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公开(公告)号：US20170365419A1
公开(公告)日：2017-12-21
申请号：US15622342
申请日：2017-06-14
发明人： Hiroyuki Demizu , Kenichi Oshiumi , Tomohiro Suzuki , Shinya Yoshida , Tadahisa Sano , Koji Fujimoto , Tsuyoshi Yamamoto , Yoshinori Ueda , Shinji Otani
摘要： A solid electrolytic capacitor that includes a plurality of capacitor elements each including an anode portion, a dielectric layer, and a cathode portion having a solid electrolyte layer and a current collector layer; a leading conductor layer; an insulating resin body; a first external electrode; and a second external electrode. The plurality of capacitor elements are stacked in layers, with mutually adjacent capacitor elements having their respective current collector layers connected to each other. The current collector layer of only the capacitor element adjacent to the leading conductor layer is connected to the leading conductor layer. The first external electrode is connected to the leading conductor layer at the first end surface.
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公开(公告)号：US10153082B2
公开(公告)日：2018-12-11
申请号：US15298577
申请日：2016-10-20
发明人： Shinji Otani , Masaki Tsutsumi , Yoshinori Ueda , Hayami Kudo
IPC分类号： H01F27/24 , H01F5/00 , H01F27/28 , H01F27/29 , H01C7/00 , H01C17/28 , H01F1/03 , H01F27/255 , H01F41/02 , H01G4/008 , H01G4/252 , H01G4/40 , H01L41/047 , H01G4/33 , H01C1/14 , H01C7/18 , H01G4/232 , H01G4/236 , H01F17/00 , H01F17/04 , H05K1/16
摘要： An electronic component includes a composite body made of a composite material of a resin material and a metal powder; and a metal film disposed on an outer surface of the composite body. The metal film is in contact with the resin material and the metal powder of the composite body, and an average particle diameter of crystals of the metal film contacting the resin material is 60% or more and 120% or less of an average particle diameter of crystals of the metal film contacting the metal powder.
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公开(公告)号：US20170365415A1
公开(公告)日：2017-12-21
申请号：US15622305
申请日：2017-06-14
发明人： HIROYUKI DEMIZU , Kenichi Oshiumi , Tomohiro Suzuki , Shinya Yoshida , Koji Fujimoto , Tadahisa Sano , Tsuyoshi Yamamoto , Yoshinori Ueda , Shinji Otani
摘要： A solid electrolytic capacitor that includes a capacitor element including an anode portion having a metal layer, a dielectric layer, and a cathode portion having a solid electrolyte layer and a current collector layer; a leading conductor layer; an insulating resin body covering the capacitor element and the leading conductor layer, the insulating resin body having a first end surface and a second end surface opposite to each other; a first external electrode; and a second external electrode. The first external electrode has at least one plating layer on the first end surface, and is connected to the leading conductor layer at the first end surface. The second external electrode has at least one plating layer on the second end surface, and is connected to the metal layer at the second end surface.
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公开(公告)号：US11821090B2
公开(公告)日：2023-11-21
申请号：US16167297
申请日：2018-10-22
发明人： Yoshinori Ueda
IPC分类号： C23C18/18 , C23C18/16 , H01F17/00 , H01F41/04 , H05K3/18 , H01F17/04 , C23C18/31 , H01F27/29 , H01G4/12 , H05K1/03 , C23C18/32 , H05K1/16 , H01G4/30
CPC分类号： C23C18/18 , C23C18/1608 , C23C18/1612 , C23C18/1879 , C23C18/31 , H01F17/0033 , H01F17/045 , H01F27/29 , H01F41/04 , H01F41/046 , H05K3/18 , H05K3/181 , C23C18/32 , H01F17/0013 , H01G4/12 , H01G4/30 , H05K1/0306 , H05K1/165
摘要： A manufacturing method that enables an electrode to be formed on a specific portion of a surface of a sintered ceramic body by a simple technique. A method of manufacturing a ceramic electronic component includes preparing a sintered ceramic body that contains a metal oxide, and forming low-resistance portions that is formed by reducing the resistance of portions of the ceramic body by radiating laser onto electrode-formation regions of surfaces of the ceramic body. The method further includes causing a catalytic metal to selectively adhere to the low-resistance portions by immersing the ceramic body, in which the low-resistance portions have been formed, in a catalytic metal substitution treatment solution, and forming a plating layer that serves as an electrode onto the low-resistance portions by performing electroless plating on the ceramic body to which the catalytic metal has adhered.
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公开(公告)号：US10903017B2
公开(公告)日：2021-01-26
申请号：US15622342
申请日：2017-06-14
发明人： Hiroyuki Demizu , Kenichi Oshiumi , Tomohiro Suzuki , Shinya Yoshida , Tadahisa Sano , Koji Fujimoto , Tsuyoshi Yamamoto , Yoshinori Ueda , Shinji Otani
摘要： A solid electrolytic capacitor that includes a plurality of capacitor elements each including an anode portion, a dielectric layer, and a cathode portion having a solid electrolyte layer and a current collector layer; a leading conductor layer; an insulating resin body; a first external electrode; and a second external electrode. The plurality of capacitor elements are stacked in layers, with mutually adjacent capacitor elements having their respective current collector layers connected to each other. The current collector layer of only the capacitor element adjacent to the leading conductor layer is connected to the leading conductor layer. The first external electrode is connected to the leading conductor layer at the first end surface.
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公开(公告)号：US10340092B2
公开(公告)日：2019-07-02
申请号：US15622305
申请日：2017-06-14
发明人： Hiroyuki Demizu , Kenichi Oshiumi , Tomohiro Suzuki , Shinya Yoshida , Koji Fujimoto , Tadahisa Sano , Tsuyoshi Yamamoto , Yoshinori Ueda , Shinji Otani
摘要： A solid electrolytic capacitor that includes a capacitor element including an anode portion having a metal layer, a dielectric layer, and a cathode portion having a solid electrolyte layer and a current collector layer; a leading conductor layer; an insulating resin body covering the capacitor element and the leading conductor layer, the insulating resin body having a first end surface and a second end surface opposite to each other; a first external electrode; and a second external electrode. The first external electrode has at least one plating layer on the first end surface, and is connected to the leading conductor layer at the first end surface. The second external electrode has at least one plating layer on the second end surface, and is connected to the metal layer at the second end surface.
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