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公开(公告)号:US20220310805A1
公开(公告)日:2022-09-29
申请号:US17526046
申请日:2021-11-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jung Hwan Chun , Seung Jae Lee , Jong Min Baek , Kyung Seok Oh , Woo Jin Lee
IPC: H01L29/417 , H01L29/06 , H01L29/423 , H01L29/786 , H01L29/08 , H01L29/78 , H01L29/40
Abstract: Semiconductor devices having improved performance and reliability. For example, a semiconductor device may include a substrate, an active pattern extending in a first direction, on the substrate, a plurality of gate structures on the active pattern, each including a gate electrode that crosses the active pattern. A lower active contact may be connected to a source/drain pattern. A trench may expose the lower active contact, and a width of a bottom surface of the trench in the first direction may be greater than a width of an upper surface of the lower active contact in the first direction. An etching stop film may be along the bottom surface of the trench and side walls of the trench, and have an uppermost surface coplanar with an upper surface of an upper active contact that extends through the etching stop film and is connected to the lower active contact.
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公开(公告)号:US20210032512A1
公开(公告)日:2021-02-04
申请号:US17068155
申请日:2020-10-12
Applicant: SAMSUNG SDI CO., LTD. , SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ik Hwan Cho , Ji Ho Kim , Jee Hee Kim , Ji Won Kang , Byeong Do Kwak , Yong Tae Kim , Il Jin Kim , Sung Hyun Mun , Hyung Rang Moon , Seon Hee Shin , Gwang Hwan Lee , Woo Jin Lee , Jae Hyun Han
IPC: C09J133/08 , C09J7/10
Abstract: An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at −20° C. of about 50 μm to about 100 μm and a gel fraction of about 50% to about 75%.
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公开(公告)号:US10669450B2
公开(公告)日:2020-06-02
申请号:US15522253
申请日:2015-10-30
Applicant: SAMSUNG SDI CO., LTD. , SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyung Rang Moon , Ji Ho Kim , Il Jin Kim , Byeong Do Kwak , Jee Hee Kim , Sung Hyun Mun , Seon Hee Shin , Gwang Hwan Lee , Woo Jin Lee , Eun Hwa Lee , Ik Hwan Cho , Jae Hyun Han
IPC: C09J4/00 , G06F3/041 , C09J7/25 , C09J7/20 , G06F1/16 , C09J133/08 , C09J7/38 , C09J133/14 , G06F3/044 , C09J11/06 , C09J7/22 , G02F1/1333
Abstract: A flexible display device of the present invention comprises a photoelectric element part; a first adhesive film formed on the photoelectric element part; a touch function part formed on the first adhesive film; a second adhesive film formed on the touch function part; and a window film formed on the second adhesive film; wherein the first adhesive film or the second adhesive film has an average slope of about −9.9 to about 0 at −20° C. to 80° C. based on x-axis for the distribution of storage modulus versus temperature in the function of x-axis of temperature (° C.) and y-axis of storage modulus (KPa) and wherein the first adhesive film or the second adhesive film has a storage modulus of about 10 KPa or more at 80° C.
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公开(公告)号:US10062609B2
公开(公告)日:2018-08-28
申请号:US15393506
申请日:2016-12-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Woo Kyung You , Jong Min Baek , Sang Shin Jang , Byung Hee Kim , Vietha Nguyen , Nae In Lee , Woo Jin Lee , Eun Ji Jung , Kyu Hee Han
IPC: H01L21/00 , H01L21/768 , H01L23/528
CPC classification number: H01L21/76883 , H01L21/76802 , H01L21/76807 , H01L21/7682 , H01L21/76829 , H01L21/76834 , H01L23/5222 , H01L23/528 , H01L23/53295 , H01L2221/1021
Abstract: A semiconductor device includes a first insulating interlayer on a substrate, metal lines in the first insulating interlayer, a first air gap between the metal lines in a first region of the substrate and a second air gap between the first insulating interlayer and at least one of the metal lines in a second region of the substrate, a liner layer covering top surfaces and side walls of the metal lines and a top surface and a side wall of the first insulating interlayer, adjacent to the first and second air gaps, and a second insulating interlayer on the liner layer and contacting the liner layer.
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公开(公告)号:US09632567B2
公开(公告)日:2017-04-25
申请号:US14630015
申请日:2015-02-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jong Lae Park , Woo Jin Lee , Sang Il Park , Gyeong Teak Lee
IPC: G06F1/32
CPC classification number: G06F1/329 , G06F1/163 , G06F1/3206 , G06F1/3296 , Y02D10/172 , Y02D10/24
Abstract: A Dynamic Voltage and Frequency Scaling (DVFS) method, comprising of a scheduling execution of DVFS to adjust frequency or voltage of a target device at a first scheduled time; monitoring operating frequency of the target device; and selectively deferring execution of DVFS at a later scheduled time based on the operating frequency of the target device; wherein execution of DVFS at a next scheduled time is deferred when the operating frequency of the target device is below a given minimum frequency.
