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11.发明申请PRODUCTION METHOD FOR SEALING MATERIAL CONTAINING FLUORESCENT BODY, PRODUCTION METHOD FOR LIGHT-EMITTING DEVICE, AND DISPENSER 有权用于密封含有荧光体的材料的生产方法，用于发光装置的生产方法和分配器公开(公告)号：US20150252258A1
公开(公告)日：2015-09-10
申请号：US14431036
申请日：2013-04-12
发明人： Masahiro Konishi
IPC分类号： C09K11/77 , H01L33/50 , C09D183/04 , H01L33/00
CPC分类号： H01L33/502 , B29C47/0004 , B29C47/025 , B29C47/026 , B29C47/30 , B29C47/402 , C08J3/18 , C08J3/20 , C08J3/203 , C08J3/24 , C08J3/244 , C08J2383/04 , C09D5/22 , C09D183/04 , C09K11/02 , C09K11/77 , H01L24/97 , H01L33/005 , H01L33/50 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： A fluorescent material-containing sealing resin (20) production method of the present invention includes: a kneading step of kneading a powder mixture (24), which has been obtained by mixing a powder of silicone resins (21) and a powder of fluorescent materials (22) together, while melting the powder mixture (24) by heat, so that a kneaded mixture (25) is obtained; and an extruding step of extruding the kneaded mixture (25) in a form of a cord from an output port (37b) of a twin screw extruder (37).
摘要翻译： 本发明的含荧光材料的密封树脂（20）的制造方法包括：将通过混合有机硅树脂（21）的粉末和荧光体粉末得到的粉末混合物（24）混炼的捏合步骤 （22），同时通过加热熔化粉末混合物（24），从而获得捏合的混合物（25）; 以及从双螺杆挤出机（37）的输出口（37b）挤出捏合混合物（25）成为帘线形式的挤出步骤。
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公开(公告)号：US10253949B2
公开(公告)日：2019-04-09
申请号：US14904804
申请日：2014-07-09
发明人： Shin Itoh , Masahiro Konishi
IPC分类号： F21V7/22 , C25D11/04 , C25D11/16 , F21V7/06 , F21Y105/10 , F21Y115/10
摘要： A lighting reflector 10 includes a base member 11, made of metal, having an inner circumferential surface 13a expanding toward a light exit aperture 14 open at an end in an axial direction. A thin-film layer 17 which is formed from a thin film containing ceramic and which scatters light is placed on an end portion of the inner circumferential surface 13a that is on the opposite side to the light exit aperture 14.
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公开(公告)号：US09966522B2
公开(公告)日：2018-05-08
申请号：US15303570
申请日：2015-03-24
发明人： Masahiro Konishi , Shin Itoh , Hiroyuki Nokubo , Yoshiaki Itakura
IPC分类号： H01L33/64 , H01L33/60 , H01L25/075 , H01L33/62 , H01L33/46
CPC分类号： H01L33/641 , H01L25/0753 , H01L33/46 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2933/0033 , H01L2933/0058 , H01L2933/0075 , H01L2924/00014
摘要： A substrate includes a base made of a metal material, a thermally conductive, light-reflective ceramic insulating layer, and a buffer layer formed between the base and the ceramic insulating layer and having a smaller linear expansion coefficient than the base.
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公开(公告)号：US09755115B2
公开(公告)日：2017-09-05
申请号：US15015903
申请日：2016-02-04
发明人： Masahiro Konishi , Makoto Agatani , Toshio Hata
IPC分类号： H01L33/50 , F21K99/00 , F21K9/00 , H01L33/62 , H01L33/36 , F21V23/00 , H01L33/38 , H01L25/075 , H01L33/32 , H01L33/56 , H01L33/60 , H01L33/64 , F21K9/20 , H01L23/00 , F21Y101/00 , F21Y105/10 , F21K9/232 , F21Y115/10
CPC分类号： H01L33/502 , F21K9/00 , F21K9/20 , F21K9/232 , F21V23/002 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L24/45 , H01L25/0753 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/01068 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.
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公开(公告)号：US09726357B2
公开(公告)日：2017-08-08
申请号：US14761981
申请日：2014-01-20
IPC分类号： H01L21/44 , H01L23/532 , F21V23/00 , F21K9/00 , H05K3/24 , H01L33/62 , H05K1/05 , F21Y115/10
CPC分类号： F21V23/002 , F21K9/00 , F21Y2115/10 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H05K1/053 , H05K3/246 , H05K3/247 , H05K2201/0341 , H05K2201/10106 , H05K2201/10409 , H01L2924/00014 , H01L2924/00
摘要： In a light-emitting device (30), a wiring pattern including conductor wirings (160, 165) and electrodes (170, 180) is formed on a substrate (110), and an Au layer (120) is formed on the wiring pattern.
