日：2013-12-13

Applicant: Plastic Components and Modules Automotive S.p.A

Inventor： Enrico Parola ,  Pasquale Iacobone ,  Etienne Valentin

IPC: H01B1/18 ,  B29C71/04 ,  B82Y30/00 ,  C08J5/00 ,  C08J5/04 ,  C08K7/06 ,  C08K7/14 ,  H05K3/10 ,  H05K1/03

CPC classification number: H01B1/18 ,  B29C71/04 ,  B82Y30/00 ,  C08J5/005 ,  C08J5/043 ,  C08K7/06 ,  C08K7/14 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0112 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/09118 ,  H05K2203/107 ,  H05K2203/1136

Abstract: A composite material for the realization of a component or a structural part, in particular for installation on-board a vehicle, adapted to integrate electrical devices and connections, includes a non-conductive polymeric matrix; a dispersed phase including at least one promoter of carbonization adapted to form carbonaceous conductive structures; and a reinforcing-fiber filler adapted to direct the distribution and orientation of the dispersed phase in the polymeric matrix.

公开(公告)号：US20170306121A1

公开(公告)日：2017-10-26

申请号：US15133295

申请日：2016-04-20

Applicant: Eastman Kodak Company

Inventor： Thomas B. Brust ,  Anne Troxell Wyand ,  Grace Ann Bennett ,  Catherine A. Falkner

IPC: C08J7/16 ,  B05D3/06 ,  H01B1/12 ,  G03F7/40 ,  G03F7/004 ,  H05K3/02 ,  B05D3/10 ,  C08J7/12 ,  C08J7/04 ,  C08G73/02 ,  C08F212/14 ,  B05D7/00 ,  B05D7/04 ,  H05K3/10

CPC classification number: C08J7/16 ,  B05D3/067 ,  B05D3/101 ,  B05D7/04 ,  B05D7/544 ,  B05D7/584 ,  C08F12/30 ,  C08F212/14 ,  C08G73/0266 ,  C08J7/047 ,  C08J7/123 ,  C08J2367/02 ,  C08J2425/08 ,  C09D125/18 ,  G03F7/004 ,  G03F7/0047 ,  G03F7/038 ,  G03F7/40 ,  H01B1/128 ,  H05K3/02 ,  H05K3/105 ,  H05K2203/1136 ,  C08F2220/302 ,  C08F220/06

Abstract: A method is used to provide an electrically-conductive polyaniline pattern by providing a uniform layer of a photocurable composition on a substrate. The photocurable composition comprises a water-soluble reactive polymer comprising (a) greater than 40 mol % of recurring units comprising sulfonic acid or sulfonate groups, and (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition. The photocurable composition is exposed to cause crosslinking via [2+2] photocycloaddition of the (b) recurring units, thereby forming a crosslinked polymer. Any remaining water-soluble reactive polymer is removed. The crosslinked polymer is contacted with an aniline reactive composition having aniline monomer and up to 0.5 molar of an aniline oxidizing agent, thereby forming an electrically-conductive polyaniline disposed either within, on top of, or both within and on top of, the crosslinked polymer.

公开(公告)号：US20170130084A1

公开(公告)日：2017-05-11

申请号：US15319910

申请日：2015-06-19

Applicant: National Research Council of Canada ,  Groupe Graham International Inc.

Inventor： Arnold Kell ,  Sylvie Lafreniere ,  Chantal Paquet ,  Patrick Malenfant ,  Olga Mozenson

IPC: C09D11/52 ,  C09D11/033 ,  H01Q1/24 ,  H05K3/12 ,  H01Q1/38 ,  C09D11/14 ,  H05K1/09

CPC classification number: C09D11/52 ,  C09D11/033 ,  C09D11/08 ,  C09D11/14 ,  C09D11/38 ,  H01Q1/2225 ,  H01Q1/24 ,  H01Q1/364 ,  H01Q1/38 ,  H05K1/095 ,  H05K3/105 ,  H05K3/1216 ,  H05K2201/0257 ,  H05K2203/1131 ,  H05K2203/1136

Abstract: A flake-less molecular ink suitable for printing (e.g. screen printing) conductive traces on a substrate has 30-60 wt % of a C8-C12 silver carboxylate or 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate, 0.1-10 wt % of a polymeric binder (e.g. ethyl cellulose) and balance of at least one organic solvent. Conductive traces formed with the molecular ink are thinner, have lower resistivity, have greater adhesion to a substrate than metal flake inks, have better print resolution and are up to 8 times less rough than metal flake inks. In addition, the shear force required to remove light emitting diodes bonded to the traces using Loctite 3880 is at least 1.3 times stronger than for commercially available flake-based inks.

公开(公告)号：US20150188024A1

公开(公告)日：2015-07-02

申请号：US14578991

申请日：2014-12-22

Applicant: Seiko Epson Corporation

Inventor： Hideki ISHIGAMI ,  Hidefumi NAKAMURA ,  Yukihiko SHIOHARA ,  Taku KAWASAKI ,  Fumiaki AKAHANE

IPC: H01L41/047 ,  H01L41/053 ,  B22F3/105 ,  H01L41/29 ,  B22F5/12 ,  H05K1/03 ,  H01L41/333

CPC classification number: H01L41/0475 ,  B22F1/02 ,  B22F3/02 ,  B22F3/1055 ,  B22F5/12 ,  B22F2009/0828 ,  B22F2009/0884 ,  H01L41/0533 ,  H01L41/29 ,  H01L41/333 ,  H03H9/1021 ,  H03H9/13 ,  H03H2003/026 ,  H05K1/0306 ,  H05K3/105 ,  H05K3/1225 ,  H05K3/321 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/10068 ,  H05K2203/107 ,  H05K2203/1126 ,  H05K2203/1136 ,  Y10T428/252

Abstract: A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.

