SEMICONDUCTOR DEVICE HAVING A FIN STRUCTURE AND METHOD OF MANUFACTURE THE SAME
    3.
    发明申请
    SEMICONDUCTOR DEVICE HAVING A FIN STRUCTURE AND METHOD OF MANUFACTURE THE SAME 审中-公开
    具有精细结构的半导体器件及其制造方法

    公开(公告)号:US20160005738A1

    公开(公告)日:2016-01-07

    申请号:US14716822

    申请日:2015-05-19

    Abstract: A semiconductor device is provided. In some examples, the semiconductor device includes: a substrate, a fin structure disposed with the substrate, a source and a drain that are formed in the fin structure, a channel area disposed between the source and the drain, a gate dielectric layer disposed on the channel area, and a gate line disposed on the gate dielectric layer. The fin structure may include an anti-punch through layer, an upper fin structure disposed on the anti-punch through layer, the upper fin structure including a material having a lattice constant to receive a compressive strain. The fin structure may also include a lower fin structure disposed under the anti-punch through layer, and may comprise the same material as the substrate.

    Abstract translation: 提供半导体器件。 在一些示例中,半导体器件包括:衬底,布置在衬底上的鳍结构,形成在鳍结构中的源极和漏极,设置在源极和漏极之间的沟道区,栅介质层,设置在 沟道区域和设置在栅极介电层上的栅极线。 翅片结构可以包括抗穿通层,设置在抗穿通层上的上翅片结构,上翅片结构包括具有接收压缩应变的晶格常数的材料。 翅片结构还可以包括设置在抗穿通层下方的下翅片结构,并且可以包括与基底相同的材料。

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