Invention Grant
- Patent Title: Electrical component and a shuntable/shunted electrical component and method for shunting and deshunting
- Patent Title (中): 电气部件和可分流/分流的电气部件和分流和脱离方法
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Application No.: US10073641Application Date: 2002-02-11
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Publication No.: US06846991B2Publication Date: 2005-01-25
- Inventor: Mark T. Girard , Ryan A. Jurgenson
- Applicant: Mark T. Girard , Ryan A. Jurgenson
- Applicant Address: US MN Hutchinson
- Assignee: Applied Kinetics, Inc.
- Current Assignee: Applied Kinetics, Inc.
- Current Assignee Address: US MN Hutchinson
- Agency: Kagan Binder, PLLC
- Main IPC: G11B5/11
- IPC: G11B5/11 ; G11B5/115 ; H05K1/00 ; H05K1/02 ; H05K1/16
Abstract:
An interconnect for an electrical component. Generally, interconnects of the invention include a substrate, a pair of leads supported on the substrate, and a shunt extending between the leads. In one aspect of the present invention, the shunt comprises an eroded carbonized area of a surface of a carbonizable material.
Public/Granted literature
- US20020100607A1 Electrical component and a shuntable/shunted electrical component and method for shunting and deshunting Public/Granted day:2002-08-01
Information query
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