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公开(公告)号:US20240318078A1
公开(公告)日:2024-09-26
申请号:US18586037
申请日:2024-02-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byungjoon KANG , Sungmin KIM , Minjae SUNG , Gayoung SONG , Jungmin OH , Hyosan LEE , Byoungki CHOI , Cheol HAM , Kyuyoung HWANG
IPC: C09K13/06 , H01L21/3213
CPC classification number: C09K13/06 , H01L21/32134
Abstract: An etching composition for a titanium-containing layer may include an oxidant, an inorganic acid, and a selective etching inhibitor. The inorganic acid may include phosphorus-based inorganic acid, chlorine-based inorganic acid, or fluorine-based inorganic acid, or any combination thereof. The selective etching inhibitor may include a polymer having a nitrogen-containing repeating unit.
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公开(公告)号:US20230163178A1
公开(公告)日:2023-05-25
申请号:US17887600
申请日:2022-08-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungmin KIM
IPC: H01L29/417 , H01L29/06 , H01L29/08 , H01L29/423 , H01L29/786 , H01L29/775 , H01L29/40 , H01L29/66
CPC classification number: H01L29/41733 , H01L29/0673 , H01L29/0847 , H01L29/42392 , H01L29/78696 , H01L29/775 , H01L29/401 , H01L29/66553 , H01L29/66545 , H01L29/66742 , H01L29/66439
Abstract: A semiconductor device includes a buried interconnection line extending in a first direction, a gate electrode extending in a second direction intersecting the buried interconnection line, and channel layers spaced apart from each other in a third direction perpendicular to the first direction and the second direction. The channel layers are surrounded by the gate electrode, and the buried interconnection line includes a metal layer and a semiconductor layer stacked in the third direction. The device includes a buried insulating layer between the channel layers and the buried interconnection line, and first and second source/drain regions in contact with the channel layers on both sides of the gate electrode. The second source/drain region penetrates through the buried insulating layer and is in contact with the semiconductor layer. The device includes a contact plug on the first source/drain region, and a via below the buried interconnection line.
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公开(公告)号:US20220342223A1
公开(公告)日:2022-10-27
申请号:US17861326
申请日:2022-07-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungkwang YANG , Sungmin KIM , Yeongmin PARK , Kyoungjin AHN , Byounguk YOON , Jongchul CHOI
Abstract: An electronic device according to an embodiment may include at least one display, a main frame to which the at least one display is mounted, a first support frame which is connected to the main frame through a first connector and includes a first antenna, a second support frame which is connected to the main frame through a second connector and includes a second antenna, at least one processor, and at least one sensor. The at least one processor may perform, when the at least one sensor detects that the electronic device is unfolded, wireless communication using the first antenna and the second antenna, and, when the at least one sensor detects that the electronic device is folded, may turn off the first antenna and/or the second antenna, connect first antenna and/or the second antenna to a ground, or shift a resonance frequency of first antenna and/or the second antenna.
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公开(公告)号:US20220190136A1
公开(公告)日:2022-06-16
申请号:US17686504
申请日:2022-03-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seungseok HA , Gukil AN , Keun Hwi CHO , Sungmin KIM
IPC: H01L29/51 , H01L29/49 , H01L29/786 , H01L29/423
Abstract: Semiconductor devices and methods of forming the same are provided. The semiconductor devices may include a substrate, a pair of semiconductor patterns adjacent to each other on the substrate, a gate electrode on the pair of semiconductor patterns, a source/drain pattern connected to the pair of semiconductor patterns, and a ferroelectric pattern on surfaces of the pair of semiconductor patterns. The surfaces of the pair of semiconductor patterns may face each other, and the ferroelectric pattern may define a first space between the pair of semiconductor patterns. The gate electrode may include a work function metal pattern that is in the first space.
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公开(公告)号:US20210035975A1
公开(公告)日:2021-02-04
申请号:US16849238
申请日:2020-04-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungmin KIM , Soonmoon JUNG
IPC: H01L27/092 , H01L29/06 , H01L29/16 , H01L29/161 , H01L29/417 , H01L29/423 , H01L29/49 , H01L29/786 , H01L21/02 , H01L21/18 , H01L21/28 , H01L21/8234 , H01L29/66
Abstract: A semiconductor device includes a first transistor, a division pattern, and a second transistor sequentially stacked on a substrate. The first transistor includes a first gate structure, a first source/drain layer at each of opposite sides of the first gate structure, and first semiconductor patterns spaced apart from each other in a vertical direction. Each of the first semiconductor patterns extends through the first gate structure and contacts the first source/drain layer. The division pattern includes an insulating material. The second transistor includes a second gate structure, a second source/drain layer at each of opposite sides of the second gate structure, and second semiconductor patterns spaced apart from each other in the vertical direction. Each of the second semiconductor patterns extends through the second gate structure and contacts the second source/drain layer. The first source/drain layer does not directly contact the second source/drain layer.
