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    Greensheet carriers and processing thereof
    11.
    发明申请
    Greensheet carriers and processing thereof 失效
    格林板载体及其加工

    公开(公告)号：US20030203175A1

    公开(公告)日：2003-10-30

    申请号：US10411906

    申请日：2003-04-11

    申请人： International Business Machines Corporation

    发明人： John U. Knickerbocker ,  Govindarajan Natarajan

    IPC分类号： B32B003/00 ,  B32B009/00 ,  B32B003/02

    CPC分类号： B32B18/00 ,  B32B37/22 ,  B32B38/04 ,  B32B2038/042 ,  B32B2305/38 ,  B32B2305/77 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/38 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/561 ,  C04B2237/567 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0169 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/108 ,  Y10T428/161 ,  Y10T428/23 ,  Y10T428/24793 ,  Y10T428/24926

    摘要： A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that that the frame and greensheet side are substantially coplanar.

    摘要翻译： 处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工 毛坯和粘合框架，并从加工的毛坯上移除框架。 毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架 一个其他图案化的毛坯和粘合框架，并且层压绿叶片。 在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。 框架与毛坯的接合可以通过层压或通过粘合剂或其它方式进行。 优选地，框架具有小于毛坯厚度的厚度。 框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。 框架可以施加到毛坯的一侧，并被压入毛坯一侧，使得框架和毛坯侧面基本上是共面的。

    Method and constrain layer for reducing shrinkage during sintering low-temperature ceramic
    13.
    发明申请
    Method and constrain layer for reducing shrinkage during sintering low-temperature ceramic 审中-公开
    烧结低温陶瓷减少收缩的方法和约束层

    公开(公告)号：US20030168150A1

    公开(公告)日：2003-09-11

    申请号：US10224949

    申请日：2002-08-20

    申请人： Phycomp Taiwan Ltd

    发明人： Wen-Hsi Lee ,  Che-Yi Su ,  Chun-Te Lee ,  Jui-Chu Jao

    IPC分类号： C03B029/00

    CPC分类号： B32B18/00 ,  B32B38/145 ,  B32B2038/042 ,  B32B2315/02 ,  C04B2235/3239 ,  C04B2235/36 ,  C04B2235/365 ,  C04B2235/9615 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/562 ,  C04B2237/62 ,  C04B2237/702 ,  C04B2237/704 ,  H01L21/4857 ,  H05K1/0306 ,  H05K1/16 ,  H05K3/4611 ,  H05K3/4629

    摘要： The present invention mainly relates to a method for reducing X-Y shrinkage during sintering low temperature ceramic comprising piling a constrain layer on a dielectric layer on a green ceramic body, which is printed with heterogeneous materials for conductors, resistors, capacitors and the like and/or disposed conductors, resistors, capacitors and the like to reduce shrinkage of the dielectric layer and the green ceramic body. The invention is characterized in that the constrain layer comprises windows in positions complying with the heterogeneous materials and/or conductors, resistors, capacitors and the like printed and/or disposed on the dielectric layer and the green ceramic body to make the heterogeneous materials and/or conductors, resistors, capacitors and the like not being covered when piling the constrain layer and the dielectric layers of the green ceramic body.

    摘要翻译： 本发明主要涉及一种减少烧结低温陶瓷中XY收缩的方法，包括在生陶瓷体上的电介质层上堆叠约束层，该陶瓷体上印有用于导体，电阻器，电容器等的异种材料和/或 布置导体，电阻器，电容器等，以减小电介质层和生坯陶瓷体的收缩。 本发明的特征在于，约束层包括在符合非均质材料的位置的窗口和/或印刷和/或设置在电介质层和生坯陶瓷体上的导体，电阻器，电容器等，以使异质材料和/ 或者在对生陶瓷体的约束层和电介质层进行打桩时不会覆盖导体，电阻器，电容器等。

    Greensheet carriers and processing thereof
    14.
    发明授权
    Greensheet carriers and processing thereof 失效
    格林板载体及其加工

    公开(公告)号：US06607620B2

    公开(公告)日：2003-08-19

    申请号：US09757071

    申请日：2001-01-08

    申请人： John U. Knickerbocker ,  Govindarajan Natarajan

    发明人： John U. Knickerbocker ,  Govindarajan Natarajan

    IPC分类号： B32B3118

    CPC分类号： B32B18/00 ,  B32B37/22 ,  B32B38/04 ,  B32B2038/042 ,  B32B2305/38 ,  B32B2305/77 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/38 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/561 ,  C04B2237/567 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0169 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/108 ,  Y10T428/161 ,  Y10T428/23 ,  Y10T428/24793 ,  Y10T428/24926

    摘要： A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that the frame and greensheet side are substantially coplanar.