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公开(公告)号:US20170002237A1
公开(公告)日:2017-01-05
申请号:US15198977
申请日:2016-06-30
Applicant: SAMSUNG SDI CO., LTD. , SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ik Hwan Cho , Ji Ho Kim , Jee Hee Kim , Ji Won Kang , Byeong Do Kwak , Yong Tae Kim , Il Jin Kim , Sung Hyun Mun , Hyung Rang Moon , Seon Hee Shin , Gwang Hwan Lee , Woo Jin Lee , Jae Hyun Han
IPC: C09J133/08 , C09J7/02
Abstract: An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at −20° C. of about 50 μm to about 100 μm and a gel fraction of about 50% to about 75%.
Abstract translation: 公开了一种粘合膜和包括该粘合膜的显示元件。 粘合剂膜由粘合剂组合物形成,所述粘合剂组合物包括:包含含羟基的(甲基)丙烯酸酯和共聚单体的单体混合物的共聚物; 和纳米颗粒。 粘合膜在-20℃下的蠕变为约50μm至约100μm,凝胶分数为约50%至约75%。
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公开(公告)号:US20240327684A1
公开(公告)日:2024-10-03
申请号:US18732366
申请日:2024-06-03
Applicant: SAMSUNG SDI CO., LTD. , SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ik Hwan Cho , Ji Ho Kim , Jee Hee Kim , Ji Won Kang , Byeong Do Kwak , Yong Tae Kim , Il Jin Kim , Sung Hyun Mun , Hyung Rang Moon , Seon Hee Shin , Gwang Hwan Lee , Woo Jin Lee , Jae Hyun Han
IPC: C09J133/08 , C09J7/10
CPC classification number: C09J133/08 , C09J7/10 , C09J2203/318 , C09J2301/312 , C09J2301/408 , C09J2433/00
Abstract: An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at −20° C. of about 50 μm to about 100 μm and a gel fraction of about 50% to about 75%.
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公开(公告)号:US10829671B2
公开(公告)日:2020-11-10
申请号:US15198977
申请日:2016-06-30
Applicant: SAMSUNG SDI CO., LTD. , SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ik Hwan Cho , Ji Ho Kim , Jee Hee Kim , Ji Won Kang , Byeong Do Kwak , Yong Tae Kim , Il Jin Kim , Sung Hyun Mun , Hyung Rang Moon , Seon Hee Shin , Gwang Hwan Lee , Woo Jin Lee , Jae Hyun Han
IPC: C09J133/08 , C09J7/10
Abstract: An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at −20° C. of about 50 μm to about 100 μm and a gel fraction of about 50% to about 75%.
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19.
公开(公告)号:US20200347270A1
公开(公告)日:2020-11-05
申请号:US16933853
申请日:2020-07-20
Applicant: SAMSUNG SDI CO., LTD. , SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ji Ho Kim , Hyung Rang Moon , II Jin Kim , Byeong Do Kwak , Jee Hee Kim , Sung Hyun Mun , Seon Hee Shin , Gwang Hwan Lee , Woo Jin Lee , Eun Hwa Lee , lk Hwan Cho , Jae Hyun Han
IPC: C09J7/10 , C09J133/08 , C09J133/06 , C09J7/22 , C09J7/38 , C08L53/02
Abstract: An adhesive film has an average slope of about −9.9 to about 0, as measured over a temperature range of about −20° C. to about 80° C. in a graph depicting a temperature-dependent storage modulus distribution of the adhesive film where the x-axis represents temperature (° C.) and the y-axis represents storage modulus (kPa). The adhesive film also has a storage modulus at about 80° C. of about 10 kPa to about 1,000 kPa.
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公开(公告)号:US10304734B2
公开(公告)日:2019-05-28
申请号:US16046081
申请日:2018-07-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Woo Kyung You , Jong Min Baek , Sang Shin Jang , Byung Hee Kim , Vietha Nguyen , Nae In Lee , Woo Jin Lee , Eun Ji Jung , Kyu Hee Han
IPC: H01L21/00 , H01L21/768 , H01L23/528
Abstract: A semiconductor device includes a first insulating interlayer on a substrate, metal lines in the first insulating interlayer, a first air gap between the metal lines in a first region of the substrate and a second air gap between the first insulating interlayer and at least one of the metal lines in a second region of the substrate, a liner layer covering top surfaces and side walls of the metal lines and a top surface and a side wall of the first insulating interlayer, adjacent to the first and second air gaps, and a second insulating interlayer on the liner layer and contacting the liner layer.
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