公开(公告)号：US11145582B2

公开(公告)日：2021-10-12

申请号：US16707875

申请日：2019-12-09

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/768 ,  H01L23/31 ,  H01L21/60

Abstract: A semiconductor chip is mounted on a leadframe. A first portion of an insulating package for the semiconductor chip is formed from laser direct structuring (LDS) material molded onto the semiconductor chip. A conductive formation (provided by laser-drilling the LDS material and plating) extends between the outer surface of the first portion of insulating package and the semiconductor chip. An electrically conductive clip is applied onto the outer surface of the first portion of the insulating package, with the electrically conductive clip electrically coupled to the conductive formation and the leadframe. A second portion of the insulating package is made from package molding material (epoxy compound) molded onto the electrically conductive clip and applied onto the outer surface of the first portion of the insulating package.

公开(公告)号：US10971375B2

公开(公告)日：2021-04-06

申请号：US16273991

申请日：2019-02-12

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Federico Giovanni Ziglioli

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

Abstract: A method, comprises: providing a laminar support member, having a front surface, arranging on the front surface at least one semiconductor die having a front surface and a back surface, with the back surface thereof towards the front surface of the support member and with the front surface thereof having die pads, arranging at the front surface of the support member sidewise of the at least one semiconductor die a plurality of electrically-conductive bodies, the electrically-conductive bodies arranged at respective recesses in the support member, wherein the electrically-conductive bodies protrude from the plane away from the front surface of the support member, providing a filling of molding material over the laminar support member between the at least one semiconductor die and the electrically-conductive bodies, and providing electrically-conductive lines between selected ones of the die pads of the semiconductor die and selected ones of the plurality of electrically-conductive bodies.

公开(公告)号：US10529653B2

公开(公告)日：2020-01-07

申请号：US15677578

申请日：2017-08-15

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

Abstract: An electronic component includes one or more circuits having electrical connections coupled therewith. The electrical connections include a lead frame as well as electrical wires coupling the circuit or circuits to respective portions of the lead frame. The electrical wires may be formed as one piece with the respective portion of the lead frame without joints therebetween, e.g., by 3D printing.

公开(公告)号：US10468344B2

公开(公告)日：2019-11-05

申请号：US15973049

申请日：2018-05-07

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Federico Giovanni Ziglioli

IPC: H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10 ,  H01L25/00

Abstract: A method of manufacturing semiconductor products includes: providing a semiconductor product lead frame including a semiconductor die mounting area and an array of electrically conductive leads, molding semiconductor product package molding material, e.g., laser direct structuring material, and forming on the package molding material molded onto the lead frame electrically-conductive lines extending between the semiconductor die mounting area and the array of electrically-conductive leads.

公开(公告)号：US10424525B2

公开(公告)日：2019-09-24

申请号：US15987102

申请日：2018-05-23

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Federico Giovanni Ziglioli

IPC: H01L23/31 ,  H01L21/3105 ,  H01L21/768 ,  H01L21/56 ,  H01L21/683 ,  H01L21/288 ,  H01L23/367 ,  H01L23/16 ,  H01L23/538 ,  H01L23/00 ,  H01L21/78 ,  H01L21/48

Abstract: An assembly is provided including one or more semiconductor dice attached on a substrate, the semiconductor die provided with electrically-conductive stud bumps opposite the substrate. The stud bumps embedded in a molding compound molded thereon are exposed to grinding thus leveling the molding compound to expose the distal ends of the stud bumps at a surface of the molding compound. Recessed electrically-conductive lines extending over said surface of the molding compound with electrically-conductive lands over the distal ends of the stud bumps. A further molding compound is provided to cover the recessed electrically-conductive lines and surrounding the electrically-conductive lands.

公开(公告)号：US20190287944A1

公开(公告)日：2019-09-19

申请号：US15919871

申请日：2018-03-13

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli

IPC: H01L25/065 ,  H01L23/528 ,  H01L23/00 ,  H01L23/31 ,  H01L21/768 ,  H01L25/00 ,  H01L21/288

Abstract: A die structure includes a first die having a first surface and a second surface opposite the first surface. The first die includes sidewalls extending between the first and second surfaces. The die structure includes conductive ink printed traces including a first group of the conductive ink printed traces on the first surface of the first semiconductor die. A second group of the conductive ink printed traces are on the second surface of the semiconductor die, and a third group of the conductive ink printed traces are on the sidewalls of the semiconductor die.