    摘要翻译： 处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工 毛坯和粘合框架，并从加工的毛坯上移除框架。 毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架 一个其他图案化的毛坯和粘合框架，并且层压绿叶片。 在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。 框架与毛坯的接合可以通过层压或通过粘合剂或其他方式进行。 优选地，框架具有小于毛坯厚度的厚度。 框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。 框架可以施加到毛坯的一侧，并且被压入毛坯一侧，使得框架和毛坯面基本上共面。

    GREENSHEET CARRIERS AND PROCESSING THEREOF
    16.
    发明申请
    GREENSHEET CARRIERS AND PROCESSING THEREOF 失效
    绿色植物及其加工

    公开(公告)号：US20030096085A1

    公开(公告)日：2003-05-22

    申请号：US09757071

    申请日：2001-01-08

    申请人： International Business Machines Corporation

    发明人： John U. Knickerbocker ,  Govindarajan Natarajan

    IPC分类号： B32B023/02

    CPC分类号： B32B18/00 ,  B32B37/22 ,  B32B38/04 ,  B32B2038/042 ,  B32B2305/38 ,  B32B2305/77 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/38 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/561 ,  C04B2237/567 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0169 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/108 ,  Y10T428/161 ,  Y10T428/23 ,  Y10T428/24793 ,  Y10T428/24926

    摘要： A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that that the frame and greensheet side are substantially coplanar.

    摘要翻译： 处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工 毛坯和粘合框架，并从加工的毛坯上移除框架。 毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架 一个其他图案化的毛坯和粘合框架，并且层压绿叶片。 在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。 框架与毛坯的接合可以通过层压或通过粘合剂或其他方式进行。 优选地，框架具有小于毛坯厚度的厚度。 框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。 框架可以施加到毛坯的一侧，并被压入毛坯一侧，使得框架和毛坯侧面基本上是共面的。

    Method for producing bonded body
    19.
    发明授权
    Method for producing bonded body 有权
    粘结体生产方法

    公开(公告)号：US09242445B2

    公开(公告)日：2016-01-26

    申请号：US14231829

    申请日：2014-04-01

    申请人： DENSO CORPORATION

    发明人： Yasuyuki Ookouchi ,  Yasunori Kawamoto

    IPC分类号： B23K20/00 ,  B32B37/14 ,  C04B37/02 ,  B32B37/26 ,  B01D46/00 ,  C04B38/00 ,  B32B9/04 ,  B23K20/02

    CPC分类号： B32B37/14 ,  B01D46/00 ,  B23K20/02 ,  B32B9/041 ,  B32B37/26 ,  B32B2307/302 ,  B32B2311/00 ,  B32B2315/02 ,  C04B37/023 ,  C04B37/026 ,  C04B38/0006 ,  C04B2235/9607 ,  C04B2237/122 ,  C04B2237/365 ,  C04B2237/408 ,  C04B2237/50 ,  C04B2237/60 ,  C04B2237/708 ,  C04B2237/72

    摘要： A method for producing a bonded body of ceramic and metal bodies includes stacking a ceramic body, metal body, gap layer capable of preventing oxidation and hindering heat conduction, first intermediate layer and second intermediate layer with the gap layer between the ceramic body and the metal body in the stacking direction. The first intermediate layer is between the ceramic body and gap layer, and the second intermediate layer is between the gap layer and metal body, linear expansion coefficients of the first and second intermediate layers being between those of the ceramic body and the metal body. Diffusion bonding is performed between the ceramic body and the first intermediate layer, and between the metal body and the second intermediate layer simultaneously. The gap layer is then removed from between the first and second intermediate layers. The first and second intermediate layers are then bonded to each other.

    摘要翻译： 一种陶瓷和金属体的接合体的制造方法，包括陶瓷体，金属体，能够防止氧化并阻碍热传导的间隙层的堆叠，第一中间层和第二中间层，陶瓷体与金属之间的间隙层 身体在堆叠方向。 第一中间层位于陶瓷体和间隙层之间，第二中间层位于间隙层与金属体之间，第一和第二中间层的线膨胀系数在陶瓷体与金属体之间。 在陶瓷体和第一中间层之间以及金属体和第二中间层之间同时进行扩散接合。 然后从第一和第二中间层之间移除间隙层。 然后将第一和第二中间层彼此结合。