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公开(公告)号:US20160049335A1
公开(公告)日:2016-02-18
申请号:US14822077
申请日:2015-08-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bin LIU , Sungmin KIM
IPC: H01L21/8234
CPC classification number: H01L21/823431 , H01L21/823412 , H01L21/823814 , H01L21/823821
Abstract: Methods for manufacturing a semiconductor device including a field effect transistor include forming first fins protruding from a substrate including a first region and a second region, the first fins including silicon-germanium (SiGe), forming a first mask pattern to expose the first fins disposed in the second region, the first mask pattern covering the first fins disposed in the first region, oxidizing the first fins in the second region to form second fins in the second region, and forming germanium (Ge)-rich layers each disposed on a surface of a respective one of the second fins.
Abstract translation: 制造包括场效应晶体管的半导体器件的方法包括形成从包括第一区域和第二区域的衬底突出的第一鳍片,所述第一鳍片包括硅 - 锗(SiGe),形成第一掩模图案以暴露设置的第一鳍片 在第二区域中,覆盖设置在第一区域中的第一鳍片的第一掩模图案,在第二区域中氧化第一鳍片以在第二区域中形成第二鳍片,并且形成各自设置在表面上的锗(Ge) 的第二鳍片中的相应一个。
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公开(公告)号:US20250011650A1
公开(公告)日:2025-01-09
申请号:US18750176
申请日:2024-06-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Cheol HAM , Byungjoon KANG , Sangwan KIM , Sungmin KIM , Insun PARK , Gayoung SONG , Jungmin OH , Kyuyoung HWANG
IPC: C09K13/06 , H01L21/3213
Abstract: Provided are an etching composition, a method of etching a metal-containing film using the same, and a method of manufacturing a semiconductor device by using the same. The etching composition includes an oxidizing agent, an acid, and a selective etching inhibitor, wherein the oxidizing agent is metal-free, the selective etching inhibitor includes a copolymer including a first repeating unit and a second repeating unit, the first repeating unit is different from the second repeating unit, and the first repeating unit is a nitrogen-containing repeating unit.
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公开(公告)号:US20240380975A1
公开(公告)日:2024-11-14
申请号:US18779817
申请日:2024-07-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongyoul PARK , Sungmin KIM , Junseok SHIN , Kioh JUNG , Soonkyoung CHOI , Hyeonseok HONG
IPC: H04N23/68 , H04N23/45 , H04N23/57 , H04N23/65 , H04N23/667
Abstract: An electronic device according to an embodiment may include a first camera module including a first driving circuit, a sub processor, and a main processor functionally connected to the first camera module and the sub processor, wherein the main processor is configured to generate a first clock signal and transmit the same to the first camera module while a first camera included in the first camera module is in an activated state, transmit a first control signal to the sub processor in response to occurrence of a predetermined event in a sleep state, and the sub processor is configured to generate a second clock signal and transmit the same to the first camera module while the main processor is in a sleep state in response to receipt of the first control signal. In addition to this, various embodiments identified thorough the specification are possible.
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公开(公告)号:US20230261079A1
公开(公告)日:2023-08-17
申请号:US17987126
申请日:2022-11-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seunghyun SONG , Pilkwang KIM , Joohyung YOU , Sungmin KIM , Yonghee PARK , Young-Seok SONG , Takeshi OKAGAKI
IPC: H01L29/423 , H01L29/786 , H01L29/08 , H01L29/66
CPC classification number: H01L29/42392 , H01L29/78696 , H01L29/0847 , H01L29/6656
Abstract: Disclosed are semiconductor devices and fabrication methods thereof. The semiconductor device includes a substrate including first and second regions, a device isolation pattern in the substrate, a lower separation dielectric pattern on the first region of the substrate, first channel patterns on the lower separation dielectric pattern, a first gate electrode on the first channel patterns and including a first gate part between the lower separation dielectric pattern and a lowermost first channel pattern, and first source/drain patterns on opposite sides of the first gate electrode and in contact with lateral surfaces of the first channel patterns. A bottom surface of the lower separation dielectric pattern is at a level higher than or equal to that of a bottom surface of the device isolation pattern. A top end of the lower separation dielectric pattern is at a level higher than that of a bottom surface of the first gate part.
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公开(公告)号:US20220127289A1
公开(公告)日:2022-04-28
申请号:US17509361
申请日:2021-10-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ohyun KWON , Virendra Kumar RAI , Bumwoo PARK , Sungmin KIM , Myungsun SIM , Byoungki CHOI , Yasushi KOISHIKAWA
Abstract: Provided are an organometallic compound represented by Formula 1, an organic light-emitting device including the organometallic compound, and a diagnostic composition including the organometallic compound. M1(Ln1)n1(Ln2)n2 Formula 1 Ln1 is a ligand represented by Formula 1-1, Ln2 is a ligand represented by Formula 1-2, and the other substituents are as described in the detailed description.
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