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公开(公告)号：US11798723B2
公开(公告)日：2023-10-24
申请号：US16830178
申请日：2020-03-25
发明人： Namiko Sasajima , Hiroki Imaeda , Masami Okado , Shinji Otani , Tomohiro Sunaga , Yoshimasa Yoshioka
IPC分类号： H01F27/29 , H01F27/06 , H01F41/04 , H01F27/255
CPC分类号： H01F27/06 , H01F27/255 , H01F27/29 , H01F41/04
摘要： A multilayer metal film disposed on a base having insulating properties includes a first metal film that is in contact with the base and that is electrically conductive, a second metal film covering the first metal film from a side of the first metal film opposite to the base, the second metal film having resistance to solder leaching, and a catalytic layer disposed between the first metal film and the second metal film, the catalytic layer having a protruding portion protruding toward the second metal film, the protruding portion extending into the second metal film.
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公开(公告)号：US11227715B2
公开(公告)日：2022-01-18
申请号：US15293700
申请日：2016-10-14
发明人： Akinori Hamada , Hayami Kudo , Ryo Okura , Shinji Otani
摘要： An electronic component includes a main body made of an insulator, a circuit element positioned inside the main body, and outer electrodes. The outer electrodes are constituted of bottom surface electrodes and post-like electrodes. The post-like electrodes are extended from a bottom surface of the main body toward the interior of the main body. Further, the post-like electrodes are embedded in the main body, and parts of the post-like electrodes are exposed to side surfaces of the main body. Furthermore, the bottom surface electrodes are made of a resin containing metal powder.
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公开(公告)号：US09627133B2
公开(公告)日：2017-04-18
申请号：US14739301
申请日：2015-06-15
发明人： Shinji Otani
摘要： A laminated ceramic electronic component that includes a laminated body formed by laminating a ceramic layer and an internal electrode, and forming an external electrode on an outer surface of the laminated body so as to be electrically connected to the internal electrode. The external electrode includes a conducting layer that is in contact with the internal electrode, and the internal electrode contains Ni. The conducting layer contains metal particles containing a Cu3Sn alloy, and a thermosetting resin. The internal electrode and the conducting layer are bonded to each other with a CuSnNi alloy phase interposed therebetween.
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公开(公告)号：US20150279568A1
公开(公告)日：2015-10-01
申请号：US14668220
申请日：2015-03-25
CPC分类号： H01G4/30 , H01G4/0085 , H01G4/1227 , H01G4/232 , H01G4/248
摘要： A first outer electrode and first inner electrodes are supplied with an anode potential and a second outer electrode and second inner electrodes are supplied with a cathode potential when a monolithic ceramic capacitor is mounted and in use. The first outer electrode supplied with the anode potential has a thickness that is greater than a thickness of the second outer electrode supplied with the cathode potential.
摘要翻译： 当安装和使用单块陶瓷电容器时，第一外电极和第一内电极被提供有阳极电位，第二外电极和第二内电极被提供阴极电位。 提供有阳极电位的第一外部电极的厚度大于被提供有阴极电位的第二外部电极的厚度。
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公开(公告)号：US20130220696A1
公开(公告)日：2013-08-29
申请号：US13864617
申请日：2013-04-17
发明人： Shinji Otani
CPC分类号： H05K1/0271 , H01G4/12 , H01G4/2325 , H01G4/30 , H05K1/0306 , Y10T29/435
摘要： The electronic component has a resin electrode which constitutes an external electrode on a face of a ceramic base body. At least a tip portion of a resin electrode region extended around another face of the body is bonded to the ceramic base body, and further a relationship between Rz1 and Rz2 satisfies the following requirement: Rz1>Rz2, Rz1>3.3 μm, and Rz2
摘要翻译： 电子部件具有在陶瓷基体的表面上构成外部电极的树脂电极。 至少在本体的另一面上延伸的树脂电极区域的顶端部分接合到陶瓷基体上，Rz1和Rz2之间的关系满足以下要求：Rz1> Rz2，Rz1>3.3μm，Rz2 < 3.2μm，其中Rz1是陶瓷基体的与顶部接合的表面的第一区域的十点平均表面粗糙度，Rz2是表面的第二区域的十点平均表面粗糙度 不形成外部电极的陶瓷基体。
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公开(公告)号：US11972909B2
公开(公告)日：2024-04-30
申请号：US17666961
申请日：2022-02-08
CPC分类号： H01G9/042 , H01G9/0029 , H01G9/15 , H05K1/182 , H05K2201/10015
摘要： A capacitor disposed inside a multilayer substrate that includes a conductive pattern on a surface thereof and an anode portion having a first conductive metal member and a porous portion disposed on a surface of the first conductive metal member, a cathode portion, and a dielectric layer disposed between the anode portion and the cathode portion. Moreover, the anode portion is led out to a surface side of the multilayer substrate by a connection electrode including an alloy layer containing a metal forming the first conductive metal member and a conductive layer disposed on the alloy layer, and in which the connection electrode is connected to the conductive pattern formed on the surface of the multilayer substrate.
