公开(公告)号：US12040213B2

公开(公告)日：2024-07-16

申请号：US17191163

申请日：2021-03-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwail Jin ,  Seon Ho Lee ,  Yeongseok Kim

IPC: H01L21/78 ,  C09J7/24 ,  C09J7/38 ,  C09J7/40 ,  H01L21/683

CPC classification number: H01L21/6836 ,  C09J7/241 ,  C09J7/385 ,  C09J7/401 ,  C09J7/403 ,  H01L21/78 ,  C09J2423/006 ,  C09J2433/005 ,  C09J2483/005 ,  Y10T428/14 ,  Y10T428/1457 ,  Y10T428/1476

Abstract: A processing tape may include a base layer, an adhesive layer disposed on the base layer, a protection release film on the adhesive layer, and a first release layer interposed between the adhesive layer and the protection release film. The first release layer may include a silicone-based material and may be non-photo-curable.

公开(公告)号：US10910339B2

公开(公告)日：2021-02-02

申请号：US16533450

申请日：2019-08-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hwail Jin ,  Yongwon Choi ,  Myung-Sung Kang ,  Yeongseok Kim ,  Wonkeun Kim

IPC: H01L23/00 ,  H01L21/78

Abstract: A flip chip bonding method includes obtaining a die including a first substrate and an adhesive layer on the first substrate; bonding the die to a second substrate different from the first substrate; and curing the adhesive layer. The curing the adhesive layer includes heating the second substrate to melt the adhesive layer, and providing the adhesive layer and the second substrate with air having pressure greater than atmospheric pressure.

公开(公告)号：US10297554B2

公开(公告)日：2019-05-21

申请号：US15942994

申请日：2018-04-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongseok Kim

IPC: H01L23/29 ,  H01L23/544 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may be applied to a molding layer to protect a semiconductor chip under the molding layer and to efficiently perform a marking process. The thickness of the molding layer may thereby be reduced so the entire thickness of the semiconductor package may be reduced. Also, it is possible to prevent warpage of the semiconductor package through the marking film, provide the surface of the semiconductor package with gloss and freely adjust the color of the surface of the semiconductor package.

公开(公告)号：US09922935B2

公开(公告)日：2018-03-20

申请号：US15223577

申请日：2016-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongseok Kim

IPC: H01L23/52 ,  H01L23/544 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/544 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/014

Abstract: A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may be applied to a molding layer to protect a semiconductor chip under the molding layer and to efficiently perform a marking process. The thickness of the molding layer may thereby be reduced so the entire thickness of the semiconductor package may be reduced. Also, it is possible to prevent warpage of the semiconductor package through the marking film, provide the surface of the semiconductor package with gloss and freely adjust the color of the surface of the semiconductor package.

公开(公告)号：US12183653B2

公开(公告)日：2024-12-31

申请号：US17726916

申请日：2022-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil Lee ,  Myung-Sung Kang ,  Yeongseok Kim ,  Gwangsun Seo ,  Hyein Yoo ,  Yongwon Choi

IPC: H01L23/373 ,  C09J7/28 ,  C09J11/04 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538

Abstract: An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

公开(公告)号：US20220189902A1

公开(公告)日：2022-06-16

申请号：US17551387

申请日：2021-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joungphil Lee ,  Yeongseok Kim

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L23/498 ,  H01L21/66 ,  C08L63/00 ,  C08K3/013 ,  C08K5/00

Abstract: Provided is a semiconductor package including: at least one semiconductor device on a first substrate; a non-conductive film (NCF) on the at least one semiconductor device and comprising an irreversible thermochromic pigment; and a molding member on the at least one semiconductor device in a lateral direction, wherein a content of the irreversible thermochromic pigment in the NCF is about 0.1 wt % to about 5 wt % with respect to a weight of the NCF.

公开(公告)号：US10115613B2

公开(公告)日：2018-10-30

申请号：US15470606

申请日：2017-03-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Gi Chang ,  Yeongseok Kim ,  Hyein Yoo

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/673 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: The present disclosure relates to a method of fabricating a semiconductor package. The method may include forming a cavity in a package substrate and providing the package substrate and a die on a carrier tape film. Here, the carrier tape film may include a tape substrate and an insulating layer on the tape substrate, and the die may be provided in the cavity of the package substrate. The method may further include subsequently forming an encapsulation layer to cover the insulating layer and the die in the cavity and cover the package substrate on the insulating layer and removing the tape substrate from the insulating layer.

公开(公告)号：US09929131B2

公开(公告)日：2018-03-27

申请号：US15355476

申请日：2016-11-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyein Yoo ,  Yeongseok Kim

IPC: H01L25/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L25/50 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/552 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06537 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method of fabricating a semiconductor package includes mounting a plurality of semiconductor chips on a substrate in a stripped state, forming a mold layer to cover the semiconductor chips, cutting the mold layer and the substrate to form unit packages separated from each other, and forming a shielding layer on the mold layer of each of the unit packages, wherein each of the unit packages includes a corresponding one of the semiconductor chips, wherein the mold layer in each of the unit packages includes side surfaces, a top surface, and corner regions, and wherein each of the corner regions of the mold layer includes a first corner, which is connected to a corresponding one of the side surfaces and has a first curvature radius, and a second corner, which is connected to the top surface and has a second curvature radius smaller than the first curvature radius.

公开(公告)号：US20160336275A1

公开(公告)日：2016-11-17

申请号：US15223577

申请日：2016-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongseok Kim

IPC: H01L23/544 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/18

CPC classification number: H01L23/544 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/014

Abstract: A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may be applied to a molding layer to protect a semiconductor chip under the molding layer and to efficiently perform a marking process. The thickness of the molding layer may thereby be reduced so the entire thickness of the semiconductor package may be reduced. Also, it is possible to prevent warpage of the semiconductor package through the marking film, provide the surface of the semiconductor package with gloss and freely adjust the color of the surface of the semiconductor package.

Abstract translation: 提供一种包括标记膜的半导体封装及其制造方法，其中可以将包括热反应层的标记膜施加到成型层，以保护模制层下的半导体芯片并有效地执行标记处理。 因此可以减小成型层的厚度，从而减小半导体封装的整体厚度。 此外，可以防止半导体封装通过标记膜的翘曲，从而为半导体封装的表面提供光泽并自由地调节半导体封装的表面的颜色。