Abstract translation: 一种制造包括电气布线的电布线层的方法包括：通过加压包含具有绝缘层的金属颗粒的粉末来获得压制粉末成型层，所述金属颗粒由具有导电性的金属颗粒和表面绝缘层构成，所述金属颗粒是 位于金属颗粒的表面上，主要含有玻璃材料; 并用能量射线照射压制成型层，并在照射区域形成电布线。

公开(公告)号：US07602614B2

公开(公告)日：2009-10-13

申请号：US10562252

申请日：2004-06-04

Applicant: Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel ,  Stephan Stoeckl

Inventor： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel ,  Stephan Stoeckl

IPC: H05K7/00

CPC classification number: H05K1/184 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K3/105 ,  H05K3/46 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0919 ,  H05K2201/10446 ,  H05K2203/102 ,  H05K2203/108 ,  H05K2203/1131 ,  H05K2203/1136

Abstract: An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.

Abstract translation: 公开了电子模块及其制造方法。 在一个实施例中，电子模块具有布置在接线块上的多个部件。 布线块具有多个外侧，并且其体积线将外侧的接触焊盘互连。 接触垫电连接到部件的部件连接。

公开(公告)号：US20070014972A1

公开(公告)日：2007-01-18

申请号：US11180877

申请日：2005-07-13

Applicant: Tatsuya Suzuki

Inventor： Tatsuya Suzuki

IPC: B32B1/00

CPC classification number: H05K5/0243 ,  H05K3/0014 ,  H05K3/105 ,  H05K2201/0323 ,  H05K2201/0999 ,  H05K2203/0108 ,  H05K2203/1105 ,  H05K2203/1136 ,  Y10T428/24628

Abstract: A wooden casing is provided with a conductive pattern formed on the surface of the wooden material by carbonizing the surface thereof. A method for processing a surface of a wooden material, is provided with the steps of carbonizing the surface of the wooden material, and compressing the wooden material.

Abstract translation: 木制外壳设置有通过碳化其表面而形成在木材表面上的导电图案。 一种用于处理木材表面的方法，具有碳化木材表面并压缩木质材料的步骤。

公开(公告)号：US06846991B2

公开(公告)日：2005-01-25

申请号：US10073641

申请日：2002-02-11

Applicant: Mark T. Girard ,  Ryan A. Jurgenson

Inventor： Mark T. Girard ,  Ryan A. Jurgenson

IPC: G11B5/11 ,  G11B5/115 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16

CPC classification number: H05K1/0259 ,  G11B5/11 ,  G11B5/112 ,  G11B5/115 ,  H05K1/0393 ,  H05K1/167 ,  H05K2201/0323 ,  H05K2203/107 ,  H05K2203/1136

Abstract: An interconnect for an electrical component. Generally, interconnects of the invention include a substrate, a pair of leads supported on the substrate, and a shunt extending between the leads. In one aspect of the present invention, the shunt comprises an eroded carbonized area of a surface of a carbonizable material.

Abstract translation: 电气部件的互连。 通常，本发明的互连包括衬底，支撑在衬底上的一对引线以及在引线之间延伸的分流器。 在本发明的一个方面，分流器包括可碳化材料表面的侵蚀碳化区域。

公开(公告)号：US20020100607A1

公开(公告)日：2002-08-01

申请号：US10073641

申请日：2002-02-11

Inventor： Mark T. Girard ,  Ryan A. Jurgenson

IPC: H05K001/00

CPC classification number: H05K1/0259 ,  G11B5/11 ,  G11B5/112 ,  G11B5/115 ,  H05K1/0393 ,  H05K1/167 ,  H05K2201/0323 ,  H05K2203/107 ,  H05K2203/1136

Abstract: The present invention provides an interconnect useful for the prevention of ESD/EOS damage to electrical components. The present invention provides for interconnects that include at least two conductive wires or leads engaged on at least one surface by a carbonizable and ablatable material. The conductive wires may each include a branched dead end lead portion interleaved with the branched dead end lead portion of the other. Alternatively, the conductive wires may extend in close proximity to each other in a curved or sinuous or serpentine or backtracking pattern. An interconnect in accord with the present invention may include a substrate substantially supporting the conductive wires except at predetermined locations or proposed stint sites wherein there is at least one through hole in the substrate.

Abstract translation: 本发明提供了一种用于防止对电气部件的ESD / EOS损伤的互连。 本发明提供了包括通过可碳化和可烧蚀材料在至少一个表面上接合的至少两个导电线或引线的互连。 导线可以各自包括与另一个的分支死端引线部分交错的分支死端引线部分。 或者，导线可以以弯曲或弯曲或蛇形或回溯模式彼此靠近地延伸。 根据本发明的互连可以包括基本上支撑导电线的基板，除了在预定位置或提出的位置，其中在基板中存在至少一个通孔。