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公开(公告)号：US11721469B2
公开(公告)日：2023-08-08
申请号：US16995176
申请日：2020-08-17
发明人： Shinji Otani , Hiroki Imaeda , Namiko Sasajima , Tomohiro Sunaga , Masami Okado , Yoshimasa Yoshioka
IPC分类号： H01F17/04 , H01F27/255 , H01F41/04 , H01F1/14 , H01F1/06 , H01F1/26 , H01F27/29 , H01F41/10 , H01F17/00
CPC分类号： H01F17/04 , H01F1/06 , H01F1/14 , H01F1/26 , H01F27/255 , H01F27/292 , H01F41/04 , H01F41/046 , H01F41/10 , H01F17/0006 , H01F2017/0066 , H01F2017/048 , Y10T428/32
摘要： An electronic component includes a composite body composed of a composite material of a resin and a magnetic metal powder and a metal film disposed on an outer surface of the composite body. The magnetic metal powder contains Fe. The metal film mainly contains Ni and is in contact with the resin and the magnetic metal powder.
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公开(公告)号：US10903017B2
公开(公告)日：2021-01-26
申请号：US15622342
申请日：2017-06-14
发明人： Hiroyuki Demizu , Kenichi Oshiumi , Tomohiro Suzuki , Shinya Yoshida , Tadahisa Sano , Koji Fujimoto , Tsuyoshi Yamamoto , Yoshinori Ueda , Shinji Otani
摘要： A solid electrolytic capacitor that includes a plurality of capacitor elements each including an anode portion, a dielectric layer, and a cathode portion having a solid electrolyte layer and a current collector layer; a leading conductor layer; an insulating resin body; a first external electrode; and a second external electrode. The plurality of capacitor elements are stacked in layers, with mutually adjacent capacitor elements having their respective current collector layers connected to each other. The current collector layer of only the capacitor element adjacent to the leading conductor layer is connected to the leading conductor layer. The first external electrode is connected to the leading conductor layer at the first end surface.
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公开(公告)号：US10340092B2
公开(公告)日：2019-07-02
申请号：US15622305
申请日：2017-06-14
发明人： Hiroyuki Demizu , Kenichi Oshiumi , Tomohiro Suzuki , Shinya Yoshida , Koji Fujimoto , Tadahisa Sano , Tsuyoshi Yamamoto , Yoshinori Ueda , Shinji Otani
摘要： A solid electrolytic capacitor that includes a capacitor element including an anode portion having a metal layer, a dielectric layer, and a cathode portion having a solid electrolyte layer and a current collector layer; a leading conductor layer; an insulating resin body covering the capacitor element and the leading conductor layer, the insulating resin body having a first end surface and a second end surface opposite to each other; a first external electrode; and a second external electrode. The first external electrode has at least one plating layer on the first end surface, and is connected to the leading conductor layer at the first end surface. The second external electrode has at least one plating layer on the second end surface, and is connected to the metal layer at the second end surface.
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公开(公告)号：US20180269000A1
公开(公告)日：2018-09-20
申请号：US15916727
申请日：2018-03-09
发明人： HIDEHIKO TANAKA , Toshikazu Makino , Shinji Otani
摘要： A method for producing a multilayer ceramic electronic component the includes producing a multilayer sheet having a plurality of multilayer ceramic green sheets and internal electrode patterns respectively arranged along a plurality of interfaces between the ceramic green sheets, and having a first main surface and a second main surface that face each other in a lamination direction thereof; placing, and pressure-bonding under heating, a resin composition onto at least one of the first main surface and the second main surface of the multilayer sheet to produce a mother block having an unfixed protection layer thereon; and cutting the mother block along a first-direction cutting-plane line and a second-direction cutting-plane line that are orthogonal to each other to produce a plurality of green chips. The resin composition includes a resin component having a melting point or a glass transition temperature of lower than 100° C. and inorganic compound particles.
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