Abstract:
A semiconductor device is provided. In some examples, the semiconductor device includes: a substrate, a fin structure disposed with the substrate, a source and a drain that are formed in the fin structure, a channel area disposed between the source and the drain, a gate dielectric layer disposed on the channel area, and a gate line disposed on the gate dielectric layer. The fin structure may include an anti-punch through layer, an upper fin structure disposed on the anti-punch through layer, the upper fin structure including a material having a lattice constant to receive a compressive strain. The fin structure may also include a lower fin structure disposed under the anti-punch through layer, and may comprise the same material as the substrate.
Abstract:
Methods for manufacturing a semiconductor device including a field effect transistor include forming first fins protruding from a substrate including a first region and a second region, the first fins including silicon-germanium (SiGe), forming a first mask pattern to expose the first fins disposed in the second region, the first mask pattern covering the first fins disposed in the first region, oxidizing the first fins in the second region to form second fins in the second region, and forming germanium (Ge)-rich layers each disposed on a surface of a respective one of the second fins.