公开(公告)号：US09922945B2

公开(公告)日：2018-03-20

申请号：US14815527

申请日：2015-07-31

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli ,  Alberto Pagani

IPC: H01L23/64 ,  H01L49/02 ,  H01L21/441 ,  H01L21/768 ,  H01L23/48 ,  H01L23/495 ,  H01L23/498 ,  H01L25/10 ,  H01L21/50 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/642 ,  H01L21/441 ,  H01L21/50 ,  H01L21/561 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/5385 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L28/40 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/07802 ,  H01L2924/00

Abstract: A packaged semiconductor device includes a communication pad formed in a side surface, which is operatively coupled to a communication circuit so as to enable the establishing of a wireless communication channel to an adjacently positioned packaged semiconductor device. The communication pad may be formed upon cutting a block including the packaged semiconductor device and an appropriately positioned and dimensioned conductor.

公开(公告)号：US09859256B1

公开(公告)日：2018-01-02

申请号：US15335331

申请日：2016-10-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Federico Giovanni Ziglioli

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/09 ,  H01L24/43 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/85345 ,  H01L2224/8584 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06568

Abstract: An integrated circuit package with improved reliability and methods for creating the same are disclosed. More specifically, integrated circuit packages are created using one or more sacrificial layers that provide support for ink printed wires prior to package processing, but are removed during package processing. Once each of the sacrificial layers is removed, molding compound is placed around each ink printed wire, which may have a substantially rectangular cross section that can vary in dimension along a length of a given wire. While substantially surrounding each wire in and of itself improves reliability, removing non-conductive paste, fillets, or other adhesive materials also minimizes adhesion issues between the molding compound and those materials, which increases the bond of the molding compound to the package and its components. The net result is a more reliable integrated circuit package that is less susceptible to internal cracking and wire damage.

公开(公告)号：US20170325329A1

公开(公告)日：2017-11-09

申请号：US15658165

申请日：2017-07-24

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Federico Giovanni Ziglioli

IPC: H05K1/02 ,  H05K7/02 ,  H01L23/552 ,  H01L23/00 ,  H01L23/13 ,  H01L23/31 ,  H01L21/56

CPC classification number: H05K1/0237 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/06 ,  H01L24/32 ,  H01L24/37 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/06135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37624 ,  H01L2224/37647 ,  H01L2224/45014 ,  H01L2224/45032 ,  H01L2224/45099 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06568 ,  H01L2924/00 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01034 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19107 ,  H05K7/02 ,  H01L2224/84 ,  H01L2924/206

Abstract: A packaged device has a die of semiconductor material bonded to a support. An electromagnetic shielding structure surrounds the die and is formed by a grid structure of conductive material extending into the support and an electromagnetic shield, coupled together. A packaging mass embeds both the die and the electromagnetic shield. The electromagnetic shield is formed by a plurality of metal ribbon sections overlying the die and embedded in the packaging mass. Each metal ribbon section has a thickness-to-width ratio between approximately 1:2 and approximately 1:50.

公开(公告)号：US09791303B2

公开(公告)日：2017-10-17

申请号：US14401332

申请日：2013-05-23

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto Pagani ,  Bruno Murari ,  Federico Giovanni Ziglioli ,  Marco Ronchi ,  Giulio Ricotti

IPC: G01D11/24 ,  G01M5/00 ,  B28B23/00 ,  G01K17/00 ,  G01L1/18 ,  G01N33/38

CPC classification number: G01D11/245 ,  B28B23/0031 ,  G01K17/00 ,  G01L1/18 ,  G01M5/00 ,  G01N33/383

Abstract: A package for a device to be inserted into a solid structure may include a building material that includes particles of one of micrometric and sub-micrometric dimensions. The device may include an integrated detection module having at least one integrated sensor and the package arranged to coat at least one portion of the device including the integrated detection module. A method aspect includes a method of manufacturing the device. A system aspect is for monitoring parameters in a solid structure that includes the device.