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公开(公告)号：US09178125B2
公开(公告)日：2015-11-03
申请号：US14467836
申请日：2014-08-25
发明人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
IPC分类号： H01L33/00 , H01L33/60 , H01L23/00 , H01L33/56 , F21Y101/02 , H01L25/075 , H01L33/46 , F21K99/00
CPC分类号： H01L33/62 , F21K9/23 , F21Y2101/00 , F21Y2115/10 , H01L24/97 , H01L25/0753 , H01L33/46 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2933/0066 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.
摘要翻译： 本发明的发光装置具有：（i）朝向比基板高的位置发光的半导体装置，（ii）多个外部连接端子，具有：设置在基板上的光反射层 ，其反映由半导体器件发射的光; 以及至少覆盖所述光反射层并透射由所述光反射层反射的光的覆盖层。 此外，半导体器件设置在覆盖层上，并且经由连接部分电连接到外部连接端子，半导体器件和连接部分用密封树脂密封以被覆盖。 因此，发光装置具有提高光线的效率，能够防止反射层的变化，劣化，反射率的降低。
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公开(公告)号：US08841838B2
公开(公告)日：2014-09-23
申请号：US13786393
申请日：2013-03-05
发明人： Masahiro Konishi , Makoto Agatani , Toshio Hata
IPC分类号： H05B33/06
CPC分类号： H01L33/502 , F21K9/00 , F21K9/20 , F21K9/232 , F21V23/002 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L24/45 , H01L25/0753 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/01068 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.
摘要翻译： 通过使用包括绝缘基板和形成在绝缘基板上的发光单元的发光装置，发光单元包括：彼此平行地布置在绝缘基板上的多个线性布线图案，多个发光元件 安装在布线图案之间，同时电连接到布线图案，以及用于密封发光元件的密封构件及其制造方法，可以提供实现足够的电绝缘的发光器件 并且具有简单的制造工艺，从而可以以低成本制造它们及其制造方法。
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公开(公告)号：US10276765B2
公开(公告)日：2019-04-30
申请号：US15104649
申请日：2014-11-11
发明人： Masahiro Konishi , Shin Itoh
摘要： A substrate (5A) includes an aluminum substrate body (10), a reflection layer (12) that is formed between an electrode pattern (20) which obtains electrical connection with a light emitting element (6) and the aluminum substrate body (10) and that contains first ceramics which reflect light from the light emitting element (6), and an intermediate layer (11) that contains second ceramics which are formed by thermal spraying and reinforces dielectric strength performance of the reflection layer (12).
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公开(公告)号：US10121951B2
公开(公告)日：2018-11-06
申请号：US15033252
申请日：2014-11-12
发明人： Shin Itoh , Masahiro Konishi
IPC分类号： H01L21/02 , H01L33/64 , H01L33/60 , H01L33/44 , H01L33/62 , H01L25/075 , H01L33/50 , H01L33/56
摘要： In a light-emitting device substrate (2), a light reflecting surface covered with an anodized aluminum layer (12) is formed on one side of a base (14), and a glass-based insulator layer (11) and electrode patterns (5⋅6) disposed on the first insulating layer (11) are formed on the one side of the base (14) in a region not covered with the anodized aluminum layer (12). A glass-based insulator layer (13) is formed at least on the other side of the base (14) that is opposite the one side of the base (14). Therefore, a light-emitting device substrate having high reflectivity, high heat dissipation capability, dielectric withstand capability, and long-term reliability and excellent in mass productivity can be realized.
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公开(公告)号：US09947850B2
公开(公告)日：2018-04-17
申请号：US15124724
申请日：2015-02-27
发明人： Masahiro Konishi , Shin Itoh , Hiroyuki Nokubo , Yoshiaki Itakura
IPC分类号： H01L29/49 , H01L33/64 , H05K1/05 , H01L25/075 , H01L33/56 , H01L33/60 , H01L33/62 , F21K9/00 , F21V29/77 , H05K3/44 , F21Y105/10 , F21Y115/10
CPC分类号： H01L33/642 , F21K9/00 , F21V29/773 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/16225 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0075 , H05K1/053 , H05K3/44 , H05K2201/0179 , H05K2201/10106
摘要： In order to provide a substrate for light emitting devices having high heat radiating properties, dielectric strength voltage properties, light reflectivity, and excellent mass productivity, a substrate (5) includes an intermediate layer (11) containing ceramic which is formed on the surface of the aluminum base (10) by using an aerosol deposition method.
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