公开(公告)号：US20140333336A1

公开(公告)日：2014-11-13

申请号：US14339406

申请日：2014-07-23

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto PAGANI

IPC: G01R1/067

CPC classification number: G01R1/06761 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/06766 ,  G01R1/07 ,  G01R1/07314 ,  G01R31/312

Abstract: An embodiment of a test apparatus for executing a test of a set of electronic devices having a plurality of electrically conductive terminals, the test apparatus including a plurality of electrically conductive test probes for exchanging electrical signals with the terminals, and coupling means for mechanically coupling the test probes with the electronic devices. In an embodiment, the coupling means includes insulating means for keeping each one of at least part of the test probes electrically insulated from at least one corresponding terminal during the execution of the test. Each test probe and the corresponding terminal form a capacitor for electro-magnetically coupling the test probe with the terminal.

Abstract translation: 一种用于执行具有多个导电端子的电子装置的测试的测试装置的实施例，所述测试装置包括用于与端子交换电信号的多个导电测试探针，以及用于机械耦合 用电子设备测试探头。 在一个实施例中，耦合装置包括绝缘装置，用于在执行测试期间将至少部分测试探针中的每一个与至少一个相应的端子电绝缘。 每个测试探头和相应的端子形成用于将测试探头与端子电磁耦合的电容器。

公开(公告)号：US20140182390A1

公开(公告)日：2014-07-03

申请号：US14108951

申请日：2013-12-17

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto PAGANI ,  Federico Giovanni Ziglioli ,  Bruno Murari

IPC: G01L1/18 ,  H01L27/20

CPC classification number: G01L1/18 ,  H01L27/20

Abstract: The integrated electronic device is for detecting a local parameter related to a force observed in a given direction, within a solid structure. The device includes at least one sensor configured to detect the above-mentioned local parameter at least in the given direction through piezo-resistive effect. At least one damping element, integrated in the device, is arranged within a frame-shaped region that is disposed around the at least one sensor and belongs to a substantially planar region comprising a plane passing through the sensor and perpendicular to the given direction. Such at least one damping element is configured to damp forces acting in the planar region and substantially perpendicular to the given direction.

Abstract translation: 集成电子装置用于在固体结构内检测与在给定方向上观察到的力有关的局部参数。 该装置包括至少一个传感器，其配置成至少在给定方向上通过压阻效应来检测上述局部参数。 集成在装置中的至少一个阻尼元件布置在围绕至少一个传感器设置的框状区域中，并且属于基本上平面的区域，该区域包括通过传感器并垂直于给定方向的平面。 这样的至少一个阻尼元件构造成阻碍作用在平面区域中并基本垂直于给定方向的力。

公开(公告)号：US20140070834A1

公开(公告)日：2014-03-13

申请号：US14080112

申请日：2013-11-14

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto PAGANI

IPC: G01R1/04

CPC classification number: G01R31/2889 ,  B62M25/04 ,  G01R1/0491 ,  G01R1/06727 ,  G01R1/07342

Abstract: An embodiment of a probe card adapted for testing at least one integrated circuit integrated on a corresponding at least one die of a semiconductor material wafer, the probe card including a board adapted for the coupling to a tester apparatus, and a plurality of probes coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units, each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test, the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested.

Abstract translation: 适于测试集成在半导体材料晶片的对应的至少一个管芯上的至少一个集成电路的探针卡的实施例，所述探针卡包括适于耦合到测试仪器的板，以及耦合到 所述板，其中所述探针卡包括多个可更换的基本单元，每个所述基座单元包括用于接触被测集成电路的外部可接近端子的所述探针中的至少一个，所述多个可更换基本单元被布置为对应于 涉及包含待测试的集成电路的半导体材料晶片上的至少一个管芯的布置。

公开(公告)号：US20160245709A1

公开(公告)日：2016-08-25

申请号：US14626153

申请日：2015-02-19

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto PAGANI ,  Federico Giovanni ZIGLIOLI ,  Bruno MURARI

IPC: G01L1/20

CPC classification number: G01L5/0038 ,  F16B31/028 ,  G01L1/18 ,  G01L1/20

Abstract: A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry.

Abstract translation: 压力感测装置可以包括构造成分配施加在彼此定位的第一和第二部件之间的负载的主体和由主体承载的压力传感器。 压力传感器可以包括支撑体和安装有支撑体并且限定空腔的IC模具。 IC芯片可以包括响应于与空腔相关联的弯曲的压力感测电路，以及耦合到压力感测电路的IC接口。

公开(公告)号：US20160041046A1

公开(公告)日：2016-02-11

申请号：US14780819

申请日：2014-03-27

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto PAGANI

IPC: G01L1/14 ,  G01L1/26

CPC classification number: G01L1/142 ,  G01L1/144 ,  G01L1/148 ,  G01L1/26 ,  G01L25/00

Abstract: The integrated electronic device detects the pressure related to a force applied in a predetermined direction within a solid structure. The device includes an integrated element that is substantially orthogonal to the direction of application of the force. First and second conductive elements are configured to face an operating surface. A measure module includes first and second measurement terminals which are electrically connected to the first and second conductive elements, respectively. A detecting element is arranged in the predetermined direction such that the operating surface is sandwiched between the first and second conductive elements and this detecting element. An insulating layer galvanically insulates the first and second conductive elements. A layer of dielectric material is sandwiched between the detecting element and the insulating layer, and is elastically deformable following the application of the force to change an electromagnetic coupling between the detecting element and the first and second conductive elements.

Abstract translation: 集成电子设备检测与固体结构内的预定方向上施加的力相关的压力。 该装置包括基本上与力的施加方向正交的集成元件。 第一和第二导电元件构造成面对操作表面。 测量模块包括分别电连接到第一和第二导电元件的第一和第二测量端子。 检测元件沿预定方向布置，使得操作表面被夹在第一和第二导电元件和该检测元件之间。 绝缘层使第一和第二导电元件电绝缘。 介电材料层被夹在检测元件和绝缘层之间，并且随着施加力而弹性变形，以改变检测元件与第一和第二导电元件之间的电磁耦合。

公开(公告)号：US20140112617A1

公开(公告)日：2014-04-24

申请号：US14145807

申请日：2013-12-31

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto PAGANI ,  Alessando MOTTA ,  Sara LOI ,  Guido CHIARETTI

IPC: G02B6/12

CPC classification number: G02B6/12002 ,  G02B6/12004 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  H01L31/02327 ,  H01L31/103 ,  H01L31/125

Abstract: An integrated electronic device, delimited by a first surface and by a second surface and including: a body made of semiconductor material, formed inside which is at least one optoelectronic component chosen between a detector and an emitter; and an optical path which is at least in part of a guided type and extends between the first surface and the second surface, the optical path traversing the body. The optoelectronic component is optically coupled, through the optical path, to a first portion of free space and a second portion of free space, which are arranged, respectively, above and underneath the first and second surfaces.

公开(公告)号：US20240012029A1

公开(公告)日：2024-01-11

申请号：US18371823

申请日：2023-09-22

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto PAGANI

IPC: G01R3/00 ,  G01R31/319 ,  G01R1/067 ,  G01R1/073

CPC classification number: G01R3/00 ,  G01R31/31905 ,  G01R1/06761 ,  G01R1/07342 ,  Y10T29/49002 ,  G01R1/07307

Abstract: Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.

公开(公告)号：US20200321456A1

公开(公告)日：2020-10-08

申请号：US16376468

申请日：2019-04-05

Applicant: STMicroelectronics S.r.l.

Inventor： Alessandro Paolo BRAMANTI ,  Alberto PAGANI

IPC: H01L29/778 ,  H01L29/10 ,  H01L29/40 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66 ,  H01L21/02 ,  H01L29/205 ,  H01L29/20 ,  H01L27/06 ,  H03K17/687

Abstract: Embodiments are directed to two-dimensional electron gas (2DEG)-confined 2DEG devices and methods. One such device includes a substrate and a heterostructure on the substrate. The heterostructure includes a first semiconductor layer, a second semiconductor layer, and a 2DEG layer between the first and second semiconductor layers. The device further includes a 2DEG device having a conduction channel in the 2DEG layer. An isolation electrode overlies the heterostructure and at least partially surrounds a periphery of the 2DEG device. The isolation electrode, in use, interrupts the 2DEG layer in response to an applied voltage.

公开(公告)号：US20190107575A1

公开(公告)日：2019-04-11

申请号：US16211882

申请日：2018-12-06

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto PAGANI

IPC: G01R31/28 ,  H01L21/66 ,  H01L23/00 ,  H01L23/58

CPC classification number: G01R31/2884 ,  H01L22/32 ,  H01L22/34 ,  H01L23/585 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/05093 ,  H01L2224/05554 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A testing architecture for integrated circuits on a wafer includes at least one first circuit of a structure TEG realized in a scribe line providing separation between first and second integrated circuits. At least one pad is shared by a second circuit inside at least one of the first and second integrated circuits and the first circuit. Switching circuitry is coupled to the at least one pad and to the first and second circuits.

公开(公告)号：US20160223444A1

公开(公告)日：2016-08-04

申请号：US14610068

申请日：2015-01-30

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto PAGANI ,  Bruno MURARI ,  Federico Giovanni ZIGLIOLI

IPC: G01N3/08 ,  H01L21/52 ,  H01L21/56

CPC classification number: G01N3/08 ,  G01L1/005 ,  G01N3/066 ,  H01L23/3107

Abstract: A tensile stress measurement device is to be attached to an object to be measured. The tensile stress measurement device may include an IC having a semiconductor substrate and tensile stress detection circuitry, the semiconductor substrate having opposing first and second attachment areas. The tensile stress measurement device may include a first attachment plate coupled to the first attachment area and extending outwardly to be attached to the object to be measured, and a second attachment plate coupled to the second attachment area and extending outwardly to be attached to the object to be measured. The tensile stress detection circuitry may be configured to detect a tensile stress imparted on the first and second attachment plates when attached to the object to be measured.

Abstract translation: 将拉伸应力测量装置连接到被测量物体上。 拉伸应力测量装置可以包括具有半导体衬底和拉伸应力检测电路的IC，该半导体衬底具有相对的第一和第二附接区域。 拉伸应力测量装置可以包括联接到第一附接区域并向外延伸以连接到待测量物体的第一附接板，以及联接到第二附接区域并向外延伸以附接到物体的第二附接板 待测。 拉伸应力检测电路可以被配置为检测当附接到待测量物体时施加在第一和第二附接板上的拉